DE60317902D1 - Verfahren zur herstellung von löchern in polymersubstraten - Google Patents

Verfahren zur herstellung von löchern in polymersubstraten

Info

Publication number
DE60317902D1
DE60317902D1 DE60317902T DE60317902T DE60317902D1 DE 60317902 D1 DE60317902 D1 DE 60317902D1 DE 60317902 T DE60317902 T DE 60317902T DE 60317902 T DE60317902 T DE 60317902T DE 60317902 D1 DE60317902 D1 DE 60317902D1
Authority
DE
Germany
Prior art keywords
polymer substrates
producing holes
holes
producing
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60317902T
Other languages
English (en)
Other versions
DE60317902T2 (de
Inventor
Kevin C Olson
Alan E Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
PPG Industries Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Ohio Inc filed Critical PPG Industries Ohio Inc
Publication of DE60317902D1 publication Critical patent/DE60317902D1/de
Application granted granted Critical
Publication of DE60317902T2 publication Critical patent/DE60317902T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE60317902T 2002-06-27 2003-06-27 Verfahren zur herstellung von löchern in polymersubstraten Expired - Lifetime DE60317902T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US183674 2002-06-27
US10/183,674 US6824959B2 (en) 2002-06-27 2002-06-27 Process for creating holes in polymeric substrates
PCT/US2003/020477 WO2004004430A1 (en) 2002-06-27 2003-06-27 Process for creating holes in polymeric substrates

Publications (2)

Publication Number Publication Date
DE60317902D1 true DE60317902D1 (de) 2008-01-17
DE60317902T2 DE60317902T2 (de) 2008-10-23

Family

ID=29779180

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60317902T Expired - Lifetime DE60317902T2 (de) 2002-06-27 2003-06-27 Verfahren zur herstellung von löchern in polymersubstraten

Country Status (11)

Country Link
US (1) US6824959B2 (de)
EP (1) EP1523868B1 (de)
JP (3) JP4411410B2 (de)
KR (1) KR100659808B1 (de)
CN (1) CN1672472A (de)
AU (1) AU2003245746A1 (de)
DE (1) DE60317902T2 (de)
ES (1) ES2297175T3 (de)
MY (1) MY134327A (de)
TW (1) TWI228953B (de)
WO (1) WO2004004430A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050153107A1 (en) * 2004-01-12 2005-07-14 Tdk Corporation Substrate having functional layer pattern formed thereon and method of forming functional layer pattern
US7271697B2 (en) * 2004-12-07 2007-09-18 Multi-Fineline Electronix Miniature circuitry and inductive components and methods for manufacturing same
KR100738055B1 (ko) * 2005-05-18 2007-07-12 삼성에스디아이 주식회사 전자소자의 적층 형성 방법 및 이를 이용한 ｆｅｄ의제조방법
US8008188B2 (en) 2007-06-11 2011-08-30 Ppg Industries Ohio, Inc. Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
US8637778B2 (en) 2010-04-08 2014-01-28 Intel Corporation Debond interconnect structures

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US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
FR2041471A5 (en) 1969-04-25 1971-01-29 Cii Multi-layer circuits with thermosetting - dielectric
US3984299A (en) 1970-06-19 1976-10-05 Ppg Industries, Inc. Process for electrodepositing cationic compositions
US3738835A (en) 1971-10-21 1973-06-12 Ibm Electrophoretic photoresist composition and a method of forming etch resistant masks
US3947338A (en) 1971-10-28 1976-03-30 Ppg Industries, Inc. Method of electrodepositing self-crosslinking cationic compositions
US3793278A (en) 1972-03-10 1974-02-19 Ppg Industries Inc Method of preparing sulfonium group containing compositions
US3833436A (en) 1972-09-05 1974-09-03 Buckbee Mears Co Etching of polyimide films
DE2707405C3 (de) 1976-07-19 1987-12-03 Vianova Kunstharz Ag, Werndorf Verfahren zur Herstellung von Bindemitteln für die Elektrotauchlackierung
US4343885A (en) 1978-05-09 1982-08-10 Dynachem Corporation Phototropic photosensitive compositions containing fluoran colorformer
JPS5527647A (en) 1978-08-17 1980-02-27 Nippon Telegraph & Telephone Paint for forming insulating film of conductive printed circuit board and method of forming insulating film
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JPS56136416A (en) * 1980-03-27 1981-10-24 Matsushita Electric Works Ltd Limit switch
US4378264A (en) 1980-05-27 1983-03-29 E. I. Du Pont De Nemours And Company Integrated laminating process
JPS58108229A (ja) 1981-12-21 1983-06-28 Hitachi Ltd ポリイミド系樹脂膜の選択エツチング方法
JPS59133232A (ja) 1983-01-21 1984-07-31 Hitachi Ltd ポリイミドのエツチング方法
GB8327756D0 (en) 1983-10-17 1983-11-16 Ici Plc Extraction process
US4508749A (en) 1983-12-27 1985-04-02 International Business Machines Corporation Patterning of polyimide films with ultraviolet light
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JPH0287590A (ja) 1988-09-22 1990-03-28 Shindo Denshi Kogyo Kk フイルム回路基板の貫通穴形成方法
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US5229550A (en) 1990-10-30 1993-07-20 International Business Machines Corporation Encapsulated circuitized power core alignment and lamination
US5298685A (en) 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5153986A (en) 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5242780A (en) 1991-10-18 1993-09-07 Industrial Technology Research Institute Electrophoretic positive working photosensitive composition comprising as the photosensitive ingredient an aliphatic polyester having o-quinone diazide on the side chain and end groups
US5227008A (en) 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
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JPH05320313A (ja) 1992-05-27 1993-12-03 Murata Mfg Co Ltd 電子部品封止用樹脂組成物
JPH05343837A (ja) 1992-06-05 1993-12-24 Taiyo Ink Mfg Ltd ソルダーレジストインキ組成物及びソルダーレジストパターン形成方法
JPH06268378A (ja) 1993-03-12 1994-09-22 Oki Electric Ind Co Ltd 多層配線基板のビアホールの形成方法
US5600035A (en) 1994-07-13 1997-02-04 Ppg Industries, Inc. Positive photoactive compounds based on 2,6-dinitro benzyl groups and 2,5-dinitro benzyl groups
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JPH09148748A (ja) * 1995-11-20 1997-06-06 Taiyo Ink Mfg Ltd 多層プリント配線板及びその製造方法並びにそれに用いる樹脂絶縁層形成用組成物
US6117931A (en) * 1996-07-01 2000-09-12 Basf Corporation Curable coating compositions having improved effect pigment orientation and a method of using the same
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JPH1171501A (ja) 1997-08-29 1999-03-16 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JP3339387B2 (ja) 1997-11-07 2002-10-28 日立電線株式会社 Ｔａｂ用テープの製造方法
JP3067021B2 (ja) 1998-09-18 2000-07-17 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 両面配線基板の製造方法
JP4257877B2 (ja) * 1998-10-08 2009-04-22 関西ペイント株式会社 塗料組成物
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JP4685236B2 (ja) * 2000-12-13 2011-05-18 三菱レイヨン株式会社 熱硬化性被覆組成物

Also Published As

Publication number Publication date
TWI228953B (en) 2005-03-01
MY134327A (en) 2007-12-31
CN1672472A (zh) 2005-09-21
JP4411410B2 (ja) 2010-02-10
JP2005531162A (ja) 2005-10-13
ES2297175T3 (es) 2008-05-01
TW200414848A (en) 2004-08-01
WO2004004430A1 (en) 2004-01-08
DE60317902T2 (de) 2008-10-23
US6824959B2 (en) 2004-11-30
JP2010118708A (ja) 2010-05-27
EP1523868A1 (de) 2005-04-20
KR20050006301A (ko) 2005-01-15
US20040000426A1 (en) 2004-01-01
JP2007027786A (ja) 2007-02-01
EP1523868B1 (de) 2007-12-05
AU2003245746A1 (en) 2004-01-19
KR100659808B1 (ko) 2006-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition