DE60140769D1 - Schwallötvorrichtung und -methode - Google Patents
Schwallötvorrichtung und -methodeInfo
- Publication number
- DE60140769D1 DE60140769D1 DE60140769T DE60140769T DE60140769D1 DE 60140769 D1 DE60140769 D1 DE 60140769D1 DE 60140769 T DE60140769 T DE 60140769T DE 60140769 T DE60140769 T DE 60140769T DE 60140769 D1 DE60140769 D1 DE 60140769D1
- Authority
- DE
- Germany
- Prior art keywords
- soldering device
- wave soldering
- wave
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000292271 | 2000-09-26 | ||
JP2000299423A JP2002111194A (ja) | 2000-09-29 | 2000-09-29 | フローはんだ付け方法および装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60140769D1 true DE60140769D1 (de) | 2010-01-21 |
Family
ID=26600739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60140769T Expired - Lifetime DE60140769D1 (de) | 2000-09-26 | 2001-09-25 | Schwallötvorrichtung und -methode |
Country Status (4)
Country | Link |
---|---|
US (1) | US6805282B2 (de) |
EP (2) | EP1405687B1 (de) |
DE (1) | DE60140769D1 (de) |
WO (1) | WO2002028156A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100482043C (zh) * | 2004-04-16 | 2009-04-22 | P.凯金属股份有限公司 | 焊接方法 |
TW200610122A (en) * | 2004-09-14 | 2006-03-16 | P Kay Metal Inc | Soldering process |
US20060226199A1 (en) * | 2005-03-30 | 2006-10-12 | Visteon Global Technologies, Inc. | Selective soldering of flat flexible cable with lead-free solder to a substrate |
WO2007013256A1 (ja) | 2005-07-27 | 2007-02-01 | Matsushita Electric Industrial Co., Ltd. | 金属試料作製装置と金属試料作製方法 |
US20080296348A1 (en) * | 2007-06-04 | 2008-12-04 | Slater Jr Richard F | Heater for select solder machine |
DE102007053857A1 (de) * | 2007-11-09 | 2009-05-14 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Betrieb einer Wellenlötanlage |
EP2138258B1 (de) * | 2008-06-23 | 2022-08-24 | Siemens Energy Global GmbH & Co. KG | Verfahren zum Löten mit mehrstufigem Temperaturprofil |
EP2299501A1 (de) * | 2009-09-16 | 2011-03-23 | 3S Industries AG | Verfahren und Vorrichtung zur Ausstattung einer Solarzelle mit einem Lötband |
KR20110129151A (ko) * | 2010-05-25 | 2011-12-01 | 삼성전자주식회사 | 부력 인가 수단을 가진 웨이브 솔더링 장치와 솔더링 방법 및 플립 칩용 솔더 범프 형성 방법 |
TWI435674B (zh) | 2011-01-28 | 2014-04-21 | Wistron Corp | 焊接插件式元件於電路板之方法及焊接系統 |
KR20130059760A (ko) * | 2011-11-29 | 2013-06-07 | 삼성전기주식회사 | 솔더범프 형성장치 및 이를 구비하는 솔더링 설비 |
FI20125384L (fi) * | 2012-04-04 | 2013-10-05 | Tellabs Oy | Juotosliitoksella varustettu järjestelmä |
US9198300B2 (en) | 2014-01-23 | 2015-11-24 | Illinois Tool Works Inc. | Flux management system and method for a wave solder machine |
US9161459B2 (en) | 2014-02-25 | 2015-10-13 | Illinois Tool Works Inc. | Pre-heater latch and seal mechanism for wave solder machine and related method |
DE102014110720A1 (de) * | 2014-07-29 | 2016-02-04 | Illinois Tool Works Inc. | Lötmodul |
JP6227580B2 (ja) * | 2015-03-03 | 2017-11-08 | ファナック株式会社 | 板金と樹脂から作製された基板、該基板を備えたモータ、および半田付け方法 |
TWI600240B (zh) * | 2017-02-08 | 2017-09-21 | 嵩技企業股份有限公司 | 全自動rf端子鉚壓沾錫機 |
EP3637966B1 (de) * | 2017-06-05 | 2022-03-16 | Senju Metal Industry Co., Ltd | Lötvorrichtung |
JP6566021B2 (ja) | 2017-12-25 | 2019-08-28 | 千住金属工業株式会社 | 噴流はんだ槽及び噴流はんだ付け装置 |
US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
JP7141001B1 (ja) * | 2021-05-14 | 2022-09-22 | 千住金属工業株式会社 | 噴流はんだ付け装置 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4446358A (en) | 1981-12-15 | 1984-05-01 | Cooper Industries, Inc. | Preheater for use in mass soldering apparatus |
US4632291A (en) | 1983-02-28 | 1986-12-30 | Electrovert Ltd. | Automatic wave soldering machine |
US4538757A (en) | 1983-08-01 | 1985-09-03 | Motorola, Inc. | Wave soldering in a reducing atmosphere |
US4600137A (en) | 1985-02-21 | 1986-07-15 | Hollis Automation, Inc. | Method and apparatus for mass soldering with subsequent reflow soldering |
JPS63174778A (ja) | 1987-01-11 | 1988-07-19 | Daiichi Tsusho:Kk | 自動半田付け方法及び装置 |
DE3737563A1 (de) * | 1987-11-05 | 1989-05-18 | Ernst Hohnerlein | Loetmaschine |
US5121874A (en) * | 1989-11-22 | 1992-06-16 | Electrovert Ltd. | Shield gas wave soldering |
US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
US5230460A (en) * | 1990-06-13 | 1993-07-27 | Electrovert Ltd. | High volume convection preheater for wave soldering |
US5228614A (en) * | 1990-07-09 | 1993-07-20 | Electrovert Ltd. | Solder nozzle with gas knife jet |
US5203489A (en) * | 1991-12-06 | 1993-04-20 | Electrovert Ltd. | Gas shrouded wave soldering |
US5240169A (en) * | 1991-12-06 | 1993-08-31 | Electrovert Ltd. | Gas shrouded wave soldering with gas knife |
JP3235877B2 (ja) | 1992-08-31 | 2001-12-04 | 松下電器産業株式会社 | ディップ半田付け装置 |
US5297724A (en) * | 1993-05-26 | 1994-03-29 | The Boc Group, Inc. | Wave soldering method and apparatus |
US5520320A (en) * | 1994-04-22 | 1996-05-28 | Air Liquide America Corporation | Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere |
DE4416788C2 (de) * | 1994-05-06 | 1999-08-19 | Siemens Ag | Verfahren zum Wellenlöten von Leiterplatten |
US5630542A (en) * | 1994-12-05 | 1997-05-20 | Soltec B.V. | Soldering apparatus with abrupt separation of solder streams |
JPH08242074A (ja) | 1995-03-03 | 1996-09-17 | Toshiba Fa Syst Eng Kk | プリント基板半田付け装置 |
JP3311547B2 (ja) * | 1995-08-02 | 2002-08-05 | 日本電熱計器株式会社 | はんだ付け装置 |
US5772101A (en) * | 1995-08-07 | 1998-06-30 | Ns Tekuno Co., Ltd. | Wave soldering machine |
US5685475A (en) * | 1995-09-08 | 1997-11-11 | Ford Motor Company | Apparatus for cooling printed circuit boards in wave soldering |
JPH09237964A (ja) | 1996-02-28 | 1997-09-09 | Sony Corp | 窒素ガス封入式半田付け装置 |
JP3963501B2 (ja) | 1996-06-12 | 2007-08-22 | 内橋エステック株式会社 | 電子部品の実装方法 |
JPH10125618A (ja) * | 1996-10-23 | 1998-05-15 | Fujitsu Ltd | 半導体装置の製造方法 |
JP3592486B2 (ja) * | 1997-06-18 | 2004-11-24 | 株式会社東芝 | ハンダ付け装置 |
JP2899584B1 (ja) | 1998-02-27 | 1999-06-02 | 松下電器産業株式会社 | 酸化物の分離剤と分離方法と容器 |
JP3241013B2 (ja) | 1998-02-27 | 2001-12-25 | 松下電器産業株式会社 | はんだ付け装置とはんだ回収装置と酸化物の除去方法と酸化物の分離剤 |
EP1378309B1 (de) | 1998-02-27 | 2008-07-09 | Matsushita Electric Industrial Co., Ltd. | Verfahren zum Trennen des Lötmaterials von der Oxidlötung |
JP2000244108A (ja) * | 1999-02-22 | 2000-09-08 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置 |
JP2000252620A (ja) | 1999-03-04 | 2000-09-14 | Matsushita Electric Ind Co Ltd | はんだ付け装置とはんだ回収装置と酸化物の除去方法と酸化物の分離剤 |
JP2002062273A (ja) | 2000-06-06 | 2002-02-28 | Matsushita Electric Ind Co Ltd | 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム |
EP1162021B1 (de) | 2000-06-06 | 2005-02-02 | Matsushita Electric Industrial Co., Ltd. | Verfahren zum Einschätzen der Qualität eines bleifreien Lötmaterials und Verfahren zum Schwall-Löten |
US6648216B2 (en) | 2000-08-21 | 2003-11-18 | Matsushita Electric Industrial Co., Ltd. | Process and apparatus for flow soldering |
JP2002141658A (ja) | 2000-08-21 | 2002-05-17 | Matsushita Electric Ind Co Ltd | フローはんだ付け方法および装置 |
-
2001
- 2001-09-25 DE DE60140769T patent/DE60140769D1/de not_active Expired - Lifetime
- 2001-09-25 WO PCT/JP2001/008298 patent/WO2002028156A1/ja not_active Application Discontinuation
- 2001-09-25 EP EP03029562A patent/EP1405687B1/de not_active Expired - Lifetime
- 2001-09-25 EP EP01967824A patent/EP1259101A4/de not_active Withdrawn
- 2001-09-25 US US10/148,014 patent/US6805282B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1259101A4 (de) | 2003-04-09 |
EP1405687B1 (de) | 2009-12-09 |
EP1259101A1 (de) | 2002-11-20 |
US20020179693A1 (en) | 2002-12-05 |
EP1405687A2 (de) | 2004-04-07 |
WO2002028156A1 (fr) | 2002-04-04 |
EP1405687A3 (de) | 2005-03-30 |
US6805282B2 (en) | 2004-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |