DE60232731D1 - Mikroelektronisches system mit integriertem kryostatischem kühler - Google Patents
Mikroelektronisches system mit integriertem kryostatischem kühlerInfo
- Publication number
- DE60232731D1 DE60232731D1 DE60232731T DE60232731T DE60232731D1 DE 60232731 D1 DE60232731 D1 DE 60232731D1 DE 60232731 T DE60232731 T DE 60232731T DE 60232731 T DE60232731 T DE 60232731T DE 60232731 D1 DE60232731 D1 DE 60232731D1
- Authority
- DE
- Germany
- Prior art keywords
- expansion
- heat
- exchanger
- fluid
- orifice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C13/00—Details of vessels or of the filling or discharging of vessels
- F17C13/005—Details of vessels or of the filling or discharging of vessels for medium-size and small storage vessels not under pressure
- F17C13/006—Details of vessels or of the filling or discharging of vessels for medium-size and small storage vessels not under pressure for Dewar vessels or cryostats
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
- H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Medicines Containing Plant Substances (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Polysaccharides And Polysaccharide Derivatives (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/952,513 US6621071B2 (en) | 2001-09-07 | 2001-09-07 | Microelectronic system with integral cryocooler, and its fabrication and use |
PCT/US2002/027326 WO2003025476A2 (en) | 2001-09-07 | 2002-08-29 | Microelectronic system with integral cyrocooler, and its fabrication and use |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60232731D1 true DE60232731D1 (de) | 2009-08-06 |
Family
ID=25492978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232731T Expired - Lifetime DE60232731D1 (de) | 2001-09-07 | 2002-08-29 | Mikroelektronisches system mit integriertem kryostatischem kühler |
Country Status (6)
Country | Link |
---|---|
US (2) | US6621071B2 (de) |
EP (1) | EP1425798B1 (de) |
AT (1) | ATE434832T1 (de) |
DE (1) | DE60232731D1 (de) |
IL (2) | IL157123A0 (de) |
WO (1) | WO2003025476A2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8283723B2 (en) * | 2005-02-11 | 2012-10-09 | Alpha & Omega Semiconductor Limited | MOS device with low injection diode |
JP2006226743A (ja) * | 2005-02-16 | 2006-08-31 | Mitsubishi Electric Corp | 加速度センサ |
DE102005013227A1 (de) * | 2005-03-18 | 2006-09-28 | Infineon Technologies Fiber Optics Gmbh | Optoelektronische Sende- und/oder Empfangsvorrichtung und optoelektronische Anordnung mit einer Mehrzahl derartiger optoelektronischer Sende- und/oder Empfangsvorrichtungen |
US8353332B2 (en) | 2010-10-13 | 2013-01-15 | Reid Aarne H | Integrated electronics cooling device |
JP5773353B2 (ja) * | 2011-02-15 | 2015-09-02 | 忠元 誠 | 熱交換器 |
WO2013043883A1 (en) | 2011-09-20 | 2013-03-28 | Lockheed Martin Corporation | Extended travel flexure bearing and micro check valve |
US8987893B1 (en) * | 2011-10-18 | 2015-03-24 | Marvell International Ltd. | Heat dissipating interposers |
US9784505B2 (en) * | 2012-05-15 | 2017-10-10 | Lockheed Martin Corporation | System, apparatus, and method for micro-capillary heat exchanger |
US9243726B2 (en) | 2012-10-03 | 2016-01-26 | Aarne H. Reid | Vacuum insulated structure with end fitting and method of making same |
US9936579B2 (en) * | 2013-02-01 | 2018-04-03 | Apple Inc. | Low profile packaging and assembly of a power conversion system in modular form |
US9683766B1 (en) * | 2013-07-12 | 2017-06-20 | Lockheed Martin Corporation | System and method for electronic de-clogging of microcoolers |
US9463918B2 (en) | 2014-02-20 | 2016-10-11 | Aarne H. Reid | Vacuum insulated articles and methods of making same |
FR3018352B1 (fr) * | 2014-03-06 | 2016-04-01 | Soc Fr Detecteurs Infrarouges Sofradir | Dispositif de detection refroidi |
US9999885B1 (en) | 2014-05-30 | 2018-06-19 | Lockheed Martin Corporation | Integrated functional and fluidic circuits in Joule-Thompson microcoolers |
US10497908B2 (en) | 2015-08-24 | 2019-12-03 | Concept Group, Llc | Sealed packages for electronic and energy storage devices |
US10065256B2 (en) | 2015-10-30 | 2018-09-04 | Concept Group Llc | Brazing systems and methods |
EP3423854A4 (de) | 2016-03-04 | 2020-01-01 | Concept Group LLC | Vakuumisolierte artikel mit verbesserung des reflektierenden materials |
US11262142B2 (en) * | 2016-04-26 | 2022-03-01 | Northrop Grumman Systems Corporation | Heat exchangers, weld configurations for heat exchangers and related systems and methods |
EP3541722A4 (de) | 2016-11-15 | 2020-07-08 | Concept Group LLC | Mehrlagenisolierte anordnungen |
WO2018093781A1 (en) | 2016-11-15 | 2018-05-24 | Reid Aarne H | Enhanced vacuum-insulated articles with microporous insulation |
US10390455B2 (en) * | 2017-03-27 | 2019-08-20 | Raytheon Company | Thermal isolation of cryo-cooled components from circuit boards or other structures |
JP2020531764A (ja) | 2017-08-25 | 2020-11-05 | コンセプト グループ エルエルシー | 複合的ジオメトリおよび複合的材料の断熱部品 |
WO2020037430A1 (en) * | 2018-08-24 | 2020-02-27 | Radialis Medical, Inc. | Liquid cooling system for precise temperature control of radiation detector for positron emission mammography |
CN112880233B (zh) * | 2021-01-07 | 2022-09-20 | 武汉高芯科技有限公司 | 一种超微型mems节流制冷红外探测器 |
CN113324344A (zh) * | 2021-04-30 | 2021-08-31 | 武汉高德红外股份有限公司 | 一种节流制冷器 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4392362A (en) | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
JPS6025308B2 (ja) * | 1980-09-16 | 1985-06-17 | 株式会社昭和製作所 | 二輪車等のフロントフオ−ク |
FR2500610B1 (fr) * | 1981-02-25 | 1986-05-02 | Inst Francais Du Petrole | Echangeur de chaleur a plaques perforees |
US4386505A (en) | 1981-05-01 | 1983-06-07 | The Board Of Trustees Of The Leland Stanford Junior University | Refrigerators |
US4431050A (en) * | 1981-10-16 | 1984-02-14 | Avco Corporation | Stacked-plate heat exchanger made of identical corrugated plates |
US4489570A (en) | 1982-12-01 | 1984-12-25 | The Board Of Trustees Of The Leland Stanford Junior University | Fast cooldown miniature refrigerators |
JPS605548A (ja) * | 1983-06-03 | 1985-01-12 | Esutetsuku:Kk | 集積回路及びその製造方法 |
JPH06101524B2 (ja) * | 1985-09-18 | 1994-12-12 | 株式会社東芝 | 半導体素子用冷却体 |
US4682032A (en) * | 1986-01-17 | 1987-07-21 | Itek Corporation | Joule-Thomson cryostat having a chemically-deposited infrared detector and method of manufacture |
US5101894A (en) * | 1989-07-05 | 1992-04-07 | Alabama Cryogenic Engineering, Inc. | Perforated plate heat exchanger and method of fabrication |
EP0563951B1 (de) * | 1992-04-02 | 1999-02-17 | Denso Corporation | Wärmetauscher |
US5596228A (en) * | 1994-03-10 | 1997-01-21 | Oec Medical Systems, Inc. | Apparatus for cooling charge coupled device imaging systems |
US5758505C1 (en) * | 1995-10-12 | 2001-10-30 | Cryogen Inc | Precooling system for joule-thomson probe |
US6151901A (en) * | 1995-10-12 | 2000-11-28 | Cryogen, Inc. | Miniature mixed gas refrigeration system |
US5590538A (en) * | 1995-11-16 | 1997-01-07 | Lockheed Missiles And Space Company, Inc. | Stacked multistage Joule-Thomson cryostat |
US6127203A (en) * | 1996-08-30 | 2000-10-03 | Drs Technologies, Inc. | Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion |
US5870823A (en) * | 1996-11-27 | 1999-02-16 | International Business Machines Corporation | Method of forming a multilayer electronic packaging substrate with integral cooling channels |
US6054676A (en) * | 1998-02-09 | 2000-04-25 | Kryotech, Inc. | Method and apparatus for cooling an integrated circuit device |
US6242778B1 (en) * | 1998-09-22 | 2001-06-05 | International Business Machines Corporation | Cooling method for silicon on insulator devices |
US6592577B2 (en) * | 1999-01-25 | 2003-07-15 | Cryocath Technologies Inc. | Cooling system |
US6446712B1 (en) * | 1999-02-23 | 2002-09-10 | Long Manufacturing Ltd. | Radial flow annular heat exchangers |
EP1047294A1 (de) * | 1999-04-23 | 2000-10-25 | The Swatch Group Management Services AG | Isoliertes metallisches Substrat für Leiterplatten |
US6252221B1 (en) * | 1999-06-21 | 2001-06-26 | Agilent Technologies, Inc. | Photo-conductive switch having an improved semiconductor structure |
US20010030040A1 (en) * | 1999-12-23 | 2001-10-18 | Jia Hua Xiao | Miniature cryogenic heat exchanger |
-
2001
- 2001-09-07 US US09/952,513 patent/US6621071B2/en not_active Expired - Lifetime
-
2002
- 2002-08-29 EP EP02763546A patent/EP1425798B1/de not_active Expired - Lifetime
- 2002-08-29 WO PCT/US2002/027326 patent/WO2003025476A2/en active Application Filing
- 2002-08-29 DE DE60232731T patent/DE60232731D1/de not_active Expired - Lifetime
- 2002-08-29 IL IL15712302A patent/IL157123A0/xx unknown
- 2002-08-29 AT AT02763546T patent/ATE434832T1/de not_active IP Right Cessation
-
2003
- 2003-07-27 IL IL157123A patent/IL157123A/en not_active IP Right Cessation
- 2003-08-26 US US10/650,094 patent/US7178345B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20060180752A1 (en) | 2006-08-17 |
US6621071B2 (en) | 2003-09-16 |
US7178345B2 (en) | 2007-02-20 |
ATE434832T1 (de) | 2009-07-15 |
WO2003025476A2 (en) | 2003-03-27 |
EP1425798A2 (de) | 2004-06-09 |
IL157123A0 (en) | 2004-02-08 |
EP1425798B1 (de) | 2009-06-24 |
IL157123A (en) | 2010-05-31 |
US20030047685A1 (en) | 2003-03-13 |
WO2003025476A3 (en) | 2004-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |