DE68923779D1 - Montier- und Kühlsystem für Leistungshalbleiteranordnungen. - Google Patents
Montier- und Kühlsystem für Leistungshalbleiteranordnungen.Info
- Publication number
- DE68923779D1 DE68923779D1 DE68923779T DE68923779T DE68923779D1 DE 68923779 D1 DE68923779 D1 DE 68923779D1 DE 68923779 T DE68923779 T DE 68923779T DE 68923779 T DE68923779 T DE 68923779T DE 68923779 D1 DE68923779 D1 DE 68923779D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- cooling system
- power semiconductor
- semiconductor arrangements
- arrangements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/291,780 US4965658A (en) | 1988-12-29 | 1988-12-29 | System for mounting and cooling power semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68923779D1 true DE68923779D1 (de) | 1995-09-14 |
DE68923779T2 DE68923779T2 (de) | 1996-02-22 |
Family
ID=23121800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68923779T Expired - Fee Related DE68923779T2 (de) | 1988-12-29 | 1989-11-27 | Montier- und Kühlsystem für Leistungshalbleiteranordnungen. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4965658A (de) |
EP (1) | EP0376478B1 (de) |
JP (1) | JP2828294B2 (de) |
KR (1) | KR970006207B1 (de) |
AU (1) | AU614888B2 (de) |
DE (1) | DE68923779T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5119175A (en) * | 1990-08-17 | 1992-06-02 | Westinghouse Electric Corp. | High power density solid-state, insulating coolant module |
US5825089A (en) * | 1991-05-01 | 1998-10-20 | Spectrian, Inc. | Low thermal resistance spring biased RF semiconductor package mounting structure |
US5825088A (en) * | 1991-05-01 | 1998-10-20 | Spectrian, Inc. | Low thermal resistance semiconductor package and mounting structure |
US5168425A (en) * | 1991-10-16 | 1992-12-01 | General Electric Company | Mounting arrangements for high voltage/high power semiconductors |
TW406454B (en) | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US5917703A (en) * | 1998-04-17 | 1999-06-29 | Advanced Interconnections Corporation | Integrated circuit intercoupling component with heat sink |
JP2001244391A (ja) * | 1999-12-21 | 2001-09-07 | Toyota Central Res & Dev Lab Inc | マルチチップモジュールの冷却構造 |
DE10022341B4 (de) * | 2000-05-08 | 2005-03-31 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Elektronisches Leistungsmodul |
DE10062108B4 (de) | 2000-12-13 | 2010-04-15 | Infineon Technologies Ag | Leistungsmodul mit verbessertem transienten Wärmewiderstand |
US8590329B2 (en) | 2004-12-22 | 2013-11-26 | Johnson Controls Technology Company | Medium voltage power controller |
US7353662B2 (en) * | 2004-12-22 | 2008-04-08 | York International Corporation | Medium voltage starter for a chiller unit |
US20080041081A1 (en) * | 2006-08-15 | 2008-02-21 | Bristol Compressors, Inc. | System and method for compressor capacity modulation in a heat pump |
US7628028B2 (en) * | 2005-08-03 | 2009-12-08 | Bristol Compressors International, Inc. | System and method for compressor capacity modulation |
US7393236B2 (en) * | 2005-09-02 | 2008-07-01 | Gm Global Technology Operations, Inc. | Integrated thermal and electrical connection system for power devices |
US20090103342A1 (en) * | 2007-10-17 | 2009-04-23 | Saul Lin | Silicon-controlled rectifier with a heat-dissipating structure |
BRMU8701723U2 (pt) * | 2007-11-01 | 2009-06-23 | Weg Automacao S A | disposição construtiva em chave de partida estática |
US8672642B2 (en) * | 2008-06-29 | 2014-03-18 | Bristol Compressors International, Inc. | System and method for starting a compressor |
US8601828B2 (en) | 2009-04-29 | 2013-12-10 | Bristol Compressors International, Inc. | Capacity control systems and methods for a compressor |
US9134137B2 (en) | 2010-12-17 | 2015-09-15 | Microsoft Technology Licensing, Llc | Mobile search based on predicted location |
DE102011004541B4 (de) * | 2011-02-22 | 2014-07-17 | Infineon Technologies Bipolar Gmbh & Co. Kg | Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls |
DE102015213916B4 (de) * | 2015-07-23 | 2021-07-08 | Siemens Aktiengesellschaft | Leistungshalbleitermodulanordnung |
JP7352830B2 (ja) * | 2019-12-04 | 2023-09-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652903A (en) * | 1971-02-01 | 1972-03-28 | Gen Electric | Fluid cooled pressure assembly |
FR2224875B1 (de) * | 1973-04-03 | 1978-10-27 | Thomson Csf | |
DE2364728A1 (de) * | 1973-12-27 | 1975-07-03 | Licentia Gmbh | Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung |
JPS53143174A (en) * | 1977-05-20 | 1978-12-13 | Hitachi Ltd | Mounting structure of disc form thyristor |
JPS5455171A (en) * | 1977-10-11 | 1979-05-02 | Mitsubishi Electric Corp | Semiconductor device |
DE2804348C2 (de) * | 1978-02-02 | 1991-05-29 | Brown, Boveri & Cie Ag, 6800 Mannheim | Rotierende Gleichrichteranordnung für die Erregung einer Synchronmaschine |
DE2813529A1 (de) * | 1978-03-29 | 1979-10-04 | Siemens Ag | Anordnung zur beidseitigen kuehlung von halbleiterbauelementen |
US4224663A (en) * | 1979-02-01 | 1980-09-23 | Power Control Corporation | Mounting assembly for semiconductive controlled rectifiers |
DE3005313C2 (de) * | 1980-02-13 | 1986-05-28 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiteranordnung |
JPS5799757A (en) * | 1980-12-12 | 1982-06-21 | Toshiba Corp | Flat type semiconductor element |
DE3143336A1 (de) * | 1981-10-31 | 1983-05-19 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitergleichrichterbaueinheit |
JPS6292348A (ja) * | 1985-10-17 | 1987-04-27 | Mitsubishi Electric Corp | 半導体スタツク装置 |
-
1988
- 1988-12-29 US US07/291,780 patent/US4965658A/en not_active Expired - Lifetime
-
1989
- 1989-11-27 EP EP89312261A patent/EP0376478B1/de not_active Expired - Lifetime
- 1989-11-27 AU AU45533/89A patent/AU614888B2/en not_active Ceased
- 1989-11-27 DE DE68923779T patent/DE68923779T2/de not_active Expired - Fee Related
- 1989-12-15 KR KR1019890018635A patent/KR970006207B1/ko not_active IP Right Cessation
- 1989-12-28 JP JP1345023A patent/JP2828294B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR910013467A (ko) | 1991-08-08 |
EP0376478A2 (de) | 1990-07-04 |
AU614888B2 (en) | 1991-09-12 |
AU4553389A (en) | 1990-07-05 |
EP0376478B1 (de) | 1995-08-09 |
US4965658A (en) | 1990-10-23 |
JP2828294B2 (ja) | 1998-11-25 |
JPH031565A (ja) | 1991-01-08 |
DE68923779T2 (de) | 1996-02-22 |
KR970006207B1 (ko) | 1997-04-24 |
EP0376478A3 (de) | 1991-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |