DE60226839D1 - Phasenwechsel-Speicherzelle sowie deren Herstellungsverfahren mittels Minigräben - Google Patents

Phasenwechsel-Speicherzelle sowie deren Herstellungsverfahren mittels Minigräben

Info

Publication number
DE60226839D1
DE60226839D1 DE60226839T DE60226839T DE60226839D1 DE 60226839 D1 DE60226839 D1 DE 60226839D1 DE 60226839 T DE60226839 T DE 60226839T DE 60226839 T DE60226839 T DE 60226839T DE 60226839 D1 DE60226839 D1 DE 60226839D1
Authority
DE
Germany
Prior art keywords
minigrams
memory cell
production method
phase change
change memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60226839T
Other languages
English (en)
Inventor
Roberto Bez
Fabio Pellizzer
Marina Tosi
Romina Zonca
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Ovonyx Inc
Original Assignee
STMicroelectronics SRL
Ovonyx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL, Ovonyx Inc filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE60226839D1 publication Critical patent/DE60226839D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • H10B63/32—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors of the bipolar type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/061—Shaping switching materials
    • H10N70/068—Shaping switching materials by processes specially adapted for achieving sub-lithographic dimensions, e.g. using spacers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/841—Electrodes
    • H10N70/8413—Electrodes adapted for resistive heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
DE60226839T 2002-02-20 2002-02-20 Phasenwechsel-Speicherzelle sowie deren Herstellungsverfahren mittels Minigräben Expired - Lifetime DE60226839D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02425087A EP1339110B1 (de) 2002-02-20 2002-02-20 Phasenwechsel-Speicherzelle sowie deren Herstellungsverfahren mittels Minigräben

Publications (1)

Publication Number Publication Date
DE60226839D1 true DE60226839D1 (de) 2008-07-10

Family

ID=27635928

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60226839T Expired - Lifetime DE60226839D1 (de) 2002-02-20 2002-02-20 Phasenwechsel-Speicherzelle sowie deren Herstellungsverfahren mittels Minigräben

Country Status (2)

Country Link
EP (1) EP1339110B1 (de)
DE (1) DE60226839D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10297692B4 (de) * 2002-08-14 2010-11-25 Intel Corporation, Santa Clara Geräte und Systeme mit Haftmaterial für programmierbare Vorrichtungen, sowie Verfahren zur Herstellung
KR100448893B1 (ko) * 2002-08-23 2004-09-16 삼성전자주식회사 상전이 기억 소자 구조 및 그 제조 방법
KR100481865B1 (ko) 2002-11-01 2005-04-11 삼성전자주식회사 상변환 기억소자 및 그 제조방법
DE60328960D1 (de) * 2003-04-16 2009-10-08 St Microelectronics Srl Selbstausrichtendes Verfahren zur Herstellung einer Phasenwechsel-Speicherzelle und dadurch hergestellte Phasenwechsel-Speicherzelle
EP1557875A1 (de) * 2003-12-29 2005-07-27 STMicroelectronics S.r.l. Verfahren zur Bildung von Gräben mit abgeschrägtem Profil in einem dielektrischen Material
DE102004019862A1 (de) * 2004-04-23 2005-11-17 Infineon Technologies Ag Sublithographische Kontaktstruktur in einem Halbleiterbauelement
DE102004031742A1 (de) * 2004-06-30 2006-01-19 Infineon Technologies Ag Verfahren zur Herstellung einer sublithographischen Kontaktstruktur in einem Halbleiterbauelement
EP1710850B1 (de) 2005-04-08 2010-01-06 STMicroelectronics S.r.l. Lateraler Phasenwechselspeicher
EP1764847B1 (de) * 2005-09-14 2008-12-24 STMicroelectronics S.r.l. Ringförmiger Heizer für eine Phasenübergangsspeichervorrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6031287A (en) * 1997-06-18 2000-02-29 Micron Technology, Inc. Contact structure and memory element incorporating the same
WO2000057498A1 (en) * 1999-03-25 2000-09-28 Energy Conversion Devices, Inc. Electrically programmable memory element with improved contacts
WO2002009206A1 (en) * 2000-07-22 2002-01-31 Ovonyx, Inc. Electrically programmable memory element

Also Published As

Publication number Publication date
EP1339110A1 (de) 2003-08-27
EP1339110A9 (de) 2004-01-28
EP1339110B1 (de) 2008-05-28

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