DE69107882D1 - Verfahren und Gerät zur Untersuchung eines Oberflächenmusters eines Objektes. - Google Patents
Verfahren und Gerät zur Untersuchung eines Oberflächenmusters eines Objektes.Info
- Publication number
- DE69107882D1 DE69107882D1 DE69107882T DE69107882T DE69107882D1 DE 69107882 D1 DE69107882 D1 DE 69107882D1 DE 69107882 T DE69107882 T DE 69107882T DE 69107882 T DE69107882 T DE 69107882T DE 69107882 D1 DE69107882 D1 DE 69107882D1
- Authority
- DE
- Germany
- Prior art keywords
- examining
- surface pattern
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/1765—Method using an image detector and processing of image signal
- G01N2021/177—Detector of the video camera type
- G01N2021/1776—Colour camera
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/178—Methods for obtaining spatial resolution of the property being measured
- G01N2021/1785—Three dimensional
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95653—Through-holes
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02100294A JP3072998B2 (ja) | 1990-04-18 | 1990-04-18 | はんだ付け状態検査方法及びその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69107882D1 true DE69107882D1 (de) | 1995-04-13 |
DE69107882T2 DE69107882T2 (de) | 1995-11-02 |
Family
ID=14270158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69107882T Expired - Fee Related DE69107882T2 (de) | 1990-04-18 | 1991-04-17 | Verfahren und Gerät zur Untersuchung eines Oberflächenmusters eines Objektes. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5166985A (de) |
EP (1) | EP0452905B1 (de) |
JP (1) | JP3072998B2 (de) |
KR (1) | KR950000331B1 (de) |
DE (1) | DE69107882T2 (de) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0833293B2 (ja) * | 1991-04-15 | 1996-03-29 | 松下電器産業株式会社 | 半田の形状検査方法 |
NO914574L (no) * | 1991-11-22 | 1993-05-24 | Elkem Technology | Fremgangsmaate for detektering av pin-hull i strengestoeptemetallemne |
JPH05248820A (ja) * | 1992-03-10 | 1993-09-28 | Nec Toyama Ltd | 照明装置 |
US5424838A (en) * | 1993-03-01 | 1995-06-13 | Siu; Bernard | Microelectronics inspection system |
GB9219550D0 (en) * | 1992-09-16 | 1992-10-28 | British Nuclear Fuels Plc | The inspection of cylindrical |
DE19511197C2 (de) * | 1995-03-27 | 1999-05-12 | Basler Gmbh | Verfahren und Vorrichtung zum optischen Prüfen einer Oberfläche, insbesondere einer Compact-Disc |
US5751910A (en) * | 1995-05-22 | 1998-05-12 | Eastman Kodak Company | Neural network solder paste inspection system |
JP2775411B2 (ja) * | 1995-07-25 | 1998-07-16 | 名古屋電機工業株式会社 | 印刷配線板検査装置用の照明装置 |
JPH0961363A (ja) * | 1995-08-29 | 1997-03-07 | Bridgestone Sports Co Ltd | ゴルフボールの外観検査方法及び該検査方法に用いる照明装置 |
US6298149B1 (en) * | 1996-03-21 | 2001-10-02 | Cognex Corporation | Semiconductor device image inspection with contrast enhancement |
IE80676B1 (en) * | 1996-08-02 | 1998-11-18 | M V Research Limited | A measurement system |
US6408429B1 (en) * | 1997-01-17 | 2002-06-18 | Cognex Corporation | Machine vision system for identifying and assessing features of an article |
US5943125A (en) * | 1997-02-26 | 1999-08-24 | Acuity Imaging, Llc | Ring illumination apparatus for illuminating reflective elements on a generally planar surface |
US6201892B1 (en) | 1997-02-26 | 2001-03-13 | Acuity Imaging, Llc | System and method for arithmetic operations for electronic package inspection |
US5828449A (en) * | 1997-02-26 | 1998-10-27 | Acuity Imaging, Llc | Ring illumination reflective elements on a generally planar surface |
US6236747B1 (en) | 1997-02-26 | 2001-05-22 | Acuity Imaging, Llc | System and method for image subtraction for ball and bumped grid array inspection |
US5926557A (en) * | 1997-02-26 | 1999-07-20 | Acuity Imaging, Llc | Inspection method |
US6118524A (en) * | 1997-02-26 | 2000-09-12 | Acuity Imaging, Llc | Arc illumination apparatus and method |
DE19725633C1 (de) * | 1997-06-17 | 1998-12-17 | Zentrum Fuer Neuroinformatik G | Verfahren und Anordnung zur Analyse der Beschaffenheit einer Oberfläche |
US20030133292A1 (en) | 1999-11-18 | 2003-07-17 | Mueller George G. | Methods and apparatus for generating and modulating white light illumination conditions |
US6624597B2 (en) | 1997-08-26 | 2003-09-23 | Color Kinetics, Inc. | Systems and methods for providing illumination in machine vision systems |
EP0935135A1 (de) * | 1998-02-09 | 1999-08-11 | MV Research Limited | System zum Messen von Lotdepots |
US6630998B1 (en) | 1998-08-13 | 2003-10-07 | Acushnet Company | Apparatus and method for automated game ball inspection |
KR100345001B1 (ko) * | 1998-08-27 | 2002-07-19 | 삼성전자 주식회사 | 기판 납땜 검사용 조명 및 광학 장치 |
US6088109A (en) * | 1998-09-24 | 2000-07-11 | Advanced Semiconductor Engineering, Inc. | System for detecting the presence of deposited metals on soldering points of an integrated circuit board substrate |
JP3330089B2 (ja) * | 1998-09-30 | 2002-09-30 | 株式会社大協精工 | ゴム製品の検査方法及び装置 |
JP2003503701A (ja) * | 1999-06-24 | 2003-01-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 照明モジュール |
US6567159B1 (en) * | 1999-10-13 | 2003-05-20 | Gaming Analysis, Inc. | System for recognizing a gaming chip and method of use |
WO2001029542A1 (en) * | 1999-10-18 | 2001-04-26 | Mv Research Limited | Machine vision |
US6542180B1 (en) * | 2000-01-07 | 2003-04-01 | Mitutoyo Corporation | Systems and methods for adjusting lighting of a part based on a plurality of selected regions of an image of the part |
JP2001255281A (ja) * | 2000-01-17 | 2001-09-21 | Agilent Technol Inc | 検査装置 |
US6762428B2 (en) * | 2000-07-17 | 2004-07-13 | Nagoya Electric Works Co. Ltd. | Cream solder inspection method and apparatus therefor |
US7042172B2 (en) | 2000-09-01 | 2006-05-09 | Color Kinetics Incorporated | Systems and methods for providing illumination in machine vision systems |
WO2002018913A2 (en) * | 2000-09-01 | 2002-03-07 | Color Kinetics Incorporated | Systems and methods for providing illumination in machine vision systems |
US6870611B2 (en) * | 2001-07-26 | 2005-03-22 | Orbotech Ltd. | Electrical circuit conductor inspection |
US7231080B2 (en) | 2001-02-13 | 2007-06-12 | Orbotech Ltd. | Multiple optical input inspection system |
US20020186878A1 (en) * | 2001-06-07 | 2002-12-12 | Hoon Tan Seow | System and method for multiple image analysis |
DE10128476C2 (de) * | 2001-06-12 | 2003-06-12 | Siemens Dematic Ag | Optische Sensorvorrichtung zur visuellen Erfassung von Substraten |
DE10149780B4 (de) * | 2001-10-09 | 2019-09-05 | Byk Gardner Gmbh | Einrichtung zur Beleuchtung einer Messfläche und Vorrichtung und Verfahren zur Bestimmung der visuellen Eigenschaften von Körpern |
US7062080B2 (en) | 2001-11-26 | 2006-06-13 | Omron Corporation | Method of inspecting curved surface and device for inspecting printed circuit board |
DE60202831T2 (de) * | 2001-11-26 | 2006-01-12 | Omron Corp. | Methode zur Prüfung einer gekrümmten Oberfläche und Vorrichtung zur Prüfung einer Leiterplatte |
JP3551188B2 (ja) * | 2002-01-10 | 2004-08-04 | オムロン株式会社 | 表面状態検査方法および基板検査装置 |
AU2003202121A1 (en) * | 2002-01-18 | 2003-07-30 | Mv Research Limited | A machine vision system |
JP2006514266A (ja) * | 2002-07-12 | 2006-04-27 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 一様光源の方法および装置 |
US7253891B2 (en) * | 2003-01-09 | 2007-08-07 | Orbotech Ltd. | Method and apparatus for simultaneous 2-D and topographical inspection |
EP1455179A1 (de) * | 2003-03-07 | 2004-09-08 | MV Research Limited | Maschinenvisionssystem und Verfahren zur Inspektion |
US6970240B2 (en) | 2003-03-10 | 2005-11-29 | Applera Corporation | Combination reader |
DE10311416B4 (de) * | 2003-03-13 | 2005-12-01 | Wente / Thiedig Gmbh | Optische Prüfeinrichtung für Hohlkörper und Verfahren zur optischen Prüfung von Hohlkörpern |
US7019826B2 (en) * | 2003-03-20 | 2006-03-28 | Agilent Technologies, Inc. | Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection |
FR2861948B1 (fr) | 2003-10-30 | 2006-03-24 | Airbus France | Procede pour determiner des modifications apportees a une carte electronique et methodes de fabrication d'une carte electronique et d'un equipement muni d'une carte electronique |
JP3867724B2 (ja) * | 2004-02-27 | 2007-01-10 | オムロン株式会社 | 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置 |
JP2006047290A (ja) * | 2004-06-30 | 2006-02-16 | Omron Corp | 基板検査用の画像生成方法、基板検査装置、および基板検査用の照明装置 |
US8121392B2 (en) | 2004-10-25 | 2012-02-21 | Parata Systems, Llc | Embedded imaging and control system |
US7930064B2 (en) | 2004-11-19 | 2011-04-19 | Parata Systems, Llc | Automated drug discrimination during dispensing |
JP4826750B2 (ja) | 2005-04-08 | 2011-11-30 | オムロン株式会社 | 欠陥検査方法およびその方法を用いた欠陥検査装置 |
US7315361B2 (en) * | 2005-04-29 | 2008-01-01 | Gsi Group Corporation | System and method for inspecting wafers in a laser marking system |
US20060291715A1 (en) * | 2005-06-24 | 2006-12-28 | Mv Research Limited | Machine vision system and method |
KR101322292B1 (ko) * | 2005-07-08 | 2013-10-28 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 텔레센트릭 축상 암 시야 조명으로 구현된 광학 시스템의 사용과 성능의 최적화 |
JP2007240432A (ja) * | 2006-03-10 | 2007-09-20 | Omron Corp | 欠陥検査装置および欠陥検査方法 |
EP2006804A1 (de) * | 2007-06-22 | 2008-12-24 | Siemens Aktiengesellschaft | Verfahren zur optischen Insprktion einer matten Oberfläche und Vorrichtung zum Durchführen dieses Verfahren |
DE102007035198A1 (de) * | 2007-07-25 | 2009-01-29 | Datarius Technologies Gmbh | Vorrichtung zur Inspektion von optischen Datenträgern |
DE102008018586A1 (de) * | 2008-04-12 | 2009-11-05 | Mühlbauer Ag | Optische Erfassungsvorrichtung und Verfahren für die Erfassung von Oberflächen von Bauteilen |
KR101251372B1 (ko) * | 2008-10-13 | 2013-04-05 | 주식회사 고영테크놀러지 | 3차원형상 측정방법 |
US8284386B2 (en) | 2008-11-26 | 2012-10-09 | Parata Systems, Llc | System and method for verifying the contents of a filled, capped pharmaceutical prescription |
US8374965B2 (en) | 2008-11-26 | 2013-02-12 | Parata Systems, Llc | System and method for verifying the contents of a filled, capped pharmaceutical prescription |
US20120086800A1 (en) * | 2010-10-06 | 2012-04-12 | Asml Holding N.V. | Surface Inspection System with Advanced Illumination |
CH706642B1 (fr) * | 2012-06-22 | 2017-05-31 | Icoflex Sàrl | Instrument optoélectronique de mesure du mouvement d'éléments mobiles d'un calibre de montre mécanique ainsi que la méthode de mesure. |
CN106030240B (zh) * | 2014-01-08 | 2019-04-30 | 雅马哈发动机株式会社 | 外观检查装置及外观检查方法 |
EP3032241B1 (de) * | 2014-12-11 | 2023-03-01 | X-Rite Europe GmbH | Verfahren und vorrichtung zur digitalisierung des aussehens eines echten materials |
KR101739696B1 (ko) * | 2016-07-13 | 2017-05-25 | 서장일 | 재질인식 조명 시스템 및 이를 이용한 재질인식 방법 |
US20220172387A1 (en) * | 2019-03-26 | 2022-06-02 | Sony Group Corporation | Image processing apparatus, image processing method, and image processing program |
US11282187B2 (en) * | 2019-08-19 | 2022-03-22 | Ricoh Company, Ltd. | Inspection system, inspection apparatus, and method using multiple angle illumination |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4692690A (en) * | 1983-12-26 | 1987-09-08 | Hitachi, Ltd. | Pattern detecting apparatus |
US4740079A (en) * | 1984-10-29 | 1988-04-26 | Hitachi, Ltd. | Method of and apparatus for detecting foreign substances |
JPS61293657A (ja) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | 半田付け外観検査方法 |
DD258658A1 (de) * | 1986-01-27 | 1988-07-27 | Univ Berlin Humboldt | Verfahren zum pruefen von loetstellen elektronischer baugruppen |
AU3543689A (en) * | 1988-05-09 | 1989-11-29 | Omron Tateisi Electronics Co. | Substrate examining apparatus and method of operating same |
EP0370527B1 (de) * | 1988-11-24 | 1994-02-02 | Omron Tateisi Electronics Co. | Verfahren und Gerät zur Inspektion von Schichten |
US4988202A (en) * | 1989-06-28 | 1991-01-29 | Westinghouse Electric Corp. | Solder joint inspection system and method |
-
1990
- 1990-04-18 JP JP02100294A patent/JP3072998B2/ja not_active Expired - Lifetime
-
1991
- 1991-04-16 KR KR1019910006073A patent/KR950000331B1/ko not_active IP Right Cessation
- 1991-04-17 DE DE69107882T patent/DE69107882T2/de not_active Expired - Fee Related
- 1991-04-17 EP EP91106141A patent/EP0452905B1/de not_active Expired - Lifetime
- 1991-04-17 US US07/686,352 patent/US5166985A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5166985A (en) | 1992-11-24 |
KR950000331B1 (ko) | 1995-01-13 |
JPH041510A (ja) | 1992-01-07 |
KR910018797A (ko) | 1991-11-30 |
DE69107882T2 (de) | 1995-11-02 |
JP3072998B2 (ja) | 2000-08-07 |
EP0452905A1 (de) | 1991-10-23 |
EP0452905B1 (de) | 1995-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |