DE602005025091D1 - Piezooszillator und herstellungsverfahren dafür - Google Patents

Piezooszillator und herstellungsverfahren dafür

Info

Publication number: DE602005025091D1
Authority: DE; Germany
Prior art keywords: piezooscillator; manufacturing; method therefor; therefor
Prior art date: 2004-02-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

DE602005025091T

Other languages

English (en)

Inventor

Seiichi Chiba

Katsuhiko Miyazaki

Mutsuo Hayashi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Seiko Epson Corp

Original Assignee

Seiko Epson Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-02-17

Filing date

2005-02-16

Publication date

2011-01-13

2005-02-16 Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp

2011-01-13 Publication of DE602005025091D1 publication Critical patent/DE602005025091D1/de

Status Active legal-status Critical Current

2025-02-17 Anticipated expiration legal-status Critical

Links

238000004519 manufacturing process Methods 0.000 title 1

Classifications

- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement

DE602005025091T 2004-02-17 2005-02-16 Piezooszillator und herstellungsverfahren dafür Active DE602005025091D1 (de)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2004040352		2004-02-17
JP2004193818		2004-06-30
JP2005005606A JP3841304B2 (ja)	2004-02-17	2005-01-12	圧電発振器、及びその製造方法
PCT/JP2005/002839 WO2005078914A1 (ja)	2004-02-17	2005-02-16	圧電発振器、及びその製造方法

Publications (1)

Publication Number	Publication Date
DE602005025091D1 true DE602005025091D1 (de)	2011-01-13

Family

ID=34864934

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE602005025091T Active DE602005025091D1 (de)	2004-02-17	2005-02-16	Piezooszillator und herstellungsverfahren dafür

Country Status (7)

Country	Link
US (1)	US7456552B2 (de)
EP (1)	EP1727275B1 (de)
JP (1)	JP3841304B2 (de)
KR (1)	KR100839248B1 (de)
DE (1)	DE602005025091D1 (de)
TW (1)	TWI278178B (de)
WO (1)	WO2005078914A1 (de)

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CN101278478B (zh) *	2005-09-30	2011-09-21	株式会社大真空	压电振动器件
KR101206030B1 (ko) *	2006-01-25	2012-11-28	삼성전자주식회사	알에프 모듈, 멀티 알에프 모듈 및 그 제조방법
JP4742938B2 (ja) *	2006-03-29	2011-08-10	エプソントヨコム株式会社	圧電デバイス及びその製造方法
JP2008035383A (ja) *	2006-07-31	2008-02-14	Epson Toyocom Corp	圧電デバイスおよび圧電デバイスの製造方法
JP2008039626A (ja) *	2006-08-08	2008-02-21	Epson Toyocom Corp	圧力検出装置
US8179022B2 (en) *	2006-09-30	2012-05-15	Citizen Finetech Miyota Co., Ltd.	Piezoelectric device with improved separation between input-output terminals and external connecting terminals
JP5155685B2 (ja) *	2008-02-15	2013-03-06	セイコーインスツル株式会社	圧電振動片の製造方法
WO2009157208A1 (ja) *	2008-06-27	2009-12-30	三洋電機株式会社	回路モジュールおよびその製造方法、ならびに携帯機器
JP2010103802A (ja) *	2008-10-24	2010-05-06	Epson Toyocom Corp	電子装置
JP5440148B2 (ja) *	2009-12-18	2014-03-12	セイコーエプソン株式会社	圧電デバイスの製造方法
JP5550373B2 (ja) *	2010-02-05	2014-07-16	セイコーインスツル株式会社	パッケージの製造方法
JP2011233977A (ja) *	2010-04-23	2011-11-17	Daishinku Corp	圧電発振器
JP2012060628A (ja) *	2010-08-07	2012-03-22	Nippon Dempa Kogyo Co Ltd	圧電デバイス及びその製造方法
TWI420810B (zh)	2010-12-17	2013-12-21	Ind Tech Res Inst	石英振盪器及其製造方法
US9831414B2 (en) *	2012-06-19	2017-11-28	Daishinku Corporation	Surface mounted piezoelectric vibrator
JP5565544B2 (ja) *	2012-08-01	2014-08-06	株式会社村田製作所	電子部品及び電子部品モジュール
JP6083214B2 (ja)	2012-11-30	2017-02-22	セイコーエプソン株式会社	発振器、電子機器、及び移動体
JP6538309B2 (ja) *	2014-04-25	2019-07-03	京セラ株式会社	恒温槽付圧電デバイス及び恒温槽付圧電デバイスの製造方法
CN106233619B (zh) *	2014-04-25	2019-04-09	株式会社村田制作所	水晶振动装置
JP2016025442A (ja) *	2014-07-18	2016-02-08	日本電波工業株式会社	電子部品用容器及び圧電発振器
JP6426935B2 (ja) *	2014-07-31	2018-11-21	京セラ株式会社	電子デバイスの製造方法
USD760230S1 (en) *	2014-09-16	2016-06-28	Daishinku Corporation	Piezoelectric vibration device
CN105471405B (zh) *	2014-09-30	2018-08-28	日本特殊陶业株式会社	布线基板及多连片式布线基板
CN105977373B (zh) *	2015-03-11	2020-06-05	株式会社大真空	压电器件
JP2016187154A (ja) *	2015-03-27	2016-10-27	セイコーエプソン株式会社	発振器、電子機器及び移動体
JP6891929B2 (ja) *	2015-03-27	2021-06-18	セイコーエプソン株式会社	温度補償型水晶発振器、電子機器及び移動体
WO2016199480A1 (ja) *	2015-06-08	2016-12-15	株式会社村田製作所	弾性波装置
JP6798121B2 (ja) *	2016-03-18	2020-12-09	セイコーエプソン株式会社	発振器、電子機器および移動体
JP2017175203A (ja)	2016-03-18	2017-09-28	セイコーエプソン株式会社	発振器、電子機器および移動体
US10062670B2 (en)	2016-04-18	2018-08-28	Skyworks Solutions, Inc.	Radio frequency system-in-package with stacked clocking crystal
US9918386B2 (en) *	2016-04-18	2018-03-13	Skyworks Solutions, Inc.	Surface mount device stacking for reduced form factor
US10297576B2 (en)	2016-04-18	2019-05-21	Skyworks Solutions, Inc.	Reduced form factor radio frequency system-in-package
JP6805697B2 (ja) *	2016-10-03	2020-12-23	セイコーエプソン株式会社	電子部品用パッケージ、発振器、電子機器、および移動体
JPWO2018097132A1 (ja) *	2016-11-24	2019-10-17	株式会社大真空	圧電振動デバイスおよびそれを備えたＳｉＰモジュール
TWI800014B (zh)	2016-12-29	2023-04-21	美商天工方案公司	前端系統及相關裝置、積體電路、模組及方法
JP6862835B2 (ja) *	2017-01-12	2021-04-21	セイコーエプソン株式会社	発振器、電子機器および移動体
US10515924B2 (en)	2017-03-10	2019-12-24	Skyworks Solutions, Inc.	Radio frequency modules
JP6946679B2 (ja) *	2017-03-15	2021-10-06	セイコーエプソン株式会社	振動デバイス、発振器、電子機器および移動体
JP2018152828A (ja) *	2017-03-15	2018-09-27	セイコーエプソン株式会社	振動デバイス、発振器、電子機器および移動体
JP7035604B2 (ja) *	2017-03-23	2022-03-15	セイコーエプソン株式会社	温度補償型発振器、電子機器および移動体
CN113228256B (zh) *	2018-12-27	2024-03-22	株式会社大真空	压电振动器件

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH09167918A (ja) *	1995-12-15	1997-06-24	Kenwood Corp	温度補償型水晶発振器
JP2974622B2 (ja)	1996-09-20	1999-11-10	松下電器産業株式会社	発振器
JP3396155B2 (ja)	1997-10-31	2003-04-14	キンセキ株式会社	圧電発振器
JP4547788B2 (ja) *	2000-03-15	2010-09-22	セイコーエプソン株式会社	圧電振動子のパッケージ構造
JP2001320240A (ja)	2000-05-12	2001-11-16	Daishinku Corp	圧電発振器
JP3783235B2 (ja) *	2003-06-16	2006-06-07	セイコーエプソン株式会社	圧電発振器とその製造方法ならびに圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器
US7157836B2 (en) *	2004-10-19	2007-01-02	Seiko Epson Corporation	Piezoelectric device
JP3905118B1 (ja) *	2006-06-21	2007-04-18	英生住野	ヘルメット
JP4167276B2 (ja) *	2006-06-23	2008-10-15	株式会社住化分析センター	導電体の溶断試験方法

2005
- 2005-01-12 JP JP2005005606A patent/JP3841304B2/ja not_active Expired - Fee Related
- 2005-02-14 US US11/056,263 patent/US7456552B2/en not_active Expired - Fee Related
- 2005-02-16 WO PCT/JP2005/002839 patent/WO2005078914A1/ja active Application Filing
- 2005-02-16 DE DE602005025091T patent/DE602005025091D1/de active Active
- 2005-02-16 EP EP05710542A patent/EP1727275B1/de not_active Expired - Fee Related
- 2005-02-16 TW TW094104518A patent/TWI278178B/zh not_active IP Right Cessation
- 2005-02-16 KR KR1020067019007A patent/KR100839248B1/ko active IP Right Grant

Also Published As

Publication number	Publication date
EP1727275A4 (de)	2009-04-01
TWI278178B (en)	2007-04-01
KR100839248B1 (ko)	2008-06-17
US7456552B2 (en)	2008-11-25
TW200533059A (en)	2005-10-01
EP1727275A1 (de)	2006-11-29
US20050184626A1 (en)	2005-08-25
KR20060111728A (ko)	2006-10-27
JP3841304B2 (ja)	2006-11-01
EP1727275B1 (de)	2010-12-01
WO2005078914A1 (ja)	2005-08-25
JP2006050529A (ja)	2006-02-16

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