DE60309467D1 - Sichtungs-SYSTEM - Google Patents

Sichtungs-SYSTEM

Info

Publication number
DE60309467D1
DE60309467D1 DE60309467T DE60309467T DE60309467D1 DE 60309467 D1 DE60309467 D1 DE 60309467D1 DE 60309467 T DE60309467 T DE 60309467T DE 60309467 T DE60309467 T DE 60309467T DE 60309467 D1 DE60309467 D1 DE 60309467D1
Authority
DE
Germany
Prior art keywords
screener system
screener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60309467T
Other languages
English (en)
Other versions
DE60309467T2 (de
Inventor
Iraj Sadighi
C Hudgens
R Rice
E Wyka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE60309467D1 publication Critical patent/DE60309467D1/de
Application granted granted Critical
Publication of DE60309467T2 publication Critical patent/DE60309467T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE60309467T 2002-04-19 2003-04-18 Sichtungs-System Expired - Lifetime DE60309467T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/126,493 US7085622B2 (en) 2002-04-19 2002-04-19 Vision system
US126493 2002-04-19
PCT/US2003/012288 WO2004017387A2 (en) 2002-04-19 2003-04-18 Vision system

Publications (2)

Publication Number Publication Date
DE60309467D1 true DE60309467D1 (de) 2006-12-14
DE60309467T2 DE60309467T2 (de) 2007-09-20

Family

ID=29215040

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60309467T Expired - Lifetime DE60309467T2 (de) 2002-04-19 2003-04-18 Sichtungs-System

Country Status (8)

Country Link
US (1) US7085622B2 (de)
EP (1) EP1514094B1 (de)
JP (1) JP4703187B2 (de)
KR (1) KR101011076B1 (de)
CN (1) CN1653326B (de)
AU (1) AU2003285810A1 (de)
DE (1) DE60309467T2 (de)
WO (1) WO2004017387A2 (de)

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CN114450780A (zh) * 2019-07-29 2022-05-06 朗姆研究公司 用于衬底处理***的自动化控制及检测的集成式硬件-软件计算机视觉***
US11164769B2 (en) * 2019-07-30 2021-11-02 Brooks Automation, Inc. Robot embedded vision apparatus
CN111239139B (zh) * 2020-01-21 2020-11-03 珠海锐翔智能科技有限公司 双工位fpc补材偏移、重贴/漏贴检查机
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CN117664862B (zh) * 2024-01-31 2024-06-18 宁德时代新能源科技股份有限公司 极耳检测***和极耳检测方法

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Also Published As

Publication number Publication date
US7085622B2 (en) 2006-08-01
EP1514094B1 (de) 2006-11-02
CN1653326B (zh) 2011-08-17
CN1653326A (zh) 2005-08-10
KR101011076B1 (ko) 2011-01-25
WO2004017387A3 (en) 2004-04-08
EP1514094A2 (de) 2005-03-16
AU2003285810A1 (en) 2004-03-03
AU2003285810A8 (en) 2004-03-03
KR20040101540A (ko) 2004-12-02
JP2005525709A (ja) 2005-08-25
JP4703187B2 (ja) 2011-06-15
WO2004017387A2 (en) 2004-02-26
DE60309467T2 (de) 2007-09-20
US20030198376A1 (en) 2003-10-23

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