DE69205142T2 - Schrubbvorrichtung zum Reinigen dünner Scheiben. - Google Patents

Schrubbvorrichtung zum Reinigen dünner Scheiben.

Info

Publication number
DE69205142T2
DE69205142T2 DE69205142T DE69205142T DE69205142T2 DE 69205142 T2 DE69205142 T2 DE 69205142T2 DE 69205142 T DE69205142 T DE 69205142T DE 69205142 T DE69205142 T DE 69205142T DE 69205142 T2 DE69205142 T2 DE 69205142T2
Authority
DE
Germany
Prior art keywords
scrubbing device
cleaning thin
thin panes
panes
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69205142T
Other languages
English (en)
Other versions
DE69205142D1 (de
Inventor
Fumihiko Hasegawa
Makoto Tsukada
Hideo Kudo
Masayuki Yamada
Isao Uchiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69205142D1 publication Critical patent/DE69205142D1/de
Application granted granted Critical
Publication of DE69205142T2 publication Critical patent/DE69205142T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69205142T 1991-12-27 1992-12-29 Schrubbvorrichtung zum Reinigen dünner Scheiben. Expired - Fee Related DE69205142T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3358060A JP2571487B2 (ja) 1991-12-27 1991-12-27 薄円板状ワークのスクラバー洗浄装置

Publications (2)

Publication Number Publication Date
DE69205142D1 DE69205142D1 (de) 1995-11-02
DE69205142T2 true DE69205142T2 (de) 1996-05-09

Family

ID=18457329

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69205142T Expired - Fee Related DE69205142T2 (de) 1991-12-27 1992-12-29 Schrubbvorrichtung zum Reinigen dünner Scheiben.

Country Status (4)

Country Link
US (1) US5282289A (de)
EP (1) EP0549377B1 (de)
JP (1) JP2571487B2 (de)
DE (1) DE69205142T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052105B2 (ja) * 1992-11-20 2000-06-12 東京エレクトロン株式会社 洗浄処理装置
EP0640969B1 (de) * 1993-08-31 1999-10-27 Kabushiki Kaisha Shoyo Seiki Reinigungsgerät
US5518542A (en) * 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
US5733175A (en) 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
JP3328426B2 (ja) * 1994-05-12 2002-09-24 東京エレクトロン株式会社 洗浄装置
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
DE19544677C2 (de) * 1995-11-30 2000-04-27 Leybold Ag Verfahren zum Reinigen von scheibenförmigen Substraten
TW363903B (en) * 1996-03-11 1999-07-11 Memc Electronic Materials Spa Apparatus for use in automatically cleaning semiconductor wafers and methods for drying a semiconductor wafer in the automatic drying machine
US5675856A (en) * 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
GB2319888A (en) * 1996-11-30 1998-06-03 Ibm Brushes for cleaning substrates
JP3320640B2 (ja) * 1997-07-23 2002-09-03 東京エレクトロン株式会社 洗浄装置
JPH1154471A (ja) 1997-08-05 1999-02-26 Tokyo Electron Ltd 処理装置及び処理方法
DE69835988T2 (de) * 1997-08-18 2007-06-21 Tokyo Electron Ltd. Doppelseitenreinigungsmaschine für ein Substrat
JP3990073B2 (ja) * 1999-06-17 2007-10-10 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
US9646859B2 (en) * 2010-04-30 2017-05-09 Applied Materials, Inc. Disk-brush cleaner module with fluid jet
WO2013112196A1 (en) * 2012-01-24 2013-08-01 Applied Materials, Inc. Cleaning module and process for particle reduction
US9711381B2 (en) * 2013-01-31 2017-07-18 Applied Materials, Inc. Methods and apparatus for post-chemical mechanical planarization substrate cleaning
CN105164793B (zh) * 2013-03-15 2018-01-02 应用材料公司 对于利用用于化学机械抛光的晶片及晶片边缘/斜角清洁模块的盘/垫清洁的设计
TWI662610B (zh) 2013-10-25 2019-06-11 美商應用材料股份有限公司 用於化學機械平坦化後之基板拋光預清洗的系統、方法及裝置
US10342326B2 (en) 2016-06-06 2019-07-09 Saudi Arabian Oil Company Underwater marine growth brushing mechanism with passive self-adjust for curved surfaces
CN109316118B (zh) * 2016-11-24 2020-09-04 乐清市风杰电子科技有限公司 转动行走比较方便的用于理发店自动清理碎头发的装置
JP7149869B2 (ja) * 2019-02-07 2022-10-07 株式会社荏原製作所 基板洗浄方法および基板洗浄装置
CN114011772B (zh) * 2022-01-04 2022-04-15 中南大学 一种用于粒子铜整形的设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695508B2 (ja) * 1986-11-28 1994-11-24 大日本スクリ−ン製造株式会社 基板の両面洗浄装置
US5046656A (en) * 1988-09-12 1991-09-10 Regents Of The University Of California Vacuum die attach for integrated circuits
KR0134962B1 (ko) * 1989-07-13 1998-04-22 나까다 구스오 디스크 세척장치
US5144711A (en) * 1991-03-25 1992-09-08 Westech Systems, Inc. Cleaning brush for semiconductor wafer

Also Published As

Publication number Publication date
JP2571487B2 (ja) 1997-01-16
EP0549377A2 (de) 1993-06-30
EP0549377B1 (de) 1995-09-27
DE69205142D1 (de) 1995-11-02
US5282289A (en) 1994-02-01
EP0549377A3 (de) 1993-08-04
JPH05182940A (ja) 1993-07-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SHIN-ETSU HANDOTAI CO., LTD., TOKIO/TOKYO, JP FUJI

8339 Ceased/non-payment of the annual fee