DE60322035D1 - Mems-baustein und verfahren zu seiner herstellung, optischer modulator, glv-baustein und verfahren zu seiner herstellung und laseranzeige - Google Patents

Mems-baustein und verfahren zu seiner herstellung, optischer modulator, glv-baustein und verfahren zu seiner herstellung und laseranzeige

Info

Publication number
DE60322035D1
DE60322035D1 DE60322035T DE60322035T DE60322035D1 DE 60322035 D1 DE60322035 D1 DE 60322035D1 DE 60322035 T DE60322035 T DE 60322035T DE 60322035 T DE60322035 T DE 60322035T DE 60322035 D1 DE60322035 D1 DE 60322035D1
Authority
DE
Germany
Prior art keywords
production
block
glv
optical modulator
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60322035T
Other languages
English (en)
Inventor
Hiroto Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE60322035D1 publication Critical patent/DE60322035D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0808—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more diffracting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0083—Optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
DE60322035T 2002-02-19 2003-02-17 Mems-baustein und verfahren zu seiner herstellung, optischer modulator, glv-baustein und verfahren zu seiner herstellung und laseranzeige Expired - Lifetime DE60322035D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002042029A JP3558066B2 (ja) 2002-02-19 2002-02-19 Ｍｅｍｓ素子とその製造方法、光変調素子、ｇｌｖデバイスとその製造方法、及びレーザディスプレイ
PCT/JP2003/001659 WO2003071334A1 (fr) 2002-02-19 2003-02-17 Dispositif mems et son procede de fabrication, modulateur optique, dispositif glv et son procede de fabrication, et ecran a laser

Publications (1)

Publication Number Publication Date
DE60322035D1 true DE60322035D1 (de) 2008-08-21

Family

ID=27750481

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60322035T Expired - Lifetime DE60322035D1 (de) 2002-02-19 2003-02-17 Mems-baustein und verfahren zu seiner herstellung, optischer modulator, glv-baustein und verfahren zu seiner herstellung und laseranzeige

Country Status (7)

Country Link
US (1) US7102808B2 (de)
EP (1) EP1486815B1 (de)
JP (1) JP3558066B2 (de)
KR (1) KR100974480B1 (de)
DE (1) DE60322035D1 (de)
TW (1) TW591257B (de)
WO (1) WO2003071334A1 (de)

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FR2864634B1 (fr) * 2003-12-26 2006-02-24 Commissariat Energie Atomique Composants optiques et leur procede de realisation
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US7417783B2 (en) 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
US7373026B2 (en) * 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
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US7684104B2 (en) 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
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US7463403B1 (en) * 2005-04-22 2008-12-09 Silicon Light Machines Corporation High impedance drive circuit for a micro-electromechanical system device
US7474171B2 (en) * 2005-06-01 2009-01-06 Raytheon Company Method and apparatus for reducing dielectric charging in MEMS structures
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US20070052671A1 (en) * 2005-09-02 2007-03-08 Hewlett-Packard Development Company Lp Pixel element actuation
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7762463B2 (en) * 2006-01-05 2010-07-27 Lockheed Martin Corporation MEMS-based security system
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7652814B2 (en) 2006-01-27 2010-01-26 Qualcomm Mems Technologies, Inc. MEMS device with integrated optical element
US7547568B2 (en) * 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
US7643203B2 (en) 2006-04-10 2010-01-05 Qualcomm Mems Technologies, Inc. Interferometric optical display system with broadband characteristics
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US7369292B2 (en) 2006-05-03 2008-05-06 Qualcomm Mems Technologies, Inc. Electrode and interconnect materials for MEMS devices
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7706042B2 (en) 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US8068268B2 (en) 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
US7863079B2 (en) 2008-02-05 2011-01-04 Qualcomm Mems Technologies, Inc. Methods of reducing CD loss in a microelectromechanical device
JP5341874B2 (ja) * 2008-02-29 2013-11-13 日本電信電話株式会社 Ｍｅｍｓデバイスとその製造方法
US8133774B2 (en) * 2009-03-26 2012-03-13 International Business Machines Corporation SOI radio frequency switch with enhanced electrical isolation
US8865497B2 (en) 2010-06-25 2014-10-21 International Business Machines Corporation Planar cavity MEMS and related structures, methods of manufacture and design structures
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
RU2501052C1 (ru) * 2012-03-27 2013-12-10 Открытое акционерное общество "Российская корпорация ракетно-космического приборостроения и информационных систем" (ОАО "Российские космические системы") Микросистема оптического излучения
CN103964364B (zh) * 2013-01-29 2016-12-28 中国科学院微电子研究所 微纳尺度静电力开关及其制造方法
CN104058363B (zh) * 2013-03-22 2016-01-20 上海丽恒光微电子科技有限公司 基于mems透射光阀的显示装置及其形成方法
US10133428B2 (en) * 2015-05-29 2018-11-20 Samsung Display Co., Ltd. Flexible display device including a flexible substrate having a bending part and a conductive pattern at least partially disposed on the bending part
JP6908064B2 (ja) * 2019-03-14 2021-07-21 セイコーエプソン株式会社 時計用部品、時計用ムーブメントおよび時計
JP7238657B2 (ja) 2019-07-16 2023-03-14 セイコーエプソン株式会社 時計用部品、時計用ムーブメントおよび時計

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Also Published As

Publication number Publication date
US20040150869A1 (en) 2004-08-05
WO2003071334A1 (fr) 2003-08-28
KR20040084638A (ko) 2004-10-06
JP2003241122A (ja) 2003-08-27
EP1486815B1 (de) 2008-07-09
EP1486815A1 (de) 2004-12-15
JP3558066B2 (ja) 2004-08-25
TW591257B (en) 2004-06-11
US7102808B2 (en) 2006-09-05
KR100974480B1 (ko) 2010-08-10
EP1486815A4 (de) 2005-08-24
TW200402552A (en) 2004-02-16

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