DE60303066D1 - Prüfspitze für integrierte Schaltungen - Google Patents

Prüfspitze für integrierte Schaltungen

Info

Publication number
DE60303066D1
DE60303066D1 DE60303066T DE60303066T DE60303066D1 DE 60303066 D1 DE60303066 D1 DE 60303066D1 DE 60303066 T DE60303066 T DE 60303066T DE 60303066 T DE60303066 T DE 60303066T DE 60303066 D1 DE60303066 D1 DE 60303066D1
Authority
DE
Germany
Prior art keywords
probe
integrated circuits
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60303066T
Other languages
English (en)
Other versions
DE60303066T2 (de
Inventor
William Y Sinclair
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aries Electronics Inc
Original Assignee
Aries Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aries Electronics Inc filed Critical Aries Electronics Inc
Application granted granted Critical
Publication of DE60303066D1 publication Critical patent/DE60303066D1/de
Publication of DE60303066T2 publication Critical patent/DE60303066T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
DE60303066T 2002-07-18 2003-07-11 Prüfspitze für integrierte Schaltungen Expired - Lifetime DE60303066T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39722302P 2002-07-18 2002-07-18
US397223P 2002-07-18

Publications (2)

Publication Number Publication Date
DE60303066D1 true DE60303066D1 (de) 2006-03-30
DE60303066T2 DE60303066T2 (de) 2006-08-31

Family

ID=30000994

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60303066T Expired - Lifetime DE60303066T2 (de) 2002-07-18 2003-07-11 Prüfspitze für integrierte Schaltungen

Country Status (4)

Country Link
US (1) US6844749B2 (de)
EP (1) EP1385011B1 (de)
JP (1) JP4328145B2 (de)
DE (1) DE60303066T2 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6937045B2 (en) * 2002-07-18 2005-08-30 Aries Electronics, Inc. Shielded integrated circuit probe
JP4037434B2 (ja) * 2003-03-18 2008-01-23 信越ポリマー株式会社 圧接挟持型コネクタ
JP4242199B2 (ja) * 2003-04-25 2009-03-18 株式会社ヨコオ Ｉｃソケット
JP2004325306A (ja) * 2003-04-25 2004-11-18 Yokowo Co Ltd 検査用同軸プローブおよびそれを用いた検査ユニット
KR100600482B1 (ko) * 2004-06-22 2006-07-13 삼성전자주식회사 반도체 패키지 측정용 프로브
US7626408B1 (en) * 2005-02-03 2009-12-01 KK Technologies, Inc. Electrical spring probe
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
US20090218321A1 (en) * 2006-02-14 2009-09-03 Intelifuse, Inc. Shape Memory Implant Heating Device
US7545159B2 (en) * 2006-06-01 2009-06-09 Rika Denshi America, Inc. Electrical test probes with a contact element, methods of making and using the same
US7535241B2 (en) * 2006-10-30 2009-05-19 Aries Electronics, Inc. Test probe with hollow tubular contact with bullet-nosed configuration at one end and crimped configuration on other end
FI121100B (fi) * 2006-11-10 2010-06-30 Yokowo Seisakusho Kk Releliitin
KR100769891B1 (ko) * 2007-01-25 2007-10-24 리노공업주식회사 검사용 탐침 장치 및 이를 이용한 검사용 소켓
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
TW200918917A (en) * 2007-10-16 2009-05-01 Compal Electronics Inc Testing probe and electrical connection method using the same
DE102008004162A1 (de) 2008-01-14 2009-07-23 Yamaichi Electronics Deutschland Gmbh Anschlußkontakt, IC Testsockel und Verfahren
JPWO2009102029A1 (ja) * 2008-02-14 2011-06-16 日本発條株式会社 コンタクトプローブおよびプローブユニット
JP5166176B2 (ja) * 2008-09-04 2013-03-21 スリーエム イノベイティブ プロパティズ カンパニー 電子デバイス用ソケット
JP4900843B2 (ja) 2008-12-26 2012-03-21 山一電機株式会社 半導体装置用電気接続装置及びそれに使用されるコンタクト
US7874880B2 (en) * 2009-02-26 2011-01-25 Ironwood Electronics, Inc. Adapter apparatus with sleeve spring contacts
WO2010140184A1 (ja) * 2009-06-01 2010-12-09 有限会社電材マート プローブ及びプローブ装置
US8430676B2 (en) * 2009-08-10 2013-04-30 Sv Probe Pte. Ltd. Modular space transformer for fine pitch vertical probing applications
US9404941B2 (en) * 2010-06-25 2016-08-02 Nhk Spring Co., Ltd. Contact probe and probe unit
FR2971892A1 (fr) 2011-02-22 2012-08-24 Souriau Contact electrique et ensemble connecteur a fort nombre de manoeuvres
JP5462231B2 (ja) * 2011-10-24 2014-04-02 ヒロセ電機株式会社 電気コネクタ組立体
US9182425B2 (en) 2012-05-21 2015-11-10 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Probe supporting and aligning apparatus
TWM461790U (zh) * 2013-04-26 2013-09-11 De-Xing Xiao 具弧狀接觸稜線之測試探針
US9887478B2 (en) * 2015-04-21 2018-02-06 Varian Semiconductor Equipment Associates, Inc. Thermally insulating electrical contact probe
GB2539964A (en) * 2015-07-03 2017-01-04 Sevcon Ltd Electronics assembly
US10274515B1 (en) * 2015-08-07 2019-04-30 Johnstech International Corporation Waveguide integrated testing
US9899193B1 (en) 2016-11-02 2018-02-20 Varian Semiconductor Equipment Associates, Inc. RF ion source with dynamic volume control
CN109212283A (zh) * 2018-09-26 2019-01-15 昆山鑫润利自动化科技有限公司 Vswr测试用探针模组定位结构
DE102018123995A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
US11043484B1 (en) 2019-03-22 2021-06-22 Xilinx, Inc. Method and apparatus of package enabled ESD protection
CN111157884A (zh) * 2020-01-03 2020-05-15 中广核工程有限公司 继电器电阻测量***及方法
TW202141046A (zh) * 2020-04-29 2021-11-01 立錡科技股份有限公司 探針結構以及感測治具
US11539167B2 (en) 2020-09-17 2022-12-27 Carlisle Interconnect Technologies, Inc. Adjustable push on connector/adaptor
US11502440B2 (en) * 2020-10-23 2022-11-15 Carlisle Interconnect Technologies, Inc. Multiport connector interface system
JP2022079959A (ja) * 2020-11-17 2022-05-27 山一電機株式会社 検査用ソケット
CN113125811B (zh) * 2021-03-05 2024-03-26 深圳市福浪电子有限公司 一种晶振测试装置
CN115877169A (zh) * 2021-09-27 2023-03-31 史密斯互连美洲公司 用于半导体集成电路的具有阶梯环的测试插座和探针
CN113933687B (zh) * 2021-10-13 2022-08-19 深圳宇凡微电子有限公司 便捷测试座及其测试方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
US4783624A (en) * 1986-04-14 1988-11-08 Interconnect Devices, Inc. Contact probe devices and method
EP0294696A3 (de) * 1987-06-10 1989-04-26 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Federkontaktstift
US5009613A (en) * 1990-05-01 1991-04-23 Interconnect Devices, Inc. Spring contact twister probe for testing electrical printed circuit boards
US5204615A (en) * 1991-10-24 1993-04-20 Interconnect Devices, Inc. Module attachment for printed circuit board test fixtures
US5225773A (en) * 1992-02-26 1993-07-06 Interconnect Devices, Inc. Switch probe
US5557213A (en) * 1994-12-01 1996-09-17 Everett Charles Technologies, Inc. Spring-loaded electrical contact probe
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
US5877554A (en) * 1997-11-03 1999-03-02 Advanced Interconnections Corp. Converter socket terminal
US6104205A (en) * 1998-02-26 2000-08-15 Interconnect Devices, Inc. Probe with tab retainer
US6020635A (en) * 1998-07-07 2000-02-01 Advanced Interconnections Corporation Converter socket terminal
AU1729800A (en) * 1998-11-25 2000-06-13 Rika Electronics International, Inc. Electrical contact system
US6341962B1 (en) * 1999-10-29 2002-01-29 Aries Electronics, Inc. Solderless grid array connector
DE19983903T1 (de) 1999-11-17 2002-02-28 Advantest Corp IC-Sockel und IC-Testgerät
TWI243244B (en) 2000-06-28 2005-11-11 Nhk Spring Co Ltd Conductive contact member
JP2002090386A (ja) 2000-09-18 2002-03-27 Fuji Photo Film Co Ltd プリント基板検査用コンタクトピン
US6685492B2 (en) * 2001-12-27 2004-02-03 Rika Electronics International, Inc. Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition
US6696850B1 (en) * 2002-10-02 2004-02-24 Interconnect Devices, Inc. Contact probe with off-centered back-drilled aperture

Also Published As

Publication number Publication date
JP2004251884A (ja) 2004-09-09
DE60303066T2 (de) 2006-08-31
US6844749B2 (en) 2005-01-18
US20040012402A1 (en) 2004-01-22
EP1385011A1 (de) 2004-01-28
EP1385011B1 (de) 2006-01-04
JP4328145B2 (ja) 2009-09-09

Similar Documents

Publication Publication Date Title
DE60303066D1 (de) Prüfspitze für integrierte Schaltungen
DE60216268D1 (de) Eingebaute Selbsttestschaltung für integrierte Schaltungen
DE602006016445D1 (de) Testsockel für integrierte schaltungen
DE60109386D1 (de) Sondenkarte zur Prüfung integrierter Schaltungen
AU2003245273A1 (en) Probe card for testing integrated circuits
DE60322826D1 (de) Integrierte Schaltung
NO20030193D0 (no) Testremsedeler
DE60308707D1 (de) Messkonstruktion für chirurgusche geräten
DE60324650D1 (de) Positioniervorrichtung für NMR-kompatible Biopsievorrichtung
DE60233985D1 (de) Testverfahren für Halbleiterspeicher
DE602004007503D1 (de) REKONFIGURIERBARE ARCHITEKTUR FÜR SOCs
DE60235386D1 (de) Ladevorrichtung für v-motor
DE60314969D1 (de) Hochleistungskontaktlöcher für vertikale Packung integrierter Schaltungen
DE60336123D1 (de) Heftinstrument
DE60230568D1 (de) Integrierte Radiofrequenz-Schaltkreise
ATE335426T1 (de) Ausziehführungsgarnitur für schubladen
DE50209663D1 (de) Gehäuse für Strömungsmaschinen
DE602004031698D1 (de) Integrierte Halbleiterschaltung
DE50302897D1 (de) Anschlusseinrichtung für ein elektrochirurgisches instrument
DE60302361D1 (de) Schieberegister für sequentiellen fuse-latch-betrieb
DE602004008186D1 (de) Kontaktloses Prüfen integrierter Schaltungen
DE50304589D1 (de) Testvorrichtung für bauteile integrierter schaltungen
DE60307425D1 (de) Schaltung für logische operationen und verfahren für logische operationen
DE60224306D1 (de) Bohrvorrichtung für erdbohrer
DE10197150T1 (de) LSI-Prüfvorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition