DE60142600D1 - Entwicklungsverfahren und -vorrichtung - Google Patents

Entwicklungsverfahren und -vorrichtung

Info

Publication number
DE60142600D1
DE60142600D1 DE60142600T DE60142600T DE60142600D1 DE 60142600 D1 DE60142600 D1 DE 60142600D1 DE 60142600 T DE60142600 T DE 60142600T DE 60142600 T DE60142600 T DE 60142600T DE 60142600 D1 DE60142600 D1 DE 60142600D1
Authority
DE
Germany
Prior art keywords
development process
development
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60142600T
Other languages
English (en)
Inventor
Akira Nishiya
Kazuo Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE60142600D1 publication Critical patent/DE60142600D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G03F7/3028—Imagewise removal using liquid means from a wafer supported on a rotating chuck characterised by means for on-wafer monitoring of the processing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE60142600T 2000-06-13 2001-06-12 Entwicklungsverfahren und -vorrichtung Expired - Lifetime DE60142600D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000176777 2000-06-13

Publications (1)

Publication Number Publication Date
DE60142600D1 true DE60142600D1 (de) 2010-09-02

Family

ID=18678464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60142600T Expired - Lifetime DE60142600D1 (de) 2000-06-13 2001-06-12 Entwicklungsverfahren und -vorrichtung

Country Status (6)

Country Link
US (1) US6706321B2 (de)
EP (1) EP1164438B1 (de)
KR (1) KR100873720B1 (de)
DE (1) DE60142600D1 (de)
SG (1) SG103292A1 (de)
TW (1) TW505957B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4464763B2 (ja) * 2004-08-20 2010-05-19 東京エレクトロン株式会社 現像装置及び現像方法
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7662436B1 (en) * 2005-05-27 2010-02-16 Infineon Technologies Ag Method of spin coating a film of non-uniform thickness
KR100757882B1 (ko) * 2006-01-13 2007-09-11 세메스 주식회사 기판의 감광막 제거 방법
TWI359456B (en) * 2006-12-15 2012-03-01 Lam Res Ag Device and method for wet treating plate-like arti
JP5096849B2 (ja) * 2007-09-13 2012-12-12 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4893799B2 (ja) * 2009-10-23 2012-03-07 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
KR101337368B1 (ko) 2010-10-27 2013-12-05 엘지디스플레이 주식회사 코팅장치 및 이를 이용한 코팅막 형성방법
JP5789546B2 (ja) 2011-04-26 2015-10-07 東京エレクトロン株式会社 塗布処理装置、塗布現像処理システム、並びに塗布処理方法及びその塗布処理方法を実行させるためのプログラムを記録した記録媒体
JP5845633B2 (ja) * 2011-05-26 2016-01-20 セイコーエプソン株式会社 液滴吐出装置
JP5940022B2 (ja) 2013-06-13 2016-06-29 三菱電機株式会社 半導体装置の製造方法
CN105204300A (zh) * 2015-09-01 2015-12-30 湘能华磊光电股份有限公司 用于制作发光二极管的光刻显影方法
CN105116694B (zh) * 2015-09-25 2017-12-22 京东方科技集团股份有限公司 一种掩膜版、曝光装置及曝光方法
JP6672967B2 (ja) * 2016-04-01 2020-03-25 東京エレクトロン株式会社 現像方法、現像装置及び記憶媒体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2704403B2 (ja) * 1986-11-21 1998-01-26 セイコーインスツルメンツ株式会社 半導体薄膜の製造方法
US5689749A (en) * 1994-08-31 1997-11-18 Tokyo Electron Limited Apparatus for developing a resist-coated substrate
JP2874155B2 (ja) 1994-11-02 1999-03-24 株式会社フロンテック レジスト現像装置
US5821035A (en) 1996-03-06 1998-10-13 Sony Corporation Resist developing apparatus and resist developing method
TW359854B (en) 1996-06-21 1999-06-01 Tokyo Electron Ltd Processing apparatus and processing method
KR100283442B1 (ko) 1996-12-26 2001-04-02 이시다 아키라 현상장치및현상방법
US5962070A (en) 1997-09-25 1999-10-05 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus
KR100537040B1 (ko) * 1998-08-19 2005-12-16 동경 엘렉트론 주식회사 현상장치
US6270579B1 (en) * 1999-10-29 2001-08-07 Advanced Micro Devices, Inc. Nozzle arm movement for resist development
US6248175B1 (en) * 1999-10-29 2001-06-19 Advanced Micro Devices, Inc. Nozzle arm movement for resist development

Also Published As

Publication number Publication date
US20010050050A1 (en) 2001-12-13
KR20010112595A (ko) 2001-12-20
TW505957B (en) 2002-10-11
KR100873720B1 (ko) 2008-12-12
SG103292A1 (en) 2004-04-29
EP1164438B1 (de) 2010-07-21
US6706321B2 (en) 2004-03-16
EP1164438A1 (de) 2001-12-19

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