DE69116265D1 - Schutzvorrichtung für Telekommunikationsanlage - Google Patents
Schutzvorrichtung für TelekommunikationsanlageInfo
- Publication number
- DE69116265D1 DE69116265D1 DE69116265T DE69116265T DE69116265D1 DE 69116265 D1 DE69116265 D1 DE 69116265D1 DE 69116265 T DE69116265 T DE 69116265T DE 69116265 T DE69116265 T DE 69116265T DE 69116265 D1 DE69116265 D1 DE 69116265D1
- Authority
- DE
- Germany
- Prior art keywords
- protection device
- telecommunication system
- telecommunication
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M3/00—Automatic or semi-automatic exchanges
- H04M3/18—Automatic or semi-automatic exchanges with means for reducing interference or noise; with means for reducing effects due to line faults with means for protecting lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/02—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess current
- H02H9/026—Current limitation using PTC resistors, i.e. resistors with a large positive temperature coefficient
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/041—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage using a short-circuiting device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/042—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage comprising means to limit the absorbed power or indicate damaged over-voltage protection device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Emergency Protection Circuit Devices (AREA)
- Protection Of Static Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/570,579 US5150271A (en) | 1990-08-21 | 1990-08-21 | Telecommunication equipment protector |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69116265D1 true DE69116265D1 (de) | 1996-02-22 |
DE69116265T2 DE69116265T2 (de) | 1996-05-23 |
Family
ID=24280207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69116265T Expired - Fee Related DE69116265T2 (de) | 1990-08-21 | 1991-08-20 | Schutzvorrichtung für Telekommunikationsanlage |
Country Status (4)
Country | Link |
---|---|
US (1) | US5150271A (de) |
EP (1) | EP0472405B1 (de) |
JP (1) | JPH06113445A (de) |
DE (1) | DE69116265T2 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5359657A (en) * | 1992-06-08 | 1994-10-25 | Oneac Corporation | Telephone line overvoltage protection apparatus |
JP2921722B2 (ja) * | 1992-06-10 | 1999-07-19 | 三菱マテリアル株式会社 | チップ型サージアブソーバ |
US5371647A (en) * | 1992-07-21 | 1994-12-06 | General Instrument Corporation | Surge protection circuit module and method for assembling same |
FR2699015B1 (fr) * | 1992-12-04 | 1995-02-24 | Sgs Thomson Microelectronics | Dispositif de protection contre des surtensions. |
US5327318A (en) * | 1992-12-07 | 1994-07-05 | Texas Instruments Incorporated | Telecommunication equipment protector |
US5479031A (en) * | 1993-09-10 | 1995-12-26 | Teccor Electronics, Inc. | Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value |
WO1995013621A1 (en) * | 1993-11-12 | 1995-05-18 | Alcoa Fujikura Ltd. | Short circuit protected splice connector |
FR2713400B1 (fr) * | 1993-11-29 | 1996-02-16 | Sgs Thomson Microelectronics | Composant de protection triangle. |
JPH07230733A (ja) * | 1994-02-16 | 1995-08-29 | Shinko Electric Ind Co Ltd | 半導体アレスタ |
US5512784A (en) * | 1994-04-19 | 1996-04-30 | Jerrold Communications, General Instrument Corporation | Surge protector semiconductor subassembly for 3-lead transistor aotline package |
ES2091715B1 (es) * | 1994-07-19 | 1998-05-01 | Cymem S A | Modulo de proteccion completa para regletas telefonicas y similares. |
US5714900A (en) * | 1996-04-12 | 1998-02-03 | Hewlett-Packard Company | Electrical overstress protection device |
US5955960A (en) * | 1997-03-24 | 1999-09-21 | Jean-Luc Monnier | Tamper resistant electronic lock and method of using same |
US5781392A (en) * | 1997-05-12 | 1998-07-14 | Tii Industries, Inc. | Balanced overvoltage protector for a dual-wire system |
US5982598A (en) * | 1997-09-19 | 1999-11-09 | Lucent Technologies Inc. | Protective circuit for a grounded power plant |
US6008976A (en) * | 1997-11-26 | 1999-12-28 | Alcatel Usa Sourcing, L.P. | Connector for a protector block in a telecommunications system |
WO1999039421A1 (en) * | 1998-01-31 | 1999-08-05 | Oglesbee John W | Supplemental battery overcharge protection device |
US6104591A (en) * | 1998-03-09 | 2000-08-15 | Teccor Electronics, Inc. | Telephone line protection element |
US6331763B1 (en) | 1998-04-15 | 2001-12-18 | Tyco Electronics Corporation | Devices and methods for protection of rechargeable elements |
US6100745A (en) * | 1998-08-10 | 2000-08-08 | Johnson Controls Technology Company | Combination positive temperature coefficient resistor and metal-oxide semiconductor field-effect transistor devices |
US6531717B1 (en) | 1999-03-01 | 2003-03-11 | Teccor Electronics, L.P. | Very low voltage actuated thyristor with centrally-located offset buried region |
US6956248B2 (en) | 1999-03-01 | 2005-10-18 | Teccor Electronics, Lp | Semiconductor device for low voltage protection with low capacitance |
US6407901B1 (en) * | 1999-04-19 | 2002-06-18 | Teccor Electronics, Lp | Semiconductor device providing overvoltage and overcurrent protection for a line |
EP1298802A1 (de) * | 2001-09-28 | 2003-04-02 | ABB Schweiz AG | Verfahren zum Ansteuern eines Leistungshalbleiters |
FR2834128B1 (fr) * | 2001-12-21 | 2005-03-04 | St Microelectronics Sa | Dispositif de protection bidirectionnel a faible capacite |
DE10243113A1 (de) * | 2002-09-17 | 2004-04-01 | Epcos Ag | Elektrische Baugruppe und deren Verwendung |
US6862162B2 (en) | 2003-04-23 | 2005-03-01 | Teccor Electronics, Lp | Thyristor circuit providing overcurrent protection to a low impedance load |
US6919625B2 (en) * | 2003-07-10 | 2005-07-19 | General Semiconductor, Inc. | Surface mount multichip devices |
US7037814B1 (en) * | 2003-10-10 | 2006-05-02 | National Semiconductor Corporation | Single mask control of doping levels |
US7244970B2 (en) | 2004-12-22 | 2007-07-17 | Tyco Electronics Corporation | Low capacitance two-terminal barrier controlled TVS diodes |
FR2997803B1 (fr) * | 2012-11-06 | 2016-09-02 | Sagem Defense Securite | Composant de protection contre la foudre |
TWI500229B (zh) * | 2013-07-22 | 2015-09-11 | Polytronics Technology Corp | 過電流保護裝置 |
CN105575941B (zh) * | 2016-02-03 | 2018-01-02 | 中芯集成电路(宁波)有限公司 | 一种双芯片封装实现的大功率谐振电源控制芯片 |
US10177081B2 (en) * | 2017-01-13 | 2019-01-08 | Littlefuse, Inc. | Thyristor and thermal switch device and assembly techniques therefor |
EP3874573A4 (de) * | 2018-12-19 | 2022-08-03 | Bourns, Inc. | Schutz gegen wechselspannungsbedingungen |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3708720A (en) * | 1973-01-02 | 1973-01-02 | Franklin Electric Co Inc | Semiconductor thermal protection |
JPS61150617A (ja) * | 1984-12-24 | 1986-07-09 | 日本電信電話株式会社 | サ−ジ防護回路 |
DE3621200A1 (de) * | 1986-06-25 | 1988-01-07 | Siemens Ag | Schutzbaustein fuer telekommunikationsanlagen |
GB8713440D0 (en) * | 1987-06-09 | 1987-07-15 | Texas Instruments Ltd | Semiconductor device |
US4903295A (en) * | 1987-08-07 | 1990-02-20 | Gte Products Corporation | Compact solid state station protector device |
US4901183A (en) * | 1988-08-29 | 1990-02-13 | World Products, Inc. | Surge protection device |
-
1990
- 1990-08-21 US US07/570,579 patent/US5150271A/en not_active Expired - Fee Related
-
1991
- 1991-08-20 DE DE69116265T patent/DE69116265T2/de not_active Expired - Fee Related
- 1991-08-20 EP EP91307662A patent/EP0472405B1/de not_active Expired - Lifetime
- 1991-08-21 JP JP3209569A patent/JPH06113445A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0472405A3 (en) | 1992-06-17 |
EP0472405B1 (de) | 1996-01-10 |
US5150271A (en) | 1992-09-22 |
DE69116265T2 (de) | 1996-05-23 |
EP0472405A2 (de) | 1992-02-26 |
JPH06113445A (ja) | 1994-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |