DE68915603D1 - BIC-Speicherzellenstruktur und Herstellungsverfahren dafür. - Google Patents
BIC-Speicherzellenstruktur und Herstellungsverfahren dafür.Info
- Publication number
- DE68915603D1 DE68915603D1 DE68915603T DE68915603T DE68915603D1 DE 68915603 D1 DE68915603 D1 DE 68915603D1 DE 68915603 T DE68915603 T DE 68915603T DE 68915603 T DE68915603 T DE 68915603T DE 68915603 D1 DE68915603 D1 DE 68915603D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- memory cell
- cell structure
- method therefor
- bic memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Dram (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63082746A JPH01253959A (ja) | 1988-04-04 | 1988-04-04 | 半導体装置の製造方法 |
JP8274788 | 1988-04-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68915603D1 true DE68915603D1 (de) | 1994-07-07 |
DE68915603T2 DE68915603T2 (de) | 1994-09-15 |
Family
ID=26423762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68915603T Expired - Fee Related DE68915603T2 (de) | 1988-04-04 | 1989-04-03 | BIC-Speicherzellenstruktur und Herstellungsverfahren dafür. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5075249A (de) |
EP (1) | EP0336679B1 (de) |
JP (1) | JP2506183B2 (de) |
KR (1) | KR920005323B1 (de) |
DE (1) | DE68915603T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234853A (en) * | 1990-03-05 | 1993-08-10 | Fujitsu Limited | Method of producing a high voltage MOS transistor |
US5404029A (en) * | 1990-04-12 | 1995-04-04 | Actel Corporation | Electrically programmable antifuse element |
EP0509631A1 (de) * | 1991-04-18 | 1992-10-21 | Actel Corporation | Antischmelzsicherungen mit minimalischen Oberflächen |
EP0510604A3 (de) * | 1991-04-23 | 2001-05-09 | Canon Kabushiki Kaisha | Halbleiteranordnung und Verfahren zu ihrer Herstellung |
US5581111A (en) * | 1993-07-07 | 1996-12-03 | Actel Corporation | Dielectric-polysilicon-dielectric antifuse for field programmable logic applications |
TW287313B (de) * | 1995-02-20 | 1996-10-01 | Matsushita Electric Ind Co Ltd | |
US5888858A (en) | 1996-01-20 | 1999-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US5909049A (en) * | 1997-02-11 | 1999-06-01 | Actel Corporation | Antifuse programmed PROM cell |
US5968851A (en) * | 1997-03-19 | 1999-10-19 | Cypress Semiconductor Corp. | Controlled isotropic etch process and method of forming an opening in a dielectric layer |
US6700151B2 (en) * | 2001-10-17 | 2004-03-02 | Kilopass Technologies, Inc. | Reprogrammable non-volatile memory using a breakdown phenomena in an ultra-thin dielectric |
US10090360B2 (en) * | 2015-02-13 | 2018-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing a semiconductor structure including a plurality of trenches |
CN108470676A (zh) * | 2018-04-04 | 2018-08-31 | 睿力集成电路有限公司 | 击穿式电熔丝结构及其形成方法、半导体器件 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3969150A (en) * | 1973-12-03 | 1976-07-13 | Fairchild Camera And Instrument Corporation | Method of MOS transistor manufacture |
US4288256A (en) * | 1977-12-23 | 1981-09-08 | International Business Machines Corporation | Method of making FET containing stacked gates |
US4282647A (en) * | 1978-04-04 | 1981-08-11 | Standard Microsystems Corporation | Method of fabricating high density refractory metal gate MOS integrated circuits utilizing the gate as a selective diffusion and oxidation mask |
US4442591A (en) * | 1982-02-01 | 1984-04-17 | Texas Instruments Incorporated | High-voltage CMOS process |
US4453325A (en) * | 1982-06-24 | 1984-06-12 | Ofsowitz Warwick N | Advertising display means for parking meter and the like |
US4388147A (en) * | 1982-08-16 | 1983-06-14 | Intel Corporation | Method for steam leaching phosphorus from phosphosilicate glass during semiconductor fabrication |
US4498224A (en) * | 1982-12-23 | 1985-02-12 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of manufacturing a MOSFET using accelerated ions to form an amorphous region |
JPH0693494B2 (ja) * | 1984-03-16 | 1994-11-16 | 株式会社日立製作所 | 半導体集積回路装置の製造方法 |
JPH073855B2 (ja) * | 1985-07-26 | 1995-01-18 | 富士通株式会社 | 半導体装置の製造方法 |
JPS62128557A (ja) * | 1985-11-29 | 1987-06-10 | Fujitsu Ltd | 半導体記憶装置とその書込み方法 |
JPS62128556A (ja) * | 1985-11-29 | 1987-06-10 | Fujitsu Ltd | 半導体装置 |
JPS62130525A (ja) * | 1985-11-30 | 1987-06-12 | Fujitsu Ltd | 半導体集積回路の製法 |
JPS62130559A (ja) * | 1985-11-30 | 1987-06-12 | Fujitsu Ltd | 集積回路素子の製法 |
-
1989
- 1989-03-31 US US07/331,193 patent/US5075249A/en not_active Expired - Fee Related
- 1989-04-03 EP EP89303271A patent/EP0336679B1/de not_active Expired - Lifetime
- 1989-04-03 DE DE68915603T patent/DE68915603T2/de not_active Expired - Fee Related
- 1989-04-03 JP JP1084611A patent/JP2506183B2/ja not_active Expired - Lifetime
- 1989-04-04 KR KR1019890004459A patent/KR920005323B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR890016676A (ko) | 1989-11-29 |
US5075249A (en) | 1991-12-24 |
EP0336679B1 (de) | 1994-06-01 |
EP0336679A2 (de) | 1989-10-11 |
DE68915603T2 (de) | 1994-09-15 |
JPH02153566A (ja) | 1990-06-13 |
JP2506183B2 (ja) | 1996-06-12 |
EP0336679A3 (de) | 1991-09-25 |
KR920005323B1 (ko) | 1992-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |