DE69112181D1 - Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine. - Google Patents

Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine.

Info

Publication number
DE69112181D1
DE69112181D1 DE69112181T DE69112181T DE69112181D1 DE 69112181 D1 DE69112181 D1 DE 69112181D1 DE 69112181 T DE69112181 T DE 69112181T DE 69112181 T DE69112181 T DE 69112181T DE 69112181 D1 DE69112181 D1 DE 69112181D1
Authority
DE
Germany
Prior art keywords
manufacturing
wiring board
multilayer wiring
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69112181T
Other languages
English (en)
Other versions
DE69112181T2 (de
Inventor
Risaburo Yoshida
Akira Muraki
Yasuhiro Sakuma
Masahiro Itoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34057290A external-priority patent/JPH04208596A/ja
Priority claimed from JP10301791A external-priority patent/JP3123107B2/ja
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Application granted granted Critical
Publication of DE69112181D1 publication Critical patent/DE69112181D1/de
Publication of DE69112181T2 publication Critical patent/DE69112181T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69112181T 1990-11-30 1991-11-28 Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine. Expired - Fee Related DE69112181T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34057290A JPH04208596A (ja) 1990-11-30 1990-11-30 多層プリント配線板の製造方法
JP10301791A JP3123107B2 (ja) 1991-05-09 1991-05-09 多層配線板の製造方法

Publications (2)

Publication Number Publication Date
DE69112181D1 true DE69112181D1 (de) 1995-09-21
DE69112181T2 DE69112181T2 (de) 1996-05-09

Family

ID=26443683

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69112181T Expired - Fee Related DE69112181T2 (de) 1990-11-30 1991-11-28 Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine.

Country Status (3)

Country Link
US (1) US5264049A (de)
EP (1) EP0488299B1 (de)
DE (1) DE69112181T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633069A (en) * 1989-02-23 1997-05-27 Fuji Xerox Co., Ltd. Multilayer printed-circuit substrate, wiring substrate and process of producing the same
DE19523646A1 (de) * 1995-06-29 1997-01-02 Km Europa Metal Ag Kupferband oder -blech mit brauner Deckschicht und Verfahren zu seiner Herstellung
JP3566269B2 (ja) * 2002-06-07 2004-09-15 富士通株式会社 リードフレーム及びその製造方法、及び半導体装置。

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117282A (ja) * 1984-11-09 1986-06-04 Dainichi Nippon Cables Ltd 酸化銅皮膜形成方法
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
GB8602330D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
GB8602331D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
EP0310010B1 (de) * 1987-10-01 1994-01-12 Mcgean-Rohco, Inc. Herstellung einer mehrschichtigen gedruckten Schaltungsplatte
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
MY104191A (en) * 1988-09-06 1994-02-28 Mitsubishi Gas Chemical Co Process for producing multilayer printed wiring board
US5147492A (en) * 1991-02-20 1992-09-15 Compeq Manufacturing Co., Ltd. Method of bonding copper and resin

Also Published As

Publication number Publication date
US5264049A (en) 1993-11-23
EP0488299A1 (de) 1992-06-03
DE69112181T2 (de) 1996-05-09
EP0488299B1 (de) 1995-08-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee