DE602006015555D1 - Lasermarkiermaschine mit großer Geschwindigkeit - Google Patents
Lasermarkiermaschine mit großer GeschwindigkeitInfo
- Publication number
- DE602006015555D1 DE602006015555D1 DE602006015555T DE602006015555T DE602006015555D1 DE 602006015555 D1 DE602006015555 D1 DE 602006015555D1 DE 602006015555 T DE602006015555 T DE 602006015555T DE 602006015555 T DE602006015555 T DE 602006015555T DE 602006015555 D1 DE602006015555 D1 DE 602006015555D1
- Authority
- DE
- Germany
- Prior art keywords
- laser
- laser marking
- marking machine
- high speed
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D29/00—Independent underground or underwater structures; Retaining walls
- E02D29/02—Retaining or protecting walls
- E02D29/0258—Retaining or protecting walls characterised by constructional features
- E02D29/0266—Retaining or protecting walls characterised by constructional features made up of preformed elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0342—Observing magnetic fields related to the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0344—Observing the speed of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/44—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
- B41J2/442—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
- B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/41—Marking using electromagnetic radiation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
- G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
- G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1914—Cards, e.g. telephone, credit and identity cards
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/20—Miscellaneous comprising details of connection between elements
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/40—Miscellaneous comprising stabilising elements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Structural Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Paleontology (AREA)
- Mining & Mineral Resources (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Laser Beam Processing (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Dot-Matrix Printers And Others (AREA)
- Duplication Or Marking (AREA)
- Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0502904A FR2883503B1 (fr) | 2005-03-23 | 2005-03-23 | Machine de marquage laser a haute cadence |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006015555D1 true DE602006015555D1 (de) | 2010-09-02 |
Family
ID=35929990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006015555T Active DE602006015555D1 (de) | 2005-03-23 | 2006-03-22 | Lasermarkiermaschine mit großer Geschwindigkeit |
Country Status (11)
Country | Link |
---|---|
US (1) | US7329830B2 (de) |
EP (2) | EP1705600B1 (de) |
JP (1) | JP2006297483A (de) |
KR (1) | KR20060103194A (de) |
CN (1) | CN1927597B (de) |
AT (1) | ATE475144T1 (de) |
CA (1) | CA2540562A1 (de) |
DE (1) | DE602006015555D1 (de) |
FR (1) | FR2883503B1 (de) |
SG (1) | SG126095A1 (de) |
TW (1) | TW200701080A (de) |
Families Citing this family (30)
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FR2898528B1 (fr) * | 2006-03-14 | 2008-05-30 | Datacard Corp | Machine de marquage laser a haute cadence |
US7834293B2 (en) * | 2006-05-02 | 2010-11-16 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing |
DE102006052380B4 (de) | 2006-11-07 | 2013-04-25 | Mühlbauer Ag | Vorrichtung und Verfahren zum Einbringen von Informationen in einen Datenträger |
DE102007052999B4 (de) * | 2007-11-05 | 2015-05-21 | Volkswagen Ag | Verfahren zur Ansteuerung eines Laserscanners |
KR100869095B1 (ko) * | 2007-12-24 | 2008-11-17 | 주식회사 세다스미디어 | 레이저마킹장치 |
KR100966292B1 (ko) * | 2008-07-09 | 2010-06-28 | 주식회사 조성 | 반도체 패키지 마킹 장치와 그 작동방법 |
FR2939516B1 (fr) * | 2008-12-05 | 2011-01-21 | Thales Sa | Telemetre |
FR2939421B1 (fr) * | 2008-12-05 | 2011-01-14 | Datacard Corp | Dispositif ascenseur pour machine de personnalisation et machine de personnalisation munie d'un dispositif ascenseur |
DE102009031871B4 (de) * | 2009-07-06 | 2013-10-24 | Nanosec Gesellschaft Für Nanotechnologie In Der Sicherheitstechnik MBH | Verfahren und Vorrichtung zur Laserbeschriftung |
KR101135537B1 (ko) * | 2010-07-16 | 2012-04-13 | 삼성모바일디스플레이주식회사 | 레이저 조사 장치 |
JP5825647B2 (ja) * | 2010-07-23 | 2015-12-02 | エントラスト・データカード・コーポレイシヨン | 一連の携帯用オブジェクトを個人化する方法および装置 |
KR101299235B1 (ko) * | 2011-11-08 | 2013-08-22 | 주식회사 이오테크닉스 | 카드 마킹 유닛 및 이를 이용한 카드 마킹 방법 |
US9387691B2 (en) | 2011-12-20 | 2016-07-12 | First Solar, Inc. | Method and apparatus for laser marking an object |
AT512386B1 (de) * | 2012-01-12 | 2016-09-15 | Medek & Schoerner Gmbh | Vorrichtung zur lasermarkierung von langgestreckten körpern |
US8786650B1 (en) * | 2012-03-07 | 2014-07-22 | Express Scripts, Inc. | Systems and methods for pharmacy messaging |
KR20150073973A (ko) | 2012-10-22 | 2015-07-01 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 물품을 마킹하기 위한 방법 및 장치 |
CN105073333B (zh) * | 2013-03-13 | 2017-10-31 | 应用材料公司 | 用于太阳能电池的激光烧蚀平台 |
KR101425814B1 (ko) * | 2013-03-26 | 2014-08-06 | 와이제이링크 주식회사 | 레이저마킹 장치 |
DE102015110264A1 (de) * | 2015-06-25 | 2016-12-29 | Cl Schutzrechtsverwaltungs Gmbh | Vorrichtung zur generativen Herstellung wenigstens eines dreidimensionalen Objekts |
FR3046112B1 (fr) * | 2015-12-23 | 2019-06-14 | Idemia France | Procede de realisation d'images selectivement visibles en variant l'angle d'observation par gravure au travers d'un reseau lenticulaire |
EP3383662B1 (de) | 2016-01-08 | 2020-09-02 | Entrust Datacard Corporation | Kartendruckmechanismus kartenrückweg |
DE102016112878A1 (de) * | 2016-07-13 | 2018-01-18 | Slcr Lasertechnik Gmbh | Verfahren und Vorrichtung zum Aufbringen eines Codes auf eine unbehandelte oder behandelte Tierhaut |
US10814668B2 (en) * | 2016-11-08 | 2020-10-27 | Jeffery James Jackson | Kiosk and method for making puzzle tags |
CN107284040B (zh) * | 2017-06-05 | 2018-12-18 | 沈阳友联电子装备有限公司 | 一种ic卡激光打标方法及打标装置 |
CN107175415A (zh) * | 2017-07-12 | 2017-09-19 | 裴向东 | 一种激光增强装置及电弧焊接*** |
CN107511589B (zh) * | 2017-10-17 | 2024-06-21 | 深圳华创兆业科技股份有限公司 | 多轴激光铣槽机 |
CN107570883A (zh) * | 2017-10-17 | 2018-01-12 | 深圳华创兆业科技股份有限公司 | 激光铣切装置 |
DE102018001325B4 (de) | 2018-02-20 | 2024-05-29 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Einbringen von Informationen in einen Datenträger |
CN108648166A (zh) * | 2018-06-06 | 2018-10-12 | 中山新诺科技股份有限公司 | 曝光图形处理的方法和*** |
CN114994247A (zh) * | 2020-11-29 | 2022-09-02 | 昆山富瑞捷机电设备有限公司 | 一种基于自动镭标的检查装置 |
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JP4134590B2 (ja) * | 2002-04-23 | 2008-08-20 | 松下電工株式会社 | メモリーカード成形品のレーザーマーキング方法、メモリーカード成形品、メモリーカード用熱可塑性樹脂組成物の流動性評価方法 |
FR2840831B1 (fr) * | 2002-06-17 | 2005-01-14 | Erca Formseal | Dispositif et procede pour marquer des articles a l'aide d'un rayon laser |
DE102004022744A1 (de) | 2004-05-07 | 2005-11-24 | Atlantic Zeiser Gmbh | Verfahren zum Bearbeiten von Informationsträgern, insbesondere von Identifikationsmitteln, wie Pässen, ID-Karten o. dgl. und Einrichtung zur Durchführung |
-
2005
- 2005-03-23 FR FR0502904A patent/FR2883503B1/fr active Active
- 2005-05-25 US US11/136,719 patent/US7329830B2/en active Active
-
2006
- 2006-03-21 SG SG200601828A patent/SG126095A1/en unknown
- 2006-03-21 CA CA002540562A patent/CA2540562A1/en not_active Abandoned
- 2006-03-22 EP EP06290461A patent/EP1705600B1/de not_active Revoked
- 2006-03-22 TW TW095109817A patent/TW200701080A/zh unknown
- 2006-03-22 AT AT06290461T patent/ATE475144T1/de not_active IP Right Cessation
- 2006-03-22 EP EP08075212.4A patent/EP1967982B1/de not_active Revoked
- 2006-03-22 DE DE602006015555T patent/DE602006015555D1/de active Active
- 2006-03-23 JP JP2006080114A patent/JP2006297483A/ja active Pending
- 2006-03-23 CN CN200610105456XA patent/CN1927597B/zh active Active
- 2006-03-23 KR KR1020060026575A patent/KR20060103194A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2006297483A (ja) | 2006-11-02 |
EP1705600A3 (de) | 2006-12-13 |
SG126095A1 (en) | 2006-10-30 |
EP1967982B1 (de) | 2016-08-03 |
CA2540562A1 (en) | 2006-09-23 |
TW200701080A (en) | 2007-01-01 |
CN1927597A (zh) | 2007-03-14 |
EP1705600B1 (de) | 2010-07-21 |
EP1967982A2 (de) | 2008-09-10 |
FR2883503A1 (fr) | 2006-09-29 |
US20060213879A1 (en) | 2006-09-28 |
KR20060103194A (ko) | 2006-09-28 |
ATE475144T1 (de) | 2010-08-15 |
CN1927597B (zh) | 2011-10-12 |
US7329830B2 (en) | 2008-02-12 |
EP1705600A2 (de) | 2006-09-27 |
EP1967982A3 (de) | 2008-11-12 |
FR2883503B1 (fr) | 2020-11-06 |
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