DE602006021049D1 - Verwendung eines diazoniumsalzs in einem verfahren zur modifizierung von isolierenden oder halbleitenden oberflächen und resultierende produkte - Google Patents

Verwendung eines diazoniumsalzs in einem verfahren zur modifizierung von isolierenden oder halbleitenden oberflächen und resultierende produkte

Info

Publication number
DE602006021049D1
DE602006021049D1 DE602006021049T DE602006021049T DE602006021049D1 DE 602006021049 D1 DE602006021049 D1 DE 602006021049D1 DE 602006021049 T DE602006021049 T DE 602006021049T DE 602006021049 T DE602006021049 T DE 602006021049T DE 602006021049 D1 DE602006021049 D1 DE 602006021049D1
Authority
DE
Germany
Prior art keywords
diazonium salt
insulated
modifying
semi
resultant products
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006021049T
Other languages
English (en)
Inventor
Christophe Bureau
Jean Pinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alchimer SA
Original Assignee
Alchimer SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alchimer SA filed Critical Alchimer SA
Publication of DE602006021049D1 publication Critical patent/DE602006021049D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
DE602006021049T 2005-10-26 2006-10-09 Verwendung eines diazoniumsalzs in einem verfahren zur modifizierung von isolierenden oder halbleitenden oberflächen und resultierende produkte Active DE602006021049D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0510914A FR2892325B1 (fr) 2005-10-26 2005-10-26 Procede de modification de surfaces isolantes, semi-conductrices ou metalliques, et produits tels qu'obtenus
PCT/FR2006/002260 WO2007048894A1 (fr) 2005-10-26 2006-10-09 Procede de modification de surfaces isolantes ou semi- conductrices, et produits tels qu'obtenus

Publications (1)

Publication Number Publication Date
DE602006021049D1 true DE602006021049D1 (de) 2011-05-12

Family

ID=36603677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006021049T Active DE602006021049D1 (de) 2005-10-26 2006-10-09 Verwendung eines diazoniumsalzs in einem verfahren zur modifizierung von isolierenden oder halbleitenden oberflächen und resultierende produkte

Country Status (12)

Country Link
US (1) US8133549B2 (de)
EP (1) EP1948720B1 (de)
JP (1) JP5210170B2 (de)
KR (1) KR101367781B1 (de)
CN (1) CN101346419B (de)
AT (1) ATE503794T1 (de)
CA (1) CA2627222C (de)
DE (1) DE602006021049D1 (de)
ES (1) ES2373299T3 (de)
FR (1) FR2892325B1 (de)
IL (1) IL191022A (de)
WO (1) WO2007048894A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2910007B1 (fr) * 2006-12-19 2009-03-06 Commissariat Energie Atomique Procede de preparation d'un film organique a la surface d'un support solide dans des conditions non-electrochimiques, support solide ainsi obtenu et kit de preparation
FR2910010B1 (fr) 2006-12-19 2009-03-06 Commissariat Energie Atomique Procede de preparation d'un film organique a la surface d'un support solide dans des conditions non-electrochimiques, support solide ainsi obtenu et kit de preparation
US9725602B2 (en) * 2006-12-19 2017-08-08 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit
FR2910006B1 (fr) * 2006-12-19 2009-03-06 Commissariat Energie Atomique Procede de preparation d'un film organique a la surface d'un support solide dans des conditions non-electrochimiques, support solide ainsi obtenu et kit de preparation
FR2929618B1 (fr) * 2008-04-03 2011-03-18 Commissariat Energie Atomique Procede pour assembler deux surfaces ou une surface avec une molecule d'interet
KR101096031B1 (ko) 2009-03-31 2011-12-19 한양대학교 산학협력단 자기조립단분자막 형성방법과 이를 이용한 반도체 소자의 구리배선 및 그의 형성방법
FR2943930B1 (fr) * 2009-04-02 2011-09-30 Commissariat Energie Atomique Procede pour modifier l'energie de surface d'un solide
US8287699B2 (en) * 2009-07-27 2012-10-16 Nanotek Instruments, Inc. Production of chemically functionalized nano graphene materials
FR2969628B1 (fr) * 2010-12-22 2013-09-27 Pegastech Procede de revetement par greffage chimique electrocatalyse d'une surface d'un substrat par une couche polymere.
US10329232B2 (en) 2012-04-13 2019-06-25 Universite Libre De Bruxelles (Ulb) Materials coated with calixarenes
FR3019477B1 (fr) 2014-04-03 2023-03-17 Commissariat Energie Atomique Procede de fonctionnalisation de surface
US10407556B2 (en) * 2014-06-11 2019-09-10 The Royal Institution For The Advancement Of Learning/Mcgill University Surface modification methods for biomedical scaffolds
RU2640768C1 (ru) * 2016-12-29 2018-01-11 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский экономический университет имени Г.В. Плеханова" (ФГБОУ ВО "РЭУ им. Г.В. Плеханова") Способ модификации поверхности эластомера
CN110945298B (zh) * 2017-06-16 2022-06-10 开利公司 电热元件、包含电热元件的传热***及它们的制备方法
CN109401360B (zh) * 2017-08-18 2020-08-21 中国科学院化学研究所 一种对高温结构陶瓷材料进行表面改性的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3311889A1 (de) * 1983-03-31 1984-10-11 Byk-Mallinckrodt Chemische Produkte Gmbh, 6057 Dietzenbach Verfahren zur irreversiblen bindung von protein an polystyroloberflaechen unter erhaltung der biologischen aktivitaet, so erhaltene polystyroloberflaechen und ihre verwendung
DE3425328A1 (de) * 1984-07-10 1986-01-16 Hoechst Ag, 6230 Frankfurt Lichtempfindliches gemisch und damit hergestelltes lichtempfindliches aufzeichnungsmaterial
FR2672307B1 (fr) * 1991-02-01 1993-06-04 Centre Nat Rech Scient Procede de modification de la surface de materiaux carbones par reduction electrochimique de sels de diazonium, notamment de fibres de carbone pour materiaux composites, materiaux carbones ainsi modifies.
FR2761377B1 (fr) * 1997-03-27 1999-05-07 Centre Nat Rech Scient Procede de realisation par voie electrochimique d'un materiau carbone dont la surface est modifiee par des groupes organiques, utilisation du materiau modifie
US6458458B1 (en) * 1998-10-13 2002-10-01 Cabot Corporation Polymer coated carbon products and other pigments and methods of making same by aqueous media polymerizations or solvent coating methods
FR2804973B1 (fr) * 2000-02-11 2002-09-20 Univ Paris 7 Denis Diderot Materiau metallique dont la surface est modifiee, son procede de preparation et utilisation du materiau modifie
US7250147B2 (en) * 2001-01-29 2007-07-31 Tour James M Process for derivatizing carbon nanotubes with diazonium species
US6555175B2 (en) * 2001-02-20 2003-04-29 Joseph E. Johnson Process for the surface modification of a polymeric substrate
FR2829046B1 (fr) * 2001-08-28 2005-01-14 Commissariat Energie Atomique Procede de greffage et de croissance d'un film organique conducteur sur une surface
WO2004046099A2 (en) * 2002-02-01 2004-06-03 William Marsh Rice University Method of making a molecule-surface interface
FR2838048B1 (fr) * 2002-04-03 2005-05-27 Prod Dentaires Pierre Rolland Produit dentaire reticulable/dereticulable
EP1663863A2 (de) * 2003-07-29 2006-06-07 William Marsh Rice University Selektive funktionalisierung von kohlenstoffnanoröhren
FR2871162B1 (fr) * 2004-06-02 2007-06-29 Univ Paris 7 Denis Diderot Materiau de surface modifiee, son procede de preparation et ses utilisations
US8784635B2 (en) * 2006-02-28 2014-07-22 Alchimer Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces
FR2904319B1 (fr) * 2006-07-27 2009-10-30 Commissariat Energie Atomique Sels de diazonium polymerisables, procede de fabrication et utilisations de ceux-ci

Also Published As

Publication number Publication date
US20090301862A1 (en) 2009-12-10
CN101346419A (zh) 2009-01-14
JP2009518459A (ja) 2009-05-07
ES2373299T3 (es) 2012-02-02
EP1948720A1 (de) 2008-07-30
IL191022A (en) 2013-08-29
CA2627222C (fr) 2014-08-05
KR101367781B1 (ko) 2014-02-27
CN101346419B (zh) 2012-05-09
WO2007048894A1 (fr) 2007-05-03
EP1948720B1 (de) 2011-03-30
FR2892325B1 (fr) 2008-01-18
KR20080072003A (ko) 2008-08-05
US8133549B2 (en) 2012-03-13
ATE503794T1 (de) 2011-04-15
JP5210170B2 (ja) 2013-06-12
CA2627222A1 (fr) 2007-05-03
FR2892325A1 (fr) 2007-04-27

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