DE602004010871D1 - Polierscheibe - Google Patents
PolierscheibeInfo
- Publication number
- DE602004010871D1 DE602004010871D1 DE602004010871T DE602004010871T DE602004010871D1 DE 602004010871 D1 DE602004010871 D1 DE 602004010871D1 DE 602004010871 T DE602004010871 T DE 602004010871T DE 602004010871 T DE602004010871 T DE 602004010871T DE 602004010871 D1 DE602004010871 D1 DE 602004010871D1
- Authority
- DE
- Germany
- Prior art keywords
- buff
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
- B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
- B24D3/26—Rubbers synthetic or natural for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68215803A | 2003-10-09 | 2003-10-09 | |
US682158 | 2003-10-09 | ||
US10/937,914 US7074115B2 (en) | 2003-10-09 | 2004-09-10 | Polishing pad |
US937914 | 2004-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004010871D1 true DE602004010871D1 (de) | 2008-02-07 |
DE602004010871T2 DE602004010871T2 (de) | 2008-12-11 |
Family
ID=34316904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004010871T Active DE602004010871T2 (de) | 2003-10-09 | 2004-10-06 | Polierscheibe |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1522385B1 (de) |
JP (1) | JP4722446B2 (de) |
KR (1) | KR101092944B1 (de) |
CN (1) | CN100353502C (de) |
DE (1) | DE602004010871T2 (de) |
SG (1) | SG111222A1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
JP2008511181A (ja) * | 2004-08-25 | 2008-04-10 | ジェイエイチ ローデス カンパニー, インコーポレイテッド | 改善されたパッド除去速度および平坦化の研磨パッドおよび方法 |
JP4757562B2 (ja) * | 2005-08-04 | 2011-08-24 | 東洋ゴム工業株式会社 | Cu膜研磨用研磨パッド |
US7445847B2 (en) * | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US7169030B1 (en) * | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US8303375B2 (en) * | 2009-01-12 | 2012-11-06 | Novaplanar Technology, Inc. | Polishing pads for chemical mechanical planarization and/or other polishing methods |
WO2010138724A1 (en) * | 2009-05-27 | 2010-12-02 | Rogers Corporation | Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer |
US20150059254A1 (en) * | 2013-09-04 | 2015-03-05 | Dow Global Technologies Llc | Polyurethane polishing pad |
US9731398B2 (en) * | 2014-08-22 | 2017-08-15 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Polyurethane polishing pad |
US10688621B2 (en) * | 2016-08-04 | 2020-06-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-defect-porous polishing pad |
US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
JP6968651B2 (ja) | 2017-10-12 | 2021-11-17 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
CN108047420B (zh) * | 2017-11-28 | 2021-01-12 | 湖北鼎龙控股股份有限公司 | 一种聚氨酯抛光层及其制备方法 |
JP7141230B2 (ja) | 2018-03-30 | 2022-09-22 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
US20210347006A1 (en) | 2018-09-28 | 2021-11-11 | Fujibo Holdings, Inc. | Polishing pad and method for producing polished product |
KR102423956B1 (ko) * | 2020-09-07 | 2022-07-21 | 에스케이씨솔믹스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
WO2022071205A1 (ja) * | 2020-09-30 | 2022-04-07 | 富士紡ホールディングス株式会社 | 研磨パッド、及び研磨加工物の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI228522B (en) * | 1999-06-04 | 2005-03-01 | Fuji Spinning Co Ltd | Urethane molded products for polishing pad and method for making same |
JP2000344902A (ja) * | 1999-06-04 | 2000-12-12 | Fuji Spinning Co Ltd | 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物 |
EP1284842B1 (de) * | 2000-05-27 | 2005-10-19 | Rohm and Haas Electronic Materials CMP Holdings, Inc. | Polierkissen zum chemisch-mechanischen planarisieren |
US6454634B1 (en) * | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
JP2002124491A (ja) | 2000-08-10 | 2002-04-26 | Toray Ind Inc | 研磨パッド |
JP4409758B2 (ja) * | 2000-12-26 | 2010-02-03 | 東洋ゴム工業株式会社 | 研磨シートの製造方法 |
JP2002192457A (ja) * | 2000-12-26 | 2002-07-10 | Toyo Tire & Rubber Co Ltd | 研磨材組成物及び研磨シート |
KR100790427B1 (ko) * | 2001-04-09 | 2008-01-02 | 도요 고무 고교 가부시키가이샤 | 폴리우레탄 조성물 및 연마 패드 |
JP3359629B1 (ja) * | 2001-04-09 | 2002-12-24 | 東洋紡績株式会社 | ポリウレタン組成物からなる研磨パッド |
JP2004083722A (ja) * | 2002-08-26 | 2004-03-18 | Jsr Corp | 研磨パッド用組成物及びこれを用いた研磨パッド |
-
2004
- 2004-10-04 SG SG200405774A patent/SG111222A1/en unknown
- 2004-10-06 DE DE602004010871T patent/DE602004010871T2/de active Active
- 2004-10-06 EP EP04256170A patent/EP1522385B1/de active Active
- 2004-10-07 KR KR1020040080039A patent/KR101092944B1/ko active IP Right Grant
- 2004-10-08 JP JP2004295816A patent/JP4722446B2/ja active Active
- 2004-10-08 CN CNB200410010483XA patent/CN100353502C/zh not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP1522385A3 (de) | 2006-03-15 |
CN100353502C (zh) | 2007-12-05 |
KR20050034554A (ko) | 2005-04-14 |
CN1638056A (zh) | 2005-07-13 |
SG111222A1 (en) | 2005-05-30 |
EP1522385B1 (de) | 2007-12-26 |
KR101092944B1 (ko) | 2011-12-12 |
JP2005136400A (ja) | 2005-05-26 |
DE602004010871T2 (de) | 2008-12-11 |
JP4722446B2 (ja) | 2011-07-13 |
EP1522385A2 (de) | 2005-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |