DE602008001728D1 - Rotierbare MEMS-Vorrichtung mit Sensor aus Piezoresistoren - Google Patents

Rotierbare MEMS-Vorrichtung mit Sensor aus Piezoresistoren

Info

Publication number
DE602008001728D1
DE602008001728D1 DE602008001728T DE602008001728T DE602008001728D1 DE 602008001728 D1 DE602008001728 D1 DE 602008001728D1 DE 602008001728 T DE602008001728 T DE 602008001728T DE 602008001728 T DE602008001728 T DE 602008001728T DE 602008001728 D1 DE602008001728 D1 DE 602008001728D1
Authority
DE
Germany
Prior art keywords
piezoresistors
mems device
sensor made
rotatable mems
rotatable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008001728T
Other languages
English (en)
Inventor
Young-Chul Ko
Jin-Woo Cho
U-Hyeok Choi
Seong-Ho Shin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of DE602008001728D1 publication Critical patent/DE602008001728D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/101Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/18Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying effective impedance of discharge tubes or semiconductor devices
    • G01D5/183Sensing rotation or linear movement using strain, force or pressure sensors
    • G01D5/185Sensing rotation or linear movement using strain, force or pressure sensors using piezoelectric sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021Transducers for transforming electrical into mechanical energy or vice versa
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B5/00Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16FSPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00Springs
    • F16F1/36Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers
    • F16F1/42Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers characterised by the mode of stressing
    • F16F1/48Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers characterised by the mode of stressing loaded mainly in torsion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/03Microengines and actuators
    • B81B2201/034Electrical rotating micromachines
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3586Control or adjustment details, e.g. calibrating
    • G02B6/359Control or adjustment details, e.g. calibrating of the position of the moving element itself during switching, i.e. without monitoring the switched beams

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Pressure Sensors (AREA)
  • Mechanical Optical Scanning Systems (AREA)
DE602008001728T 2007-01-15 2008-01-10 Rotierbare MEMS-Vorrichtung mit Sensor aus Piezoresistoren Active DE602008001728D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070004415A KR100868758B1 (ko) 2007-01-15 2007-01-15 압저항 센서를 구비한 회전형 mems 디바이스

Publications (1)

Publication Number Publication Date
DE602008001728D1 true DE602008001728D1 (de) 2010-08-26

Family

ID=39400916

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008001728T Active DE602008001728D1 (de) 2007-01-15 2008-01-10 Rotierbare MEMS-Vorrichtung mit Sensor aus Piezoresistoren

Country Status (5)

Country Link
US (1) US7642576B2 (de)
EP (1) EP1944596B1 (de)
JP (1) JP4773421B2 (de)
KR (1) KR100868758B1 (de)
DE (1) DE602008001728D1 (de)

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* Cited by examiner, † Cited by third party
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JP5157857B2 (ja) 2008-12-05 2013-03-06 船井電機株式会社 振動ミラー素子
ATE554418T1 (de) * 2008-12-05 2012-05-15 Funai Electric Co Vibrierendes spiegelelement
DE102009026506A1 (de) * 2009-05-27 2010-12-02 Robert Bosch Gmbh Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil
DE102010029074B4 (de) 2010-05-18 2018-03-08 Robert Bosch Gmbh Anbindungsstruktur für Mikroschwingeneinrichtungen
DE102010029925A1 (de) 2010-06-10 2011-12-15 Robert Bosch Gmbh Vorrichtung und Verfahren zur Lageerkennung einer Mikroschwingvorrichtung
JP2014182227A (ja) * 2013-03-18 2014-09-29 Seiko Epson Corp 光スキャナー、画像表示装置およびヘッドマウントディスプレイ
JP2014182226A (ja) * 2013-03-18 2014-09-29 Seiko Epson Corp 光スキャナー、アクチュエーター、画像表示装置およびヘッドマウントディスプレイ
DE102016200599A1 (de) * 2016-01-19 2017-07-20 Robert Bosch Gmbh MEMS-Vorrichtung und Betriebsverfahren für eine MEMS-Vorrichtung
CN109269690B (zh) * 2018-09-18 2019-10-18 清华大学 应激传感***及应用应激传感***的机器人
CN111064173B (zh) * 2019-12-03 2021-11-02 国网浙江平阳县供电有限责任公司 一种配电网防雷装置
CN112817143A (zh) * 2020-12-31 2021-05-18 歌尔股份有限公司 Mems扫描镜
CN113184799B (zh) * 2021-04-09 2023-07-18 清华大学深圳国际研究生院 一种带硅基压阻式传感器的mems器件

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NL171309C (nl) * 1970-03-02 1983-03-01 Hitachi Ltd Werkwijze voor de vervaardiging van een halfgeleiderlichaam, waarbij een laag van siliciumdioxyde wordt gevormd op een oppervlak van een monokristallijn lichaam van silicium.
US4696188A (en) * 1981-10-09 1987-09-29 Honeywell Inc. Semiconductor device microstructure
JPH0413975A (ja) * 1990-05-07 1992-01-17 Nec Corp 半導体加速度センサ
US5488862A (en) * 1993-10-18 1996-02-06 Armand P. Neukermans Monolithic silicon rate-gyro with integrated sensors
US6232861B1 (en) 1995-06-05 2001-05-15 Nihon Shingo Kabushiki Kaisha Electromagnetic actuator
US6000280A (en) * 1995-07-20 1999-12-14 Cornell Research Foundation, Inc. Drive electrodes for microfabricated torsional cantilevers
JPH09145509A (ja) * 1995-11-29 1997-06-06 Matsushita Electric Works Ltd 圧力センサ
US5694237A (en) 1996-09-25 1997-12-02 University Of Washington Position detection of mechanical resonant scanner mirror
US6388279B1 (en) * 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
WO2004090556A1 (ja) * 1997-11-11 2004-10-21 Makoto Ishida シリコン集積化加速度センサ
JP4238437B2 (ja) * 1999-01-25 2009-03-18 株式会社デンソー 半導体力学量センサとその製造方法
US20010051014A1 (en) 2000-03-24 2001-12-13 Behrang Behin Optical switch employing biased rotatable combdrive devices and methods
JP2005106679A (ja) * 2003-09-30 2005-04-21 Nitta Ind Corp 多軸センサユニットおよびこれを利用した多軸センサ
US7183137B2 (en) * 2003-12-01 2007-02-27 Taiwan Semiconductor Manufacturing Company Method for dicing semiconductor wafers
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JP4749790B2 (ja) * 2004-08-20 2011-08-17 佐々木 実 マイクロミラーデバイスとその製造方法、マイクロミラーデバイスの角度計測方法、およびマイクロミラーデバイス応用装置
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Also Published As

Publication number Publication date
KR20080067181A (ko) 2008-07-18
JP4773421B2 (ja) 2011-09-14
KR100868758B1 (ko) 2008-11-13
US20080168670A1 (en) 2008-07-17
US7642576B2 (en) 2010-01-05
EP1944596B1 (de) 2010-07-14
EP1944596A1 (de) 2008-07-16
JP2008168423A (ja) 2008-07-24

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