DE69318675D1 - Klebefilm und seine herstellung - Google Patents
Klebefilm und seine herstellungInfo
- Publication number
- DE69318675D1 DE69318675D1 DE69318675T DE69318675T DE69318675D1 DE 69318675 D1 DE69318675 D1 DE 69318675D1 DE 69318675 T DE69318675 T DE 69318675T DE 69318675 T DE69318675 T DE 69318675T DE 69318675 D1 DE69318675 D1 DE 69318675D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- adhesive film
- adhesive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002313 adhesive film Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S526/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S526/935—Hot melt adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4144187A JP2887359B2 (ja) | 1992-06-04 | 1992-06-04 | フィルム接着剤 |
JP14418392A JPH05331445A (ja) | 1992-06-04 | 1992-06-04 | フィルム接着剤の製造方法 |
JP32501592A JPH06172713A (ja) | 1992-12-04 | 1992-12-04 | フィルム接着剤およびその製造方法 |
JP32501292A JPH06172736A (ja) | 1992-12-04 | 1992-12-04 | フィルム接着剤およびその製造方法 |
JP04325017A JP3093062B2 (ja) | 1992-12-04 | 1992-12-04 | フィルム接着剤およびその製造方法 |
PCT/JP1993/000351 WO1993024583A1 (en) | 1992-06-04 | 1993-03-24 | Film adhesive and production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69318675D1 true DE69318675D1 (de) | 1998-06-25 |
DE69318675T2 DE69318675T2 (de) | 1999-02-04 |
Family
ID=27527699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1993618675 Expired - Fee Related DE69318675T2 (de) | 1992-06-04 | 1993-03-24 | Klebefilm und seine herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5739263A (de) |
EP (1) | EP0598911B1 (de) |
KR (1) | KR100262417B1 (de) |
DE (1) | DE69318675T2 (de) |
SG (1) | SG44486A1 (de) |
WO (1) | WO1993024583A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69421696T2 (de) * | 1993-03-16 | 2000-05-25 | Occidental Chem Co | Dreischicht-polyimidsiloxan klebeband |
DE69603442T2 (de) * | 1995-01-11 | 2000-03-30 | Kanegafuchi Chemical Ind | Heisssiegelbares copolymer; pulver, folie, verbundwärmeisolierung, elektrisches modul und kondensator aus diesem copolymer hergestellt, und verfahren zur herstellung desselben |
DE69830488T2 (de) * | 1998-03-19 | 2006-03-16 | Sumitomo Bakelite Co. Ltd. | Ausrichtungsmittel für flüssigkristalle |
MY124687A (en) * | 1998-05-20 | 2006-06-30 | Hitachi Chemical Co Ltd | Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same |
US6156820A (en) * | 1998-12-28 | 2000-12-05 | Occidental Chemical Corporation | Polyamideimidesiloxane hot melt adhesive |
KR100335663B1 (ko) | 1999-10-19 | 2002-05-06 | 윤종용 | 테입리스 loc 패키징용 폴리(이미드-실록산) 화합물 |
US6605353B2 (en) | 1999-12-28 | 2003-08-12 | Kaneka Corporation | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide |
JP4362917B2 (ja) * | 2000-01-31 | 2009-11-11 | 宇部興産株式会社 | 金属箔積層体およびその製法 |
JP4665298B2 (ja) * | 2000-08-25 | 2011-04-06 | 東レ株式会社 | 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置 |
US20030066603A1 (en) * | 2001-08-20 | 2003-04-10 | Lord Corporation | Adhesive composition for bonding an elastomer to a substrate and a method for the bonding thereof |
DE60327695D1 (de) * | 2002-05-30 | 2009-07-02 | Mitsui Chemicals Inc | Klebharz und damit hergestellte filmklebstoffe |
US7892651B2 (en) * | 2004-09-14 | 2011-02-22 | Mitsubishi Gas Chemical Company, Inc. | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate |
US7989081B2 (en) * | 2006-01-25 | 2011-08-02 | Mitsubishi Gas Chemical Company, Inc. | Resin composite copper foil, printed wiring board, and production processes thereof |
JP5006310B2 (ja) * | 2006-03-03 | 2012-08-22 | 株式会社ピーアイ技術研究所 | スクリーン印刷用感光性インク組成物及びそれを用いたポジ型レリーフパターンの形成方法 |
JP4806815B2 (ja) * | 2008-03-31 | 2011-11-02 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
JP2009242605A (ja) * | 2008-03-31 | 2009-10-22 | Lintec Corp | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
WO2012144563A1 (ja) * | 2011-04-20 | 2012-10-26 | 株式会社カネカ | ポリアミドイミド溶液およびポリアミドイミド膜 |
SG11201700692RA (en) | 2014-08-08 | 2017-03-30 | Toray Industries | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827721A (ja) * | 1981-08-10 | 1983-02-18 | Hitachi Chem Co Ltd | ポリアミド酸シリコン型中間体及びポリイミドシリコン共重合体樹脂の製造法 |
JPS5844712B2 (ja) * | 1981-07-07 | 1983-10-05 | 日立化成工業株式会社 | 接着剤組成物 |
JPS5844712A (ja) * | 1981-09-10 | 1983-03-15 | Fujitsu Ltd | 半導体の熱処理装置 |
JPS60258229A (ja) * | 1984-06-05 | 1985-12-20 | Mitsui Toatsu Chem Inc | 芳香族ポリイミド樹脂に用いるプレポリマ−溶液の調整方法 |
JPH0765027B2 (ja) * | 1984-12-18 | 1995-07-12 | 三井東圧化学株式会社 | 耐熱性接着剤 |
JPS61241359A (ja) * | 1985-03-30 | 1986-10-27 | Nitto Electric Ind Co Ltd | ポリイミド前駆体溶液 |
US4658010A (en) * | 1985-04-25 | 1987-04-14 | Long John V | Polyimide adhesive and method of making from lactam, dianhydride mixture and diamine |
JPH0632351B2 (ja) * | 1986-05-30 | 1994-04-27 | 日東電工株式会社 | フレキシブルプリント基板 |
JPS63225629A (ja) * | 1986-12-15 | 1988-09-20 | Mitsubishi Electric Corp | ポリイミド系樹脂 |
JPS6442136A (en) * | 1987-08-07 | 1989-02-14 | Nitto Denko Corp | Manufacture of semiconductor device |
JPH01188577A (ja) * | 1988-01-21 | 1989-07-27 | Hitachi Chem Co Ltd | 気密封止用接着剤 |
US5192619A (en) * | 1988-06-30 | 1993-03-09 | Chisso Corporation | Flexible copper-applied substrates |
JP2848918B2 (ja) * | 1990-05-14 | 1999-01-20 | 住友ベークライト株式会社 | 両面フレキシブルプリント回路基板用樹脂。 |
JPH0446983A (ja) * | 1990-06-14 | 1992-02-17 | Sumitomo Bakelite Co Ltd | ポリイミド系接着剤 |
JP2834544B2 (ja) * | 1990-06-18 | 1998-12-09 | 住友ベークライト株式会社 | カバーレイ用接着剤 |
JPH0513902A (ja) * | 1990-09-04 | 1993-01-22 | Chisso Corp | フレキシブルプリント基板及びその製造法 |
JP2938227B2 (ja) * | 1991-04-17 | 1999-08-23 | 住友ベークライト株式会社 | ポリアミック酸樹脂 |
JP3059248B2 (ja) * | 1991-05-09 | 2000-07-04 | 住友ベークライト株式会社 | フレキシブル印刷回路板の製造方法 |
JP3065388B2 (ja) * | 1991-05-09 | 2000-07-17 | 住友ベークライト株式会社 | フレキシブル印刷回路板の製造方法 |
US5300627A (en) * | 1991-10-17 | 1994-04-05 | Chisso Corporation | Adhesive polyimide film |
JP3221756B2 (ja) * | 1992-12-28 | 2001-10-22 | 新日鐵化学株式会社 | プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法 |
US5604041A (en) * | 1995-11-14 | 1997-02-18 | Choi; Jin-O | Method of making free-standing polyimide film |
-
1993
- 1993-03-24 WO PCT/JP1993/000351 patent/WO1993024583A1/ja active IP Right Grant
- 1993-03-24 US US08/182,194 patent/US5739263A/en not_active Expired - Lifetime
- 1993-03-24 DE DE1993618675 patent/DE69318675T2/de not_active Expired - Fee Related
- 1993-03-24 KR KR1019940700340A patent/KR100262417B1/ko not_active IP Right Cessation
- 1993-03-24 EP EP93906815A patent/EP0598911B1/de not_active Expired - Lifetime
- 1993-03-24 SG SG1996000842A patent/SG44486A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1993024583A1 (en) | 1993-12-09 |
KR100262417B1 (ko) | 2000-08-01 |
DE69318675T2 (de) | 1999-02-04 |
SG44486A1 (en) | 1997-12-19 |
EP0598911B1 (de) | 1998-05-20 |
US5739263A (en) | 1998-04-14 |
EP0598911A4 (de) | 1994-11-30 |
EP0598911A1 (de) | 1994-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |