DE60316746D1 - Keramischer Suszeptor - Google Patents

Keramischer Suszeptor

Info

Publication number
DE60316746D1
DE60316746D1 DE60316746T DE60316746T DE60316746D1 DE 60316746 D1 DE60316746 D1 DE 60316746D1 DE 60316746 T DE60316746 T DE 60316746T DE 60316746 T DE60316746 T DE 60316746T DE 60316746 D1 DE60316746 D1 DE 60316746D1
Authority
DE
Germany
Prior art keywords
ceramic susceptor
susceptor
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60316746T
Other languages
English (en)
Other versions
DE60316746T2 (de
Inventor
Akira Kuibira
Masuhiro Natsuhara
Hirohiko Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE60316746D1 publication Critical patent/DE60316746D1/de
Publication of DE60316746T2 publication Critical patent/DE60316746T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
DE60316746T 2002-04-24 2003-04-15 Keramischer Suszeptor Expired - Fee Related DE60316746T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002121616A JP2003317906A (ja) 2002-04-24 2002-04-24 セラミックスヒータ
JP2002121616 2002-04-24

Publications (2)

Publication Number Publication Date
DE60316746D1 true DE60316746D1 (de) 2007-11-22
DE60316746T2 DE60316746T2 (de) 2008-02-07

Family

ID=29243592

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60316746T Expired - Fee Related DE60316746T2 (de) 2002-04-24 2003-04-15 Keramischer Suszeptor

Country Status (8)

Country Link
US (2) US6806443B2 (de)
EP (1) EP1363316B1 (de)
JP (1) JP2003317906A (de)
KR (1) KR100551643B1 (de)
CN (1) CN1225342C (de)
CA (1) CA2424507C (de)
DE (1) DE60316746T2 (de)
TW (1) TWI236527B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7394043B2 (en) * 2002-04-24 2008-07-01 Sumitomo Electric Industries, Ltd. Ceramic susceptor
JP2003317906A (ja) * 2002-04-24 2003-11-07 Sumitomo Electric Ind Ltd セラミックスヒータ
KR100478744B1 (ko) * 2002-05-02 2005-03-28 주성엔지니어링(주) 서셉터 및 이의 제조방법
US7283346B2 (en) * 2002-12-26 2007-10-16 Mitsubishi Heavy Industries, Ltd. Electrostatic chuck and its manufacturing method
JP4756695B2 (ja) 2006-02-20 2011-08-24 コバレントマテリアル株式会社 面状ヒータ
DE102007016029A1 (de) * 2007-03-30 2008-10-02 Sig Technology Ag Haltevorrichtung für eine CVD- oder PVD-Beschichtungsanlage
KR101477142B1 (ko) * 2013-09-13 2014-12-29 (주)티티에스 기판 지지대 및 이를 구비하는 기판 지지 장치.
JP1541874S (de) * 2015-03-16 2016-01-18
US10636690B2 (en) * 2016-07-20 2020-04-28 Applied Materials, Inc. Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing
US10679873B2 (en) * 2016-09-30 2020-06-09 Ngk Spark Plug Co., Ltd. Ceramic heater
DE102017121045A1 (de) * 2017-05-24 2018-11-29 Webasto SE Heizgerät sowie Verfahren zur Herstellung eines solchen
JP7018744B2 (ja) * 2017-11-24 2022-02-14 昭和電工株式会社 ＳｉＣエピタキシャル成長装置
CN109738481A (zh) * 2018-11-27 2019-05-10 武汉嘉仪通科技有限公司 一种薄膜材料的赛贝克系数测量装置及方法
CN112822798B (zh) * 2020-12-31 2022-11-25 博宇（天津）半导体材料有限公司 一种立式陶瓷加热器
CN116120085A (zh) * 2023-02-14 2023-05-16 广东工业大学 一种等离子表面刻蚀结合玻璃陶瓷连接SiC陶瓷的方法及其制得的陶瓷连接件和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69111493T2 (de) * 1990-03-12 1996-03-21 Ngk Insulators Ltd Wafer-Heizgeräte für Apparate, zur Halbleiterherstellung Heizanlage mit diesen Heizgeräten und Herstellung von Heizgeräten.
US6133557A (en) * 1995-01-31 2000-10-17 Kyocera Corporation Wafer holding member
JP3477062B2 (ja) 1997-12-26 2003-12-10 京セラ株式会社 ウエハ加熱装置
JPH11260534A (ja) * 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
JP4166345B2 (ja) * 1998-10-07 2008-10-15 日本碍子株式会社 塩素系ガスに対する耐蝕性部材
JP3381909B2 (ja) 1999-08-10 2003-03-04 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
JP3222121B2 (ja) 1999-10-22 2001-10-22 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
JP2001196152A (ja) * 2000-01-13 2001-07-19 Sumitomo Electric Ind Ltd セラミックスヒータ
JP2001203257A (ja) * 2000-01-20 2001-07-27 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体
JP2003317906A (ja) * 2002-04-24 2003-11-07 Sumitomo Electric Ind Ltd セラミックスヒータ

Also Published As

Publication number Publication date
DE60316746T2 (de) 2008-02-07
US20050000956A1 (en) 2005-01-06
KR20030084683A (ko) 2003-11-01
US20030201264A1 (en) 2003-10-30
CN1453095A (zh) 2003-11-05
US6806443B2 (en) 2004-10-19
CA2424507C (en) 2005-07-12
US6946625B2 (en) 2005-09-20
TWI236527B (en) 2005-07-21
CA2424507A1 (en) 2003-10-24
EP1363316A3 (de) 2004-01-02
KR100551643B1 (ko) 2006-02-14
EP1363316B1 (de) 2007-10-10
EP1363316A2 (de) 2003-11-19
TW200406566A (en) 2004-05-01
CN1225342C (zh) 2005-11-02
JP2003317906A (ja) 2003-11-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee