DE602006000694D1 - Verbinder und Motageverfahren - Google Patents

Verbinder und Motageverfahren

Info

Publication number
DE602006000694D1
DE602006000694D1 DE602006000694T DE602006000694T DE602006000694D1 DE 602006000694 D1 DE602006000694 D1 DE 602006000694D1 DE 602006000694 T DE602006000694 T DE 602006000694T DE 602006000694 T DE602006000694 T DE 602006000694T DE 602006000694 D1 DE602006000694 D1 DE 602006000694D1
Authority
DE
Germany
Prior art keywords
connector
motive
motive method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006000694T
Other languages
English (en)
Other versions
DE602006000694T2 (de
Inventor
Hiroshi Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of DE602006000694D1 publication Critical patent/DE602006000694D1/de
Application granted granted Critical
Publication of DE602006000694T2 publication Critical patent/DE602006000694T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
DE602006000694T 2005-08-22 2006-08-16 Verbinder und Montageverfahren Active DE602006000694T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005240159A JP4556135B2 (ja) 2005-08-22 2005-08-22 基板用コネクタ
JP2005240159 2005-08-22

Publications (2)

Publication Number Publication Date
DE602006000694D1 true DE602006000694D1 (de) 2008-04-24
DE602006000694T2 DE602006000694T2 (de) 2009-03-12

Family

ID=36940180

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006000694T Active DE602006000694T2 (de) 2005-08-22 2006-08-16 Verbinder und Montageverfahren

Country Status (4)

Country Link
US (1) US7207837B2 (de)
EP (1) EP1758208B1 (de)
JP (1) JP4556135B2 (de)
DE (1) DE602006000694T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT2317607E (pt) * 2008-08-22 2013-01-31 Iriso Electronics Co Ltd Conector que compreende uma placa de reforço a ser soldada a um substrato
JP5995147B2 (ja) * 2013-09-24 2016-09-21 住友電装株式会社 回路構成体
JP7032312B2 (ja) * 2016-06-06 2022-03-08 日本端子株式会社 表面実装型コネクタ
JP7029643B2 (ja) * 2018-09-03 2022-03-04 住友電装株式会社 端子、基板用コネクタ、およびコネクタ付き基板
JP7240616B2 (ja) * 2020-09-24 2023-03-16 住友電装株式会社 コネクタ

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646385A (en) 1987-06-26 1989-01-10 Canon Kk Electrical connection structure of circuit substrates
JPH01103272U (de) * 1987-12-28 1989-07-12
JP2529849Y2 (ja) * 1990-12-25 1997-03-19 ヒロセ電機株式会社 表面実装用コネクタの補強金具構造
WO1993002489A1 (en) * 1991-07-16 1993-02-04 E.I. Du Pont De Nemours And Company Retention system for a connector housing
JPH0555438A (ja) * 1991-08-26 1993-03-05 Rohm Co Ltd 電子部品のリード端子構造
US5357074A (en) * 1993-08-17 1994-10-18 The Whitaker Corporation Electrical interconnection device
JP3085572B2 (ja) * 1995-10-13 2000-09-11 エスエムケイ株式会社 接続用端子
WO1997022164A1 (en) * 1995-12-11 1997-06-19 The Whitaker Corporation Surface mountable retention bracket for electrical connectors
JP3685875B2 (ja) * 1996-07-01 2005-08-24 Ｓｍｋ株式会社 コネクタターミナルの実装方法及び実装方法に用いるコネクタターミナルユニット
JP2000113926A (ja) * 1998-10-01 2000-04-21 Hirose Electric Co Ltd 表面実装型コネクタ
US6012949A (en) * 1998-12-09 2000-01-11 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly and boardlocks thereof
JP2000251989A (ja) * 1999-03-01 2000-09-14 Yazaki Corp コネクタの基板接続構造及び基板接続方法
US6227906B1 (en) * 1999-12-21 2001-05-08 Hon Nai Precision Ind. Co., Ltd. Connector to circuit board securing arrangement
ES2276754T3 (es) * 2000-06-02 2007-07-01 Saint-Gobain Glass France Elemento de conexion electrica soldable mediante deposito de soldadura.
US6774310B1 (en) * 2000-10-27 2004-08-10 Intel Corporation Surface mount connector lead
JP4527310B2 (ja) * 2000-12-08 2010-08-18 タイコエレクトロニクスジャパン合同会社 カードエッジコネクタ
JP2003017164A (ja) 2001-07-04 2003-01-17 Yamaichi Electronics Co Ltd コネクタ及びその実装方法
JP2005294163A (ja) * 2004-04-02 2005-10-20 Jst Mfg Co Ltd 補強タブ付き電気コネクタ
JP4013914B2 (ja) * 2004-04-12 2007-11-28 住友電装株式会社 基板用コネクタ
JP2006031944A (ja) * 2004-07-12 2006-02-02 Tokai Rika Co Ltd 表面実装コネクタ

Also Published As

Publication number Publication date
DE602006000694T2 (de) 2009-03-12
US7207837B2 (en) 2007-04-24
EP1758208B1 (de) 2008-03-12
US20070054548A1 (en) 2007-03-08
EP1758208A1 (de) 2007-02-28
JP2007059095A (ja) 2007-03-08
JP4556135B2 (ja) 2010-10-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition