DE316886T1 - Verfahren zur herstellung einer gedruckten schaltungsplatte. - Google Patents
Verfahren zur herstellung einer gedruckten schaltungsplatte.Info
- Publication number
- DE316886T1 DE316886T1 DE198888119051T DE88119051T DE316886T1 DE 316886 T1 DE316886 T1 DE 316886T1 DE 198888119051 T DE198888119051 T DE 198888119051T DE 88119051 T DE88119051 T DE 88119051T DE 316886 T1 DE316886 T1 DE 316886T1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- circuit board
- printed circuit
- printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62289114A JPH01129492A (ja) | 1987-11-16 | 1987-11-16 | プリント基板製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE316886T1 true DE316886T1 (de) | 1990-05-03 |
Family
ID=17738964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE198888119051T Pending DE316886T1 (de) | 1987-11-16 | 1988-11-15 | Verfahren zur herstellung einer gedruckten schaltungsplatte. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0316886A3 (de) |
JP (1) | JPH01129492A (de) |
KR (1) | KR910001745B1 (de) |
DE (1) | DE316886T1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02291194A (ja) * | 1989-04-28 | 1990-11-30 | Nec Corp | 印刷配線パターンの製造方法 |
JPH0319297A (ja) * | 1989-06-15 | 1991-01-28 | Nec Corp | 多層セラミック配線基板の製造方法 |
EP0923094B1 (de) | 1997-12-03 | 2006-09-20 | TDK Corporation | Mehrlagiges keramisches Elektronikbauteil und dessen Herstellungsverfahren |
GB9803972D0 (en) * | 1998-02-25 | 1998-04-22 | Noble Peter J W | A deposition method and apparatus therefor |
GB0123676D0 (en) | 2001-10-02 | 2001-11-21 | Poly Flex Circuits Ltd | Method of manufacturing circuits |
WO2015156661A1 (en) * | 2014-04-07 | 2015-10-15 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method of producing a patterned nanowires network |
JP7104687B2 (ja) | 2017-03-16 | 2022-07-21 | 旭化成株式会社 | 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体 |
US11328835B2 (en) | 2017-03-16 | 2022-05-10 | Asahi Kasei Kabushiki Kaisha | Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern |
JP7005625B2 (ja) * | 2017-07-18 | 2022-01-21 | 旭化成株式会社 | 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線 |
CN110933948B (zh) | 2017-07-27 | 2022-07-19 | 旭化成株式会社 | 氧化铜油墨和其在制品中的应用及各制品的制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2776235A (en) * | 1952-09-18 | 1957-01-01 | Sprague Electric Co | Electric circuit printing |
US4350449A (en) * | 1980-06-23 | 1982-09-21 | International Business Machines Corporation | Resistive ribbon printing apparatus and method |
JPS60219790A (ja) * | 1984-04-16 | 1985-11-02 | 富士ゼロックス株式会社 | 電気回路パターン形成装置 |
DE3574845D1 (de) * | 1984-10-22 | 1990-01-25 | Xerox Corp | Druckersystem. |
JPS62128277A (ja) * | 1985-11-28 | 1987-06-10 | Mita Ind Co Ltd | 熱転写式レ−ザビ−ムプリンタ |
-
1987
- 1987-11-16 JP JP62289114A patent/JPH01129492A/ja active Pending
-
1988
- 1988-11-15 DE DE198888119051T patent/DE316886T1/de active Pending
- 1988-11-15 EP EP88119051A patent/EP0316886A3/de not_active Withdrawn
- 1988-11-16 KR KR1019880015069A patent/KR910001745B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0316886A3 (de) | 1990-03-07 |
EP0316886A2 (de) | 1989-05-24 |
JPH01129492A (ja) | 1989-05-22 |
KR910001745B1 (ko) | 1991-03-22 |
KR890009235A (ko) | 1989-07-15 |
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