DE602004031735D1 - Flüssigkeitausstossvorrichtung - Google Patents

Flüssigkeitausstossvorrichtung

Info

Publication number
DE602004031735D1
DE602004031735D1 DE602004031735T DE602004031735T DE602004031735D1 DE 602004031735 D1 DE602004031735 D1 DE 602004031735D1 DE 602004031735 T DE602004031735 T DE 602004031735T DE 602004031735 T DE602004031735 T DE 602004031735T DE 602004031735 D1 DE602004031735 D1 DE 602004031735D1
Authority
DE
Germany
Prior art keywords
ejection device
fluid ejection
fluid
ejection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004031735T
Other languages
English (en)
Inventor
Scott W Hock
Hector Lebron
Paul Crivelli
Kenneth Diest
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of DE602004031735D1 publication Critical patent/DE602004031735D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14032—Structure of the pressure chamber
    • B41J2/1404—Geometrical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14379—Edge shooter

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Nozzles (AREA)
DE602004031735T 2003-07-03 2004-06-25 Flüssigkeitausstossvorrichtung Expired - Lifetime DE602004031735D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/613,471 US6890067B2 (en) 2003-07-03 2003-07-03 Fluid ejection assembly
PCT/US2004/020677 WO2005007412A1 (en) 2003-07-03 2004-06-25 Fluid ejection assembly

Publications (1)

Publication Number Publication Date
DE602004031735D1 true DE602004031735D1 (de) 2011-04-21

Family

ID=33552701

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004031735T Expired - Lifetime DE602004031735D1 (de) 2003-07-03 2004-06-25 Flüssigkeitausstossvorrichtung

Country Status (9)

Country Link
US (1) US6890067B2 (de)
EP (1) EP1644197B1 (de)
JP (1) JP2007527332A (de)
CN (1) CN100436139C (de)
AR (1) AR044998A1 (de)
CL (1) CL2004000953A1 (de)
DE (1) DE602004031735D1 (de)
TW (1) TWI296971B (de)
WO (1) WO2005007412A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050206679A1 (en) * 2003-07-03 2005-09-22 Rio Rivas Fluid ejection assembly
US6890067B2 (en) 2003-07-03 2005-05-10 Hewlett-Packard Development Company, L.P. Fluid ejection assembly
US7540593B2 (en) * 2005-04-26 2009-06-02 Hewlett-Packard Development Company, L.P. Fluid ejection assembly
US7380914B2 (en) 2005-04-26 2008-06-03 Hewlett-Packard Development Company, L.P. Fluid ejection assembly
US20070171261A1 (en) * 2006-01-24 2007-07-26 Samsung Electronics Co., Ltd Array inkjet printhead
JP5395679B2 (ja) 2007-03-21 2014-01-22 ソシエテ ビック 流体マニホルドとその方法
US8133629B2 (en) * 2007-03-21 2012-03-13 SOCIéTé BIC Fluidic distribution system and related methods
US8679694B2 (en) * 2007-03-21 2014-03-25 Societe Bic Fluidic control system and method of manufacture
US7938513B2 (en) * 2008-04-11 2011-05-10 Lexmark International, Inc. Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips
US8459779B2 (en) * 2008-04-11 2013-06-11 Lexmark International, Inc. Heater chips with silicon die bonded on silicon substrate, including offset wire bonding
US20100116423A1 (en) * 2008-11-07 2010-05-13 Zachary Justin Reitmeier Micro-fluid ejection device and method for assembling a micro-fluid ejection device by wafer-to-wafer bonding
CN106068186B (zh) * 2014-06-30 2018-12-21 惠普发展公司，有限责任合伙企业 流体喷射结构

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JP3143549B2 (ja) 1993-09-08 2001-03-07 キヤノン株式会社 熱記録ヘッド用基体、該基体を用いたインクジェット記録ヘッド、インクジェットカートリッジ、インクジェット記録装置、及び記録ヘッドの駆動方法
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US6890067B2 (en) 2003-07-03 2005-05-10 Hewlett-Packard Development Company, L.P. Fluid ejection assembly

Also Published As

Publication number Publication date
CN1845824A (zh) 2006-10-11
CN100436139C (zh) 2008-11-26
EP1644197A1 (de) 2006-04-12
US20050001886A1 (en) 2005-01-06
TW200513391A (en) 2005-04-16
WO2005007412A1 (en) 2005-01-27
TWI296971B (en) 2008-05-21
JP2007527332A (ja) 2007-09-27
CL2004000953A1 (es) 2005-04-15
AR044998A1 (es) 2005-10-12
US6890067B2 (en) 2005-05-10
EP1644197B1 (de) 2011-03-09

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