DE69016296T2 - Mischleiterplatten und Verfahren zu ihrer Herstellung. - Google Patents
Mischleiterplatten und Verfahren zu ihrer Herstellung.Info
- Publication number
- DE69016296T2 DE69016296T2 DE69016296T DE69016296T DE69016296T2 DE 69016296 T2 DE69016296 T2 DE 69016296T2 DE 69016296 T DE69016296 T DE 69016296T DE 69016296 T DE69016296 T DE 69016296T DE 69016296 T2 DE69016296 T2 DE 69016296T2
- Authority
- DE
- Germany
- Prior art keywords
- mixed circuit
- manufacture
- processes
- circuit boards
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0376—Etching temporary metallic carrier substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1190205A JP2764745B2 (ja) | 1989-07-21 | 1989-07-21 | 混成回路基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69016296D1 DE69016296D1 (de) | 1995-03-09 |
DE69016296T2 true DE69016296T2 (de) | 1995-08-10 |
Family
ID=16254213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69016296T Expired - Fee Related DE69016296T2 (de) | 1989-07-21 | 1990-07-23 | Mischleiterplatten und Verfahren zu ihrer Herstellung. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0409668B1 (de) |
JP (1) | JP2764745B2 (de) |
AT (1) | ATE117869T1 (de) |
DE (1) | DE69016296T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4304437A1 (de) * | 1993-02-13 | 1994-08-18 | Ego Elektro Blanc & Fischer | Integrierte Schaltung, insbesondere für Berührungsschalter, sowie Verfahren zur Herstellung einer integrierten Schaltung |
US6005197A (en) * | 1997-08-25 | 1999-12-21 | Lucent Technologies Inc. | Embedded thin film passive components |
IL141592A (en) * | 2001-02-22 | 2007-02-11 | Zvi Finkelstein | Electrolytic capacitors and method for making them |
US6212078B1 (en) * | 1999-10-27 | 2001-04-03 | Microcoating Technologies | Nanolaminated thin film circuitry materials |
US6525921B1 (en) * | 1999-11-12 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
JP2002185142A (ja) * | 2000-12-19 | 2002-06-28 | Ibiden Co Ltd | 多層プリント配線板及びその製造方法 |
EP1265466A3 (de) | 2001-06-05 | 2004-07-21 | Dai Nippon Printing Co., Ltd. | Verfahren zur Herstellung einer Leiterplatte mit passiven Elementen und Leiterplatte mit passiven Elementen |
DE10155393A1 (de) * | 2001-11-10 | 2003-05-22 | Philips Corp Intellectual Pty | Planarer Polymer-Kondensator |
WO2004056160A1 (en) * | 2002-12-13 | 2004-07-01 | E.I. Du Pont De Nemours And Company | Printed wiring boards having low inductance embedded capacitors and methods of making same |
US20040231885A1 (en) * | 2003-03-07 | 2004-11-25 | Borland William J. | Printed wiring boards having capacitors and methods of making thereof |
US7430128B2 (en) | 2004-10-18 | 2008-09-30 | E.I. Du Pont De Nemours And Company | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE503299A (de) * | 1949-10-29 | |||
GB999183A (en) * | 1962-03-09 | 1965-07-21 | Jean Michel | A process for manufacturing printed circuits |
DE3639604A1 (de) * | 1986-11-20 | 1988-05-26 | Bbc Brown Boveri & Cie | Verfahren zur herstellung lotverstaerkter leiterbahnen |
US4805074A (en) * | 1987-03-20 | 1989-02-14 | Nitsuko Corporation | Solid electrolytic capacitor, and method of manufacturing same |
-
1989
- 1989-07-21 JP JP1190205A patent/JP2764745B2/ja not_active Expired - Lifetime
-
1990
- 1990-07-23 EP EP90308039A patent/EP0409668B1/de not_active Expired - Lifetime
- 1990-07-23 DE DE69016296T patent/DE69016296T2/de not_active Expired - Fee Related
- 1990-07-23 AT AT90308039T patent/ATE117869T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0409668A3 (en) | 1991-11-21 |
ATE117869T1 (de) | 1995-02-15 |
EP0409668A2 (de) | 1991-01-23 |
JPH0354853A (ja) | 1991-03-08 |
EP0409668B1 (de) | 1995-01-25 |
DE69016296D1 (de) | 1995-03-09 |
JP2764745B2 (ja) | 1998-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE59756T1 (de) | Verfahren zur herstellung von durchkontaktierten flexiblen leiterplatten fuer hohe biegebeanspruchung. | |
DE3278193D1 (en) | Method for fabricating multilayer laminated printed circuit boards | |
DE69203691T2 (de) | Zwei- oder mehrlagige Leiterplatte, Verfahren zur Herstellung von solchen Leiterplatten und Laminat für die Herstellung von solchen Leiterplatten durch ein solches Verfahren. | |
ATE42664T1 (de) | Verfahren zur herstellung von gedruckten schaltungen. | |
MC2169A1 (fr) | Resistance electrique sous forme de puce a montage de surface et son procede de fabrication | |
KR840000080A (ko) | 혼성집적회로부품 및 그 부착방법 | |
DE69016296D1 (de) | Mischleiterplatten und Verfahren zu ihrer Herstellung. | |
CA2073211A1 (en) | Method of manufacturing a rigid-flex printed wiring board | |
DE69026341D1 (de) | Verfahren zur Herstellung von Mehrschichtleiterplatten | |
DE69524364D1 (de) | Mehrzahl-Anschluss für elektronische Dickschichtkomponente und Herstellungsverfahren | |
DE69401195T2 (de) | Laminare Platte für die Herstellung von gedruckten Schaltungen, daraus hergestellte gedruckte Schaltung und Verfahren zu ihrer Herstellung | |
JPS56153797A (en) | Method of manufacturing multilayer printed circuit board substrate | |
DE59407670D1 (de) | Kern für elektrische Verbindungssubstrate und elektrische Verbindungssubstrate mit Kern, sowie Verfahren zu deren Herstellung | |
HK88996A (en) | Interconnection device between an integrated circuit and an electrical circuit and method of manufacturing the device | |
ATE79483T1 (de) | Duennschichtschaltung und ein verfahren zu ihrer herstellung. | |
DE69201823T2 (de) | Verbesserte Gleichförmigkeit beim Kupferätzen bei der Herstellung von mehrschichtig gedruckten Schaltungsplatinen. | |
SE8205343D0 (sv) | Sett att framstella elektroniska komponenter | |
EP0222618A3 (de) | Integrierte Mehrschichthybridschaltung und Verfahren zu deren Herstellung | |
JPS55118695A (en) | Copperrlined laminated board and multilayer printed circuit board using same and method of fabricating same | |
JPS56153796A (en) | Method of manufacturing multilayer printed circuit board substrate | |
JPS55113399A (en) | Method of fabricating multilayer printed circuit board | |
JPS55121696A (en) | Method of fabricating multilayer printed circuit board | |
RU93040934A (ru) | Способ изготовления печатных плат | |
JPS55120198A (en) | Multilayer printed circuit board and method of fabricating same | |
MY103155A (en) | Printed circuit boards and method for manufacturing printed circuit boards |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |