DE69024817T2 - Verfahren zur herstellung eines punktartig teilweise bedeckten elementes - Google Patents

Verfahren zur herstellung eines punktartig teilweise bedeckten elementes

Info

Publication number
DE69024817T2
DE69024817T2 DE69024817T DE69024817T DE69024817T2 DE 69024817 T2 DE69024817 T2 DE 69024817T2 DE 69024817 T DE69024817 T DE 69024817T DE 69024817 T DE69024817 T DE 69024817T DE 69024817 T2 DE69024817 T2 DE 69024817T2
Authority
DE
Germany
Prior art keywords
producing
covered element
particularly partial
partial covered
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69024817T
Other languages
English (en)
Other versions
DE69024817D1 (de
Inventor
K Suita Seisakusho Of Yamamoto
Shin Suita Seisakusho O Nemoto
Jun Suita Seisakusho O Okamoto
S Suita Seisakusho Of Okazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neomax Co Ltd
Original Assignee
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Special Metals Co Ltd filed Critical Sumitomo Special Metals Co Ltd
Publication of DE69024817D1 publication Critical patent/DE69024817D1/de
Application granted granted Critical
Publication of DE69024817T2 publication Critical patent/DE69024817T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/005—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore cutting-off or cutting-out a part of a strip-like or sheet-like material, transferring that part and fixing it to an article
    • B29C69/006—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore cutting-off or cutting-out a part of a strip-like or sheet-like material, transferring that part and fixing it to an article rotating transfer means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B23K2103/26—Alloys of Nickel and Cobalt and Chromium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Metal Rolling (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Laser Beam Processing (AREA)
DE69024817T 1989-09-20 1990-09-19 Verfahren zur herstellung eines punktartig teilweise bedeckten elementes Expired - Lifetime DE69024817T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1246165A JPH03106578A (ja) 1989-09-20 1989-09-20 スポット状部分クラッド材の製造方法
PCT/JP1990/001195 WO1991004123A1 (fr) 1989-09-20 1990-09-19 Procede de production d'un element ponctuel partiellement revetu

Publications (2)

Publication Number Publication Date
DE69024817D1 DE69024817D1 (de) 1996-02-22
DE69024817T2 true DE69024817T2 (de) 1996-11-07

Family

ID=17144475

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69024817T Expired - Lifetime DE69024817T2 (de) 1989-09-20 1990-09-19 Verfahren zur herstellung eines punktartig teilweise bedeckten elementes

Country Status (6)

Country Link
US (1) US5234150A (de)
EP (1) EP0493595B1 (de)
JP (1) JPH03106578A (de)
KR (1) KR960005825B1 (de)
DE (1) DE69024817T2 (de)
WO (1) WO1991004123A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH685108A5 (de) * 1991-12-12 1995-03-31 Bruderer Ag Verfahren und Vorrichtung zum Herstellen von Werkteilen auf einer Bänder verarbeitenden Umformmaschine.
BE1008374A3 (nl) * 1994-04-22 1996-04-02 Philips Electronics Nv Werkwijze voor het verbinden van twee van sporenpatronen voorziene strippen, alsmede magneetkop voorzien van twee volgens de werkwijze met elkaar verbonden strippen.
FR2754595B1 (fr) * 1996-10-11 1999-01-08 Ziemann Secathen Echangeur de chaleur, et faisceau d'echange de chaleur, ainsi que procedes de soudage et de realisation s'y rapportant
KR100842493B1 (ko) * 2004-08-09 2008-07-01 닛본 덴끼 가부시끼가이샤 이금속 박판의 용접 방법, 이금속 박판 접합체, 전기디바이스 및 전기 디바이스 집합체
US20060132544A1 (en) * 2004-12-21 2006-06-22 Corley Richard E Jr Laser tacking and singulating method and system
US7652223B2 (en) * 2005-06-13 2010-01-26 Applied Materials, Inc. Electron beam welding of sputtering target tiles
US20080041922A1 (en) * 2006-07-13 2008-02-21 Mariana G Forrest Hybrid Resistance/Ultrasonic Welding System and Method
JP5353087B2 (ja) * 2008-06-24 2013-11-27 スズキ株式会社 レーザ溶接用隙間制御装置
DE102010025963A1 (de) 2010-06-30 2012-01-05 Universität Paderborn Verfahren zur umformtechnischen Herstellung von Halbzeugen mit lokal variierenden bzw. einstellbaren Verbundeigenschaften, entsprechend hergestellte Halbzeuge sowie Verwendung entsprechender Halbzeuge
JP7210277B2 (ja) 2015-09-15 2023-01-23 ジースリー・エンタープライゼズ・インコーポレイテッド 金属に適用される代替コーティングのための装置及び方法
KR20210134087A (ko) * 2016-04-29 2021-11-08 누부루 인크. 반도체 패키징, 자동차 전기 장치, 배터리 및 기타 부품에 대한 가시 레이저 용접 방법
WO2020106895A1 (en) 2018-11-20 2020-05-28 G3 Enterprises, Inc. Apparatus and methods using coatings for metal applications
CN109616420A (zh) * 2018-11-21 2019-04-12 杰群电子科技（东莞）有限公司 一种功率模组加工方法及功率模组
CN113316495A (zh) * 2019-02-22 2021-08-27 哈利玛化成株式会社 固态钎焊材的涂布方法、涂布物制造方法、涂布装置和卷状固态钎焊材
WO2022095124A1 (zh) * 2020-11-09 2022-05-12 绍兴市柯桥区锦策智能科技有限公司 一种装饰面木塑快速自动贴面机

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542612A (en) * 1977-06-08 1979-01-10 Hitachi Ltd Fault-protective circuit of signal transmitter
JPS59141389A (ja) * 1983-02-01 1984-08-14 Hitachi Cable Ltd 部分クラツド材の製造方法
JPS59174287A (ja) * 1983-03-23 1984-10-02 Hitachi Cable Ltd 部分クラツド材の製造方法
JPS60227456A (ja) * 1984-04-26 1985-11-12 Nec Corp 半導体装置用リ−ドフレ−ム
JPS61209787A (ja) * 1985-03-14 1986-09-18 Ishikawajima Harima Heavy Ind Co Ltd クラツド板の圧延方法および装置
JPS61209788A (ja) * 1985-03-14 1986-09-18 Ishikawajima Harima Heavy Ind Co Ltd クラツド板の圧延方法及び装置
JPS62114781A (ja) * 1985-11-12 1987-05-26 Showa Alum Corp 帯状金属シ−トに一定間隔おきに片状金属箔接合層を設ける方法
JPS62224484A (ja) * 1986-03-26 1987-10-02 Showa Alum Corp 帯状金属シ−トに一定間隔おきに異種金属部分クラツド層を設ける方法
JPS6368284A (ja) * 1986-09-09 1988-03-28 Daido Steel Co Ltd ストライプクラツド帯の製造方法
US4887343A (en) * 1987-05-29 1989-12-19 Fuji Photo Film Co., Ltd. Method and apparatus for roller leveler
JPH02280981A (ja) * 1989-04-21 1990-11-16 Sumitomo Special Metals Co Ltd スポット状部分クラッド材の製造方法
JPH06102273B2 (ja) * 1989-06-02 1994-12-14 住友特殊金属株式会社 スポット状部分クラッド材の製造方法
JPH0379040A (ja) * 1989-08-22 1991-04-04 Sumitomo Special Metals Co Ltd スポット状部分クラッド材の製造方法

Also Published As

Publication number Publication date
EP0493595A1 (de) 1992-07-08
DE69024817D1 (de) 1996-02-22
EP0493595B1 (de) 1996-01-10
KR960005825B1 (ko) 1996-05-01
KR920703264A (ko) 1992-12-17
EP0493595A4 (en) 1993-09-01
US5234150A (en) 1993-08-10
WO1991004123A1 (fr) 1991-04-04
JPH03106578A (ja) 1991-05-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: FEDER WALTER EBERT PATENTANWAELTE, 40237 DUESSELDO