DE69222354T2 - Methode und Apparat zur Steuerung des Emissionsspektrums einer Elektrolumineszensdiode - Google Patents
Methode und Apparat zur Steuerung des Emissionsspektrums einer ElektrolumineszensdiodeInfo
- Publication number
- DE69222354T2 DE69222354T2 DE69222354T DE69222354T DE69222354T2 DE 69222354 T2 DE69222354 T2 DE 69222354T2 DE 69222354 T DE69222354 T DE 69222354T DE 69222354 T DE69222354 T DE 69222354T DE 69222354 T2 DE69222354 T2 DE 69222354T2
- Authority
- DE
- Germany
- Prior art keywords
- controlling
- emission spectrum
- electroluminescent diode
- electroluminescent
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
- H05B45/22—Controlling the colour of the light using optical feedback
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06808—Stabilisation of laser output parameters by monitoring the electrical laser parameters, e.g. voltage or current
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3121317A JP2975160B2 (ja) | 1991-05-27 | 1991-05-27 | 発光スペクトル制御システム |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69222354D1 DE69222354D1 (de) | 1997-10-30 |
DE69222354T2 true DE69222354T2 (de) | 1998-03-05 |
Family
ID=14808256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69222354T Expired - Fee Related DE69222354T2 (de) | 1991-05-27 | 1992-05-27 | Methode und Apparat zur Steuerung des Emissionsspektrums einer Elektrolumineszensdiode |
Country Status (4)
Country | Link |
---|---|
US (1) | US5334916A (de) |
EP (1) | EP0516398B1 (de) |
JP (1) | JP2975160B2 (de) |
DE (1) | DE69222354T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006056148A1 (de) * | 2006-11-28 | 2008-06-05 | Siemens Ag | Verfahren und Treiberschaltung zur Regelung des Flussstroms durch eine Lichtemissionseinrichtung |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4434266B4 (de) * | 1994-09-24 | 2005-05-25 | Byk Gardner Gmbh | Verfahren zur Berücksichtigung der Temperaturabhängigkeit von optoelektronischen Dioden |
DE10031303A1 (de) * | 2000-06-27 | 2002-01-10 | Arnold & Richter Kg | Beleuchtungsvorrichtung mit lichtemittierenden Dioden (LED), Beleuchtungsverfahren und Verfahren zur Bildaufzeichnung mit derartiger LED-Beleuchtungsvorrichtung |
JP4288553B2 (ja) | 2000-07-25 | 2009-07-01 | 富士フイルム株式会社 | カメラのストロボ装置 |
GB0204212D0 (en) | 2002-02-22 | 2002-04-10 | Oxley Dev Co Ltd | Led drive circuit |
US20060293727A1 (en) * | 2002-05-09 | 2006-12-28 | Greg Spooner | System and method for treating exposed tissue with light emitting diodes |
US6998594B2 (en) * | 2002-06-25 | 2006-02-14 | Koninklijke Philips Electronics N.V. | Method for maintaining light characteristics from a multi-chip LED package |
KR100966514B1 (ko) * | 2002-06-25 | 2010-06-29 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 멀티칩 led 패키지로부터의 광 특성을 유지하기 위한 시스템 및 구조체 |
US20060108935A1 (en) * | 2002-09-16 | 2006-05-25 | First Flower & Fruit Company A/S | Led system for producing light |
GB0308343D0 (en) | 2003-04-10 | 2003-05-14 | Univ London | Athermalisation of tuneable lasers |
US7500950B2 (en) | 2003-07-25 | 2009-03-10 | Masimo Corporation | Multipurpose sensor port |
JP2005072218A (ja) * | 2003-08-25 | 2005-03-17 | Tdk Corp | 発光素子の温度管理方法および管理装置、および照明装置 |
JP2007504674A (ja) * | 2003-09-04 | 2007-03-01 | コニンクリユケ フィリップス エレクトロニクス エヌ.ブイ. | Ledの温度依存性電力供給システム及び方法 |
JP2006080383A (ja) * | 2004-09-10 | 2006-03-23 | Matsushita Electric Ind Co Ltd | 発光装置及びその温度検出方法 |
WO2006094168A1 (en) | 2005-03-01 | 2006-09-08 | Masimo Laboratories, Inc. | Noninvasive multi-parameter patient monitor |
ATE549745T1 (de) * | 2005-04-21 | 2012-03-15 | Fiat Ricerche | Durchsichtige head-up-led-anzeigevorrichtung |
JP4984621B2 (ja) * | 2006-04-18 | 2012-07-25 | 日亜化学工業株式会社 | 半導体発光装置 |
US10188348B2 (en) | 2006-06-05 | 2019-01-29 | Masimo Corporation | Parameter upgrade system |
US7880626B2 (en) | 2006-10-12 | 2011-02-01 | Masimo Corporation | System and method for monitoring the life of a physiological sensor |
US8063578B2 (en) * | 2007-03-05 | 2011-11-22 | Tecey Software Development Kg, Llc | Method and firmware for generating a digital dimming waveform for an inverter |
US8374665B2 (en) | 2007-04-21 | 2013-02-12 | Cercacor Laboratories, Inc. | Tissue profile wellness monitor |
DE102007038943A1 (de) * | 2007-08-17 | 2009-02-19 | Siemens Ag | Laserlichtquelle mit wenigstens zwei Einzel-Lasern |
DE102007039317A1 (de) * | 2007-08-20 | 2009-02-26 | Ses-Entwicklung Gmbh | Verfahren und Vorrichtung zur exakten und geregelten Schwerpunktswellenlängenjustage der emittierten Strahlung einer Leuchtdiode |
DE102007040079A1 (de) * | 2007-08-24 | 2009-02-26 | Ledon Lighting Gmbh | Verfahren zur Bestimmung des Lichtstroms einer Lichtquelle |
JP5756752B2 (ja) | 2008-07-03 | 2015-07-29 | セルカコール・ラボラトリーズ・インコーポレイテッドCercacor Laboratories, Inc. | センサ |
US8630691B2 (en) | 2008-08-04 | 2014-01-14 | Cercacor Laboratories, Inc. | Multi-stream sensor front ends for noninvasive measurement of blood constituents |
JP5111286B2 (ja) * | 2008-08-08 | 2013-01-09 | シャープ株式会社 | Ledランプ駆動方法及びledランプ装置 |
US8358085B2 (en) * | 2009-01-13 | 2013-01-22 | Terralux, Inc. | Method and device for remote sensing and control of LED lights |
US9326346B2 (en) | 2009-01-13 | 2016-04-26 | Terralux, Inc. | Method and device for remote sensing and control of LED lights |
US8571619B2 (en) | 2009-05-20 | 2013-10-29 | Masimo Corporation | Hemoglobin display and patient treatment |
DE102009033979A1 (de) | 2009-07-16 | 2011-01-20 | Schmidt & Haensch Gmbh & Co. | Vorrichtung zur Schwerpunktwellenlängenjustage emittierter optischer Strahlung |
US10264637B2 (en) | 2009-09-24 | 2019-04-16 | Cree, Inc. | Solid state lighting apparatus with compensation bypass circuits and methods of operation thereof |
US9713211B2 (en) | 2009-09-24 | 2017-07-18 | Cree, Inc. | Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof |
US8901845B2 (en) | 2009-09-24 | 2014-12-02 | Cree, Inc. | Temperature responsive control for lighting apparatus including light emitting devices providing different chromaticities and related methods |
EP3032921A1 (de) | 2009-11-17 | 2016-06-15 | Terralux, Inc. | Erkennung und steuerung einer led-stromzufuhr |
US9839381B1 (en) | 2009-11-24 | 2017-12-12 | Cercacor Laboratories, Inc. | Physiological measurement system with automatic wavelength adjustment |
DE112010004682T5 (de) | 2009-12-04 | 2013-03-28 | Masimo Corporation | Kalibrierung für mehrstufige physiologische Monitore |
US8476836B2 (en) | 2010-05-07 | 2013-07-02 | Cree, Inc. | AC driven solid state lighting apparatus with LED string including switched segments |
US8340941B2 (en) * | 2010-06-04 | 2012-12-25 | Tyco Electronics Corporation | Temperature measurement system for a light emitting diode (LED) assembly |
US10098197B2 (en) | 2011-06-03 | 2018-10-09 | Cree, Inc. | Lighting devices with individually compensating multi-color clusters |
US10178723B2 (en) | 2011-06-03 | 2019-01-08 | Cree, Inc. | Systems and methods for controlling solid state lighting devices and lighting apparatus incorporating such systems and/or methods |
US8950892B2 (en) | 2011-03-17 | 2015-02-10 | Cree, Inc. | Methods for combining light emitting devices in a white light emitting apparatus that mimics incandescent dimming characteristics and solid state lighting apparatus for general illumination that mimic incandescent dimming characteristics |
US9839083B2 (en) | 2011-06-03 | 2017-12-05 | Cree, Inc. | Solid state lighting apparatus and circuits including LED segments configured for targeted spectral power distribution and methods of operating the same |
US8742671B2 (en) | 2011-07-28 | 2014-06-03 | Cree, Inc. | Solid state lighting apparatus and methods using integrated driver circuitry |
CN103891412B (zh) * | 2011-09-23 | 2015-10-14 | 马田专业公司 | 基于电流-电压模型来控制照明装置的方法 |
US10043960B2 (en) | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
US8896231B2 (en) | 2011-12-16 | 2014-11-25 | Terralux, Inc. | Systems and methods of applying bleed circuits in LED lamps |
US10264638B2 (en) | 2013-01-15 | 2019-04-16 | Cree, Inc. | Circuits and methods for controlling solid state lighting |
US10231300B2 (en) | 2013-01-15 | 2019-03-12 | Cree, Inc. | Systems and methods for controlling solid state lighting during dimming and lighting apparatus incorporating such systems and/or methods |
US9265119B2 (en) | 2013-06-17 | 2016-02-16 | Terralux, Inc. | Systems and methods for providing thermal fold-back to LED lights |
DE102013020698A1 (de) * | 2013-11-29 | 2015-06-03 | Cooper Crouse-Hinds Gmbh | Leuchte und Verfahren zur Temperaturbestimmung |
DE102013018120B4 (de) * | 2013-11-29 | 2022-02-10 | Cooper Crouse-Hinds Gmbh | Verfahren zur Temperaturüberwachung einer Leuchte |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8200517A (nl) * | 1982-02-11 | 1983-09-01 | Tno | Instelschakeling voor licht-emitterende diode met temperatuurcompensatie. |
US4710631A (en) * | 1984-08-28 | 1987-12-01 | Fuji Photo Film Co., Ltd. | Temperature compensation for a semiconductor light source used for exposure of light sensitive material |
EP0238484A1 (de) * | 1985-09-24 | 1987-09-30 | Bell Communications Research, Inc. | Temperaturstabilisierung von injektionslaser |
IL86349A (en) * | 1987-05-26 | 1993-04-04 | Hughes Aircraft Co | Temperature stabilization of laser diodes and light emitting diodes |
GB2224374A (en) * | 1988-08-24 | 1990-05-02 | Plessey Co Plc | Temperature control of light-emitting devices |
US5018154A (en) * | 1989-09-12 | 1991-05-21 | Brother Kogyo Kabushiki Kaisha | Semiconductor laser drive device |
-
1991
- 1991-05-27 JP JP3121317A patent/JP2975160B2/ja not_active Expired - Fee Related
-
1992
- 1992-05-27 US US07/888,758 patent/US5334916A/en not_active Expired - Fee Related
- 1992-05-27 EP EP92304804A patent/EP0516398B1/de not_active Expired - Lifetime
- 1992-05-27 DE DE69222354T patent/DE69222354T2/de not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006056148A1 (de) * | 2006-11-28 | 2008-06-05 | Siemens Ag | Verfahren und Treiberschaltung zur Regelung des Flussstroms durch eine Lichtemissionseinrichtung |
DE102006056148B4 (de) * | 2006-11-28 | 2016-10-27 | Siemens Aktiengesellschaft | Verfahren zur Funktionsüberwachung einer Lichtsignalanlage und Verkehrssteuerungs-Lichtsignalanlage |
Also Published As
Publication number | Publication date |
---|---|
JP2975160B2 (ja) | 1999-11-10 |
EP0516398A3 (en) | 1994-11-09 |
US5334916A (en) | 1994-08-02 |
EP0516398B1 (de) | 1997-09-24 |
EP0516398A2 (de) | 1992-12-02 |
DE69222354D1 (de) | 1997-10-30 |
JPH06237013A (ja) | 1994-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |