DE69107664D1 - Wafertransportsystem. - Google Patents

Wafertransportsystem.

Info

Publication number
DE69107664D1
DE69107664D1 DE69107664T DE69107664T DE69107664D1 DE 69107664 D1 DE69107664 D1 DE 69107664D1 DE 69107664 T DE69107664 T DE 69107664T DE 69107664 T DE69107664 T DE 69107664T DE 69107664 D1 DE69107664 D1 DE 69107664D1
Authority
DE
Germany
Prior art keywords
transport system
wafer transport
wafer
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69107664T
Other languages
English (en)
Other versions
DE69107664T2 (de
Inventor
Munenori Tomita
Junichiro Takei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69107664D1 publication Critical patent/DE69107664D1/de
Application granted granted Critical
Publication of DE69107664T2 publication Critical patent/DE69107664T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
DE69107664T 1990-04-27 1991-04-26 Wafertransportsystem. Expired - Fee Related DE69107664T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2110612A JPH0410529A (ja) 1990-04-27 1990-04-27 サセプタ及びウエーハ自動脱着装置

Publications (2)

Publication Number Publication Date
DE69107664D1 true DE69107664D1 (de) 1995-04-06
DE69107664T2 DE69107664T2 (de) 1995-10-19

Family

ID=14540240

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69107664T Expired - Fee Related DE69107664T2 (de) 1990-04-27 1991-04-26 Wafertransportsystem.

Country Status (4)

Country Link
US (1) US5188501A (de)
EP (1) EP0454496B1 (de)
JP (1) JPH0410529A (de)
DE (1) DE69107664T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9201825A (nl) * 1992-10-21 1994-05-16 Od & Me Bv Inrichting voor het vervaardigen van een matrijs voor een schijfvormige registratiedrager.
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US5669644A (en) * 1995-11-13 1997-09-23 Kokusai Electric Co., Ltd. Wafer transfer plate
JPH09213769A (ja) * 1996-01-31 1997-08-15 Komatsu Electron Metals Co Ltd 半導体ウェハの搬送装置
US6183186B1 (en) 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
US6149368A (en) * 1998-06-12 2000-11-21 Advanced Micro Devices, Inc. Wafer disk pad having one or more wafer loading points to facilitate vacuum wand wafer loading and unloading
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
DE19906398B4 (de) * 1999-02-16 2004-04-29 Steag Hamatech Ag Verfahren und Vorrichtung zum Behandeln von Substraten
US6770144B2 (en) * 2000-07-25 2004-08-03 International Business Machines Corporation Multideposition SACVD reactor
US6634882B2 (en) 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US7294317B2 (en) * 2001-02-08 2007-11-13 Sd Lizenzverwertungsgesellschaft Mbh & Co. Exothermic reaction system
ITMI20012014A1 (it) * 2001-09-27 2003-03-27 Lpe Spa Utensile per maneggiare fette e stazione per crescita epitassiale
US7033445B2 (en) * 2001-12-27 2006-04-25 Asm America, Inc. Gridded susceptor
US20040035360A1 (en) * 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
US6709267B1 (en) 2002-12-27 2004-03-23 Asm America, Inc. Substrate holder with deep annular groove to prevent edge heat loss
US8211230B2 (en) 2005-01-18 2012-07-03 Asm America, Inc. Reaction system for growing a thin film
JP2009032946A (ja) * 2007-07-27 2009-02-12 Shin Etsu Handotai Co Ltd 気相成長装置および気相成長方法
JP5253933B2 (ja) * 2008-09-04 2013-07-31 東京エレクトロン株式会社 成膜装置、基板処理装置、成膜方法及び記憶媒体
JP5623213B2 (ja) * 2010-09-17 2014-11-12 株式会社ディスコ 切削加工装置
US8322766B1 (en) * 2011-11-02 2012-12-04 Gintech Energy Corporation Wafer gripper
CN102862396A (zh) * 2012-08-04 2013-01-09 江苏吉星新材料有限公司 晶片打标定位模具
CA147129S (en) * 2012-08-24 2013-04-18 Fsts Man Group Inc Drink tray
US9373534B2 (en) 2012-09-05 2016-06-21 Industrial Technology Research Institute Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof
US9082801B2 (en) * 2012-09-05 2015-07-14 Industrial Technology Research Institute Rotatable locating apparatus with dome carrier and operating method thereof
JP6562546B2 (ja) * 2015-07-14 2019-08-21 昭和電工株式会社 ウェハ支持台、ウェハ支持体、化学気相成長装置
US10872803B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US10872804B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
USD914620S1 (en) 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
US11961756B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Vented susceptor
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
US11404302B2 (en) 2019-05-22 2022-08-02 Asm Ip Holding B.V. Substrate susceptor using edge purging
US11764101B2 (en) 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
USD1031676S1 (en) 2020-12-04 2024-06-18 Asm Ip Holding B.V. Combined susceptor, support, and lift system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272350A (en) * 1964-09-25 1966-09-13 Westinghouse Electric Corp Method and apparatus for semiconductor wafer handling
US3764511A (en) * 1972-03-29 1973-10-09 United Aircraft Corp Moated substrate holding pedestal
DE2415277A1 (de) * 1974-03-29 1975-10-16 Karl Schwab Stapelbare transportpalette
US4132311A (en) * 1977-09-29 1979-01-02 Shorewood Packaging Corp. Tape cartridge/cassette receptacle
US4208006A (en) * 1979-02-27 1980-06-17 Diamond International Corporation Molded pulp tray for beverage and food
JPS57169968A (en) * 1981-04-10 1982-10-19 Matsushita Electric Ind Co Ltd Reproducer for recording disc
JPS61222221A (ja) * 1985-03-28 1986-10-02 Toshiba Corp 気相成長装置用サセプタ
JPS62295839A (ja) * 1986-06-16 1987-12-23 Shin Meiwa Ind Co Ltd グリツプ装置
JPS62295840A (ja) * 1986-06-16 1987-12-23 Shin Meiwa Ind Co Ltd グリツプ装置
JPS6356932A (ja) * 1986-08-28 1988-03-11 Sony Corp 基板供給装置
US4986215A (en) * 1988-09-01 1991-01-22 Kyushu Electronic Metal Co., Ltd. Susceptor for vapor-phase growth system
US5052560A (en) * 1990-09-27 1991-10-01 Stringham Richard B Confection holding structure for use in envelopes

Also Published As

Publication number Publication date
EP0454496A1 (de) 1991-10-30
JPH0410529A (ja) 1992-01-14
EP0454496B1 (de) 1995-03-01
DE69107664T2 (de) 1995-10-19
US5188501A (en) 1993-02-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee