DE602006015555D1 - Lasermarkiermaschine mit großer Geschwindigkeit - Google Patents

Lasermarkiermaschine mit großer Geschwindigkeit

Info

Publication number
DE602006015555D1
DE602006015555D1 DE602006015555T DE602006015555T DE602006015555D1 DE 602006015555 D1 DE602006015555 D1 DE 602006015555D1 DE 602006015555 T DE602006015555 T DE 602006015555T DE 602006015555 T DE602006015555 T DE 602006015555T DE 602006015555 D1 DE602006015555 D1 DE 602006015555D1
Authority
DE
Germany
Prior art keywords
laser
laser marking
marking machine
high speed
supports
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006015555T
Other languages
English (en)
Inventor
Patrick Baudron
Frederic Beulet
Benoit Berthe
Dominique Perdoux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entrust Corp
Original Assignee
Datacard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35929990&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE602006015555(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Datacard Corp filed Critical Datacard Corp
Publication of DE602006015555D1 publication Critical patent/DE602006015555D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D29/00—Independent underground or underwater structures; Retaining walls
    • E02D29/02—Retaining or protecting walls
    • E02D29/0258—Retaining or protecting walls characterised by constructional features
    • E02D29/0266—Retaining or protecting walls characterised by constructional features made up of preformed elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/0342—Observing magnetic fields related to the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/0344—Observing the speed of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/44—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
    • B41J2/442—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/41—Marking using electromagnetic radiation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
    • G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
    • G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/1914—Cards, e.g. telephone, credit and identity cards
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/20—Miscellaneous comprising details of connection between elements
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/40—Miscellaneous comprising stabilising elements

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Structural Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Paleontology (AREA)
  • Mining & Mineral Resources (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Duplication Or Marking (AREA)
  • Lasers (AREA)
DE602006015555T 2005-03-23 2006-03-22 Lasermarkiermaschine mit großer Geschwindigkeit Active DE602006015555D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0502904A FR2883503B1 (fr) 2005-03-23 2005-03-23 Machine de marquage laser a haute cadence

Publications (1)

Publication Number Publication Date
DE602006015555D1 true DE602006015555D1 (de) 2010-09-02

Family

ID=35929990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006015555T Active DE602006015555D1 (de) 2005-03-23 2006-03-22 Lasermarkiermaschine mit großer Geschwindigkeit

Country Status (11)

Country Link
US (1) US7329830B2 (de)
EP (2) EP1705600B1 (de)
JP (1) JP2006297483A (de)
KR (1) KR20060103194A (de)
CN (1) CN1927597B (de)
AT (1) ATE475144T1 (de)
CA (1) CA2540562A1 (de)
DE (1) DE602006015555D1 (de)
FR (1) FR2883503B1 (de)
SG (1) SG126095A1 (de)
TW (1) TW200701080A (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2898528B1 (fr) * 2006-03-14 2008-05-30 Datacard Corp Machine de marquage laser a haute cadence
US7834293B2 (en) * 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
DE102006052380B4 (de) 2006-11-07 2013-04-25 Mühlbauer Ag Vorrichtung und Verfahren zum Einbringen von Informationen in einen Datenträger
DE102007052999B4 (de) * 2007-11-05 2015-05-21 Volkswagen Ag Verfahren zur Ansteuerung eines Laserscanners
KR100869095B1 (ko) * 2007-12-24 2008-11-17 주식회사 세다스미디어 레이저마킹장치
KR100966292B1 (ko) * 2008-07-09 2010-06-28 주식회사 조성 반도체 패키지 마킹 장치와 그 작동방법
FR2939516B1 (fr) * 2008-12-05 2011-01-21 Thales Sa Telemetre
FR2939421B1 (fr) * 2008-12-05 2011-01-14 Datacard Corp Dispositif ascenseur pour machine de personnalisation et machine de personnalisation munie d'un dispositif ascenseur
DE102009031871B4 (de) * 2009-07-06 2013-10-24 Nanosec Gesellschaft Für Nanotechnologie In Der Sicherheitstechnik MBH Verfahren und Vorrichtung zur Laserbeschriftung
KR101135537B1 (ko) * 2010-07-16 2012-04-13 삼성모바일디스플레이주식회사 레이저 조사 장치
JP5825647B2 (ja) * 2010-07-23 2015-12-02 エントラスト・データカード・コーポレイシヨン 一連の携帯用オブジェクトを個人化する方法および装置
KR101299235B1 (ko) * 2011-11-08 2013-08-22 주식회사 이오테크닉스 카드 마킹 유닛 및 이를 이용한 카드 마킹 방법
US9387691B2 (en) 2011-12-20 2016-07-12 First Solar, Inc. Method and apparatus for laser marking an object
AT512386B1 (de) * 2012-01-12 2016-09-15 Medek & Schoerner Gmbh Vorrichtung zur lasermarkierung von langgestreckten körpern
US8786650B1 (en) * 2012-03-07 2014-07-22 Express Scripts, Inc. Systems and methods for pharmacy messaging
KR20150073973A (ko) 2012-10-22 2015-07-01 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 물품을 마킹하기 위한 방법 및 장치
CN105073333B (zh) * 2013-03-13 2017-10-31 应用材料公司 用于太阳能电池的激光烧蚀平台
KR101425814B1 (ko) * 2013-03-26 2014-08-06 와이제이링크 주식회사 레이저마킹 장치
DE102015110264A1 (de) * 2015-06-25 2016-12-29 Cl Schutzrechtsverwaltungs Gmbh Vorrichtung zur generativen Herstellung wenigstens eines dreidimensionalen Objekts
FR3046112B1 (fr) * 2015-12-23 2019-06-14 Idemia France Procede de realisation d'images selectivement visibles en variant l'angle d'observation par gravure au travers d'un reseau lenticulaire
EP3383662B1 (de) 2016-01-08 2020-09-02 Entrust Datacard Corporation Kartendruckmechanismus kartenrückweg
DE102016112878A1 (de) * 2016-07-13 2018-01-18 Slcr Lasertechnik Gmbh Verfahren und Vorrichtung zum Aufbringen eines Codes auf eine unbehandelte oder behandelte Tierhaut
US10814668B2 (en) * 2016-11-08 2020-10-27 Jeffery James Jackson Kiosk and method for making puzzle tags
CN107284040B (zh) * 2017-06-05 2018-12-18 沈阳友联电子装备有限公司 一种ic卡激光打标方法及打标装置
CN107175415A (zh) * 2017-07-12 2017-09-19 裴向东 一种激光增强装置及电弧焊接***
CN107511589B (zh) * 2017-10-17 2024-06-21 深圳华创兆业科技股份有限公司 多轴激光铣槽机
CN107570883A (zh) * 2017-10-17 2018-01-12 深圳华创兆业科技股份有限公司 激光铣切装置
DE102018001325B4 (de) 2018-02-20 2024-05-29 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Einbringen von Informationen in einen Datenträger
CN108648166A (zh) * 2018-06-06 2018-10-12 中山新诺科技股份有限公司 曝光图形处理的方法和***
CN114994247A (zh) * 2020-11-29 2022-09-02 昆山富瑞捷机电设备有限公司 一种基于自动镭标的检查装置

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024545A (en) * 1974-04-22 1977-05-17 Mb Associates Laser-excited marking system
US4346284A (en) * 1980-06-18 1982-08-24 Philip Morris Incorporated Dual path web transport and processing apparatus with radiant energy directing means
DE3333386A1 (de) * 1983-09-15 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Verfahren und einrichtung zum beschriften von teilen, insbesondere von elektronischen bauelementen
US4818852A (en) * 1986-01-24 1989-04-04 Drexler Technology Corporation Method for forming data cards with registered images
JPH01306082A (ja) * 1988-05-30 1989-12-11 Mitsubishi Electric Corp レーザマーキング装置
JPH0293091U (de) * 1989-01-05 1990-07-24
US5304786A (en) * 1990-01-05 1994-04-19 Symbol Technologies, Inc. High density two-dimensional bar code symbol
JP2736153B2 (ja) * 1990-03-26 1998-04-02 株式会社東芝 半導体部品の製造方法及び半導体部品のマーキング装置
JPH04127982A (ja) * 1990-09-18 1992-04-28 Nec Corp レーザ捺印機
FR2695854B1 (fr) * 1992-09-22 1994-12-09 Leroux Ets Gilles Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités.
US5521628A (en) * 1993-08-30 1996-05-28 Lumonics Corporation Laser system for simultaneously marking multiple parts
DE4338774A1 (de) * 1993-11-12 1995-05-18 Baasel Carl Lasertech Vorrichtung zum Beschriften von Werkstücken
US5504345A (en) * 1994-04-14 1996-04-02 Hama Laboratories, Inc. Dual beam sensor and edge detection system and method
JP3289258B2 (ja) * 1994-08-17 2002-06-04 株式会社小松製作所 ワークの刻印方法
JP2682475B2 (ja) * 1994-11-17 1997-11-26 日本電気株式会社 ビームスキャン式レーザマーキング方法および装置
JP2950190B2 (ja) * 1995-03-28 1999-09-20 株式会社田村電機製作所 カード発行装置
KR100191892B1 (ko) * 1995-11-30 1999-06-15 이형도 광검출장치
US5937270A (en) * 1996-01-24 1999-08-10 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
US6262388B1 (en) * 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
US6417484B1 (en) * 1998-12-21 2002-07-09 Micron Electronics, Inc. Laser marking system for dice carried in trays and method of operation
JP3254430B2 (ja) * 1999-01-18 2002-02-04 サンクス株式会社 レーザマーカ装置
US6420792B1 (en) * 1999-09-24 2002-07-16 Texas Instruments Incorporated Semiconductor wafer edge marking
DE10026499A1 (de) * 2000-05-27 2001-12-06 Isola Ag Vorrichtung und Verfahren zur Beschriftung von kupferkaschierten Laminaten
US6359253B1 (en) * 2000-07-12 2002-03-19 Advanced Micro Devices, Inc. Unit-in-tray pocket checker
JP2003010985A (ja) * 2001-06-29 2003-01-15 Toppan Forms Co Ltd レーザ加工による真正マーク内蔵部材
DE10146820B4 (de) * 2001-09-19 2005-02-24 Tampoprint Gmbh Dekoriervorrichtung und Verfahren zum Dekorieren von Oberflächen
JP2003145284A (ja) * 2001-11-13 2003-05-20 Meidensha Corp 製造番号印字装置
JP2003260578A (ja) 2002-03-07 2003-09-16 Printing Bureau Ministry Of Finance 冊子穿孔搬送装置
JP2003290939A (ja) * 2002-03-28 2003-10-14 Sunx Ltd レーザマーキング装置
JP4134590B2 (ja) * 2002-04-23 2008-08-20 松下電工株式会社 メモリーカード成形品のレーザーマーキング方法、メモリーカード成形品、メモリーカード用熱可塑性樹脂組成物の流動性評価方法
FR2840831B1 (fr) * 2002-06-17 2005-01-14 Erca Formseal Dispositif et procede pour marquer des articles a l'aide d'un rayon laser
DE102004022744A1 (de) 2004-05-07 2005-11-24 Atlantic Zeiser Gmbh Verfahren zum Bearbeiten von Informationsträgern, insbesondere von Identifikationsmitteln, wie Pässen, ID-Karten o. dgl. und Einrichtung zur Durchführung

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JP2006297483A (ja) 2006-11-02
EP1705600A3 (de) 2006-12-13
SG126095A1 (en) 2006-10-30
EP1967982B1 (de) 2016-08-03
CA2540562A1 (en) 2006-09-23
TW200701080A (en) 2007-01-01
CN1927597A (zh) 2007-03-14
EP1705600B1 (de) 2010-07-21
EP1967982A2 (de) 2008-09-10
FR2883503A1 (fr) 2006-09-29
US20060213879A1 (en) 2006-09-28
KR20060103194A (ko) 2006-09-28
ATE475144T1 (de) 2010-08-15
CN1927597B (zh) 2011-10-12
US7329830B2 (en) 2008-02-12
EP1705600A2 (de) 2006-09-27
EP1967982A3 (de) 2008-11-12
FR2883503B1 (fr) 2020-11-06

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