DE69116265D1 - Schutzvorrichtung für Telekommunikationsanlage - Google Patents

Schutzvorrichtung für Telekommunikationsanlage

Info

Publication number
DE69116265D1
DE69116265D1 DE69116265T DE69116265T DE69116265D1 DE 69116265 D1 DE69116265 D1 DE 69116265D1 DE 69116265 T DE69116265 T DE 69116265T DE 69116265 T DE69116265 T DE 69116265T DE 69116265 D1 DE69116265 D1 DE 69116265D1
Authority
DE
Germany
Prior art keywords
protection device
telecommunication system
telecommunication
protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69116265T
Other languages
English (en)
Other versions
DE69116265T2 (de
Inventor
Diethard Unterweger
Ronald J Candelet
Pravin N Popat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69116265D1 publication Critical patent/DE69116265D1/de
Application granted granted Critical
Publication of DE69116265T2 publication Critical patent/DE69116265T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M3/00—Automatic or semi-automatic exchanges
    • H04M3/18—Automatic or semi-automatic exchanges with means for reducing interference or noise; with means for reducing effects due to line faults with means for protecting lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/02—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess current
    • H02H9/026—Current limitation using PTC resistors, i.e. resistors with a large positive temperature coefficient
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/041—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage using a short-circuiting device
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/042—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage comprising means to limit the absorbed power or indicate damaged over-voltage protection device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Protection Of Static Devices (AREA)
DE69116265T 1990-08-21 1991-08-20 Schutzvorrichtung für Telekommunikationsanlage Expired - Fee Related DE69116265T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/570,579 US5150271A (en) 1990-08-21 1990-08-21 Telecommunication equipment protector

Publications (2)

Publication Number Publication Date
DE69116265D1 true DE69116265D1 (de) 1996-02-22
DE69116265T2 DE69116265T2 (de) 1996-05-23

Family

ID=24280207

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69116265T Expired - Fee Related DE69116265T2 (de) 1990-08-21 1991-08-20 Schutzvorrichtung für Telekommunikationsanlage

Country Status (4)

Country Link
US (1) US5150271A (de)
EP (1) EP0472405B1 (de)
JP (1) JPH06113445A (de)
DE (1) DE69116265T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5359657A (en) * 1992-06-08 1994-10-25 Oneac Corporation Telephone line overvoltage protection apparatus
JP2921722B2 (ja) * 1992-06-10 1999-07-19 三菱マテリアル株式会社 チップ型サージアブソーバ
US5371647A (en) * 1992-07-21 1994-12-06 General Instrument Corporation Surge protection circuit module and method for assembling same
FR2699015B1 (fr) * 1992-12-04 1995-02-24 Sgs Thomson Microelectronics Dispositif de protection contre des surtensions.
US5327318A (en) * 1992-12-07 1994-07-05 Texas Instruments Incorporated Telecommunication equipment protector
US5479031A (en) * 1993-09-10 1995-12-26 Teccor Electronics, Inc. Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value
WO1995013621A1 (en) * 1993-11-12 1995-05-18 Alcoa Fujikura Ltd. Short circuit protected splice connector
FR2713400B1 (fr) * 1993-11-29 1996-02-16 Sgs Thomson Microelectronics Composant de protection triangle.
JPH07230733A (ja) * 1994-02-16 1995-08-29 Shinko Electric Ind Co Ltd 半導体アレスタ
US5512784A (en) * 1994-04-19 1996-04-30 Jerrold Communications, General Instrument Corporation Surge protector semiconductor subassembly for 3-lead transistor aotline package
ES2091715B1 (es) * 1994-07-19 1998-05-01 Cymem S A Modulo de proteccion completa para regletas telefonicas y similares.
US5714900A (en) * 1996-04-12 1998-02-03 Hewlett-Packard Company Electrical overstress protection device
US5955960A (en) * 1997-03-24 1999-09-21 Jean-Luc Monnier Tamper resistant electronic lock and method of using same
US5781392A (en) * 1997-05-12 1998-07-14 Tii Industries, Inc. Balanced overvoltage protector for a dual-wire system
US5982598A (en) * 1997-09-19 1999-11-09 Lucent Technologies Inc. Protective circuit for a grounded power plant
US6008976A (en) * 1997-11-26 1999-12-28 Alcatel Usa Sourcing, L.P. Connector for a protector block in a telecommunications system
WO1999039421A1 (en) * 1998-01-31 1999-08-05 Oglesbee John W Supplemental battery overcharge protection device
US6104591A (en) * 1998-03-09 2000-08-15 Teccor Electronics, Inc. Telephone line protection element
US6331763B1 (en) 1998-04-15 2001-12-18 Tyco Electronics Corporation Devices and methods for protection of rechargeable elements
US6100745A (en) * 1998-08-10 2000-08-08 Johnson Controls Technology Company Combination positive temperature coefficient resistor and metal-oxide semiconductor field-effect transistor devices
US6531717B1 (en) 1999-03-01 2003-03-11 Teccor Electronics, L.P. Very low voltage actuated thyristor with centrally-located offset buried region
US6956248B2 (en) 1999-03-01 2005-10-18 Teccor Electronics, Lp Semiconductor device for low voltage protection with low capacitance
US6407901B1 (en) * 1999-04-19 2002-06-18 Teccor Electronics, Lp Semiconductor device providing overvoltage and overcurrent protection for a line
EP1298802A1 (de) * 2001-09-28 2003-04-02 ABB Schweiz AG Verfahren zum Ansteuern eines Leistungshalbleiters
FR2834128B1 (fr) * 2001-12-21 2005-03-04 St Microelectronics Sa Dispositif de protection bidirectionnel a faible capacite
DE10243113A1 (de) * 2002-09-17 2004-04-01 Epcos Ag Elektrische Baugruppe und deren Verwendung
US6862162B2 (en) 2003-04-23 2005-03-01 Teccor Electronics, Lp Thyristor circuit providing overcurrent protection to a low impedance load
US6919625B2 (en) * 2003-07-10 2005-07-19 General Semiconductor, Inc. Surface mount multichip devices
US7037814B1 (en) * 2003-10-10 2006-05-02 National Semiconductor Corporation Single mask control of doping levels
US7244970B2 (en) 2004-12-22 2007-07-17 Tyco Electronics Corporation Low capacitance two-terminal barrier controlled TVS diodes
FR2997803B1 (fr) * 2012-11-06 2016-09-02 Sagem Defense Securite Composant de protection contre la foudre
TWI500229B (zh) * 2013-07-22 2015-09-11 Polytronics Technology Corp 過電流保護裝置
CN105575941B (zh) * 2016-02-03 2018-01-02 中芯集成电路（宁波）有限公司 一种双芯片封装实现的大功率谐振电源控制芯片
US10177081B2 (en) * 2017-01-13 2019-01-08 Littlefuse, Inc. Thyristor and thermal switch device and assembly techniques therefor
EP3874573A4 (de) * 2018-12-19 2022-08-03 Bourns, Inc. Schutz gegen wechselspannungsbedingungen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708720A (en) * 1973-01-02 1973-01-02 Franklin Electric Co Inc Semiconductor thermal protection
JPS61150617A (ja) * 1984-12-24 1986-07-09 日本電信電話株式会社 サ−ジ防護回路
DE3621200A1 (de) * 1986-06-25 1988-01-07 Siemens Ag Schutzbaustein fuer telekommunikationsanlagen
GB8713440D0 (en) * 1987-06-09 1987-07-15 Texas Instruments Ltd Semiconductor device
US4903295A (en) * 1987-08-07 1990-02-20 Gte Products Corporation Compact solid state station protector device
US4901183A (en) * 1988-08-29 1990-02-13 World Products, Inc. Surge protection device

Also Published As

Publication number Publication date
EP0472405A3 (en) 1992-06-17
EP0472405B1 (de) 1996-01-10
US5150271A (en) 1992-09-22
DE69116265T2 (de) 1996-05-23
EP0472405A2 (de) 1992-02-26
JPH06113445A (ja) 1994-04-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee