DE60111989D1 - Härtbare Silikonklebstoffzusammensetzung - Google Patents
Härtbare SilikonklebstoffzusammensetzungInfo
- Publication number
- DE60111989D1 DE60111989D1 DE60111989T DE60111989T DE60111989D1 DE 60111989 D1 DE60111989 D1 DE 60111989D1 DE 60111989 T DE60111989 T DE 60111989T DE 60111989 T DE60111989 T DE 60111989T DE 60111989 D1 DE60111989 D1 DE 60111989D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive composition
- curable silicone
- silicone adhesive
- curable
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013464 silicone adhesive Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- C08L2666/44—Silicon-containing compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/539,103 US6296944B1 (en) | 2000-03-30 | 2000-03-30 | Curable silicone adhesive compositions |
US539103 | 2000-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60111989D1 true DE60111989D1 (de) | 2005-08-25 |
DE60111989T2 DE60111989T2 (de) | 2006-05-24 |
Family
ID=24149782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60111989T Expired - Lifetime DE60111989T2 (de) | 2000-03-30 | 2001-01-16 | Härtbare Silikonklebstoffzusammensetzung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6296944B1 (de) |
EP (1) | EP1138738B1 (de) |
JP (1) | JP5005130B2 (de) |
DE (1) | DE60111989T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100839780B1 (ko) * | 2006-01-18 | 2008-06-19 | 주식회사 엘지화학 | 유연성 기판 반송용 점착제 |
DE102008000353A1 (de) * | 2008-02-20 | 2009-08-27 | Wacker Chemie Ag | Härtbare Polymerabmischungen |
CN103194170A (zh) * | 2013-04-02 | 2013-07-10 | 广东祥新光电科技有限公司 | 一种具有高折射率的改性有机硅封装胶及改性的含硅氢基的聚硅氧烷的制备方法 |
CN112639003B (zh) | 2018-09-19 | 2023-08-11 | 美国陶氏有机硅公司 | 芳基官能化聚硅氧烷中的芳基断裂抑制 |
CN113321571B (zh) * | 2021-06-21 | 2023-05-26 | 万华化学集团股份有限公司 | 一种线性二元醇的合成方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6004679A (en) * | 1991-03-14 | 1999-12-21 | General Electric Company | Laminates containing addition-curable silicone adhesive compositions |
US5164461A (en) | 1991-03-14 | 1992-11-17 | General Electric Company | Addition-curable silicone adhesive compositions |
US5380788A (en) | 1993-12-13 | 1995-01-10 | General Electric Company | Room temperature addition-curable silicone adhesive compositions and N-heterocyclic silane adhesion promoters |
GB2284812B (en) * | 1993-12-20 | 1997-11-26 | Gen Electric Co Plc | Addition-curable silicone adhesive compositions |
DE4416857C1 (de) * | 1994-05-13 | 1995-06-29 | Fraunhofer Ges Forschung | Hydrolysierbare und polymerisierbare Silane, Verfahren zu deren Herstellung sowie deren Verwendung |
US5487948A (en) * | 1995-01-26 | 1996-01-30 | General Electric Company | Bis(bis-silylalkyl) dicarboxylates as adhesion promoters and compositions containing them |
JPH108023A (ja) * | 1996-06-20 | 1998-01-13 | Tokuyama Corp | シリコーン系接着剤組成物 |
US6312818B1 (en) * | 1999-12-22 | 2001-11-06 | General Electric Company | Adhesion enhancing additives for release coating compositions |
US6447922B1 (en) * | 2000-11-20 | 2002-09-10 | General Electric Company | Curable silicon adhesive compositions |
-
2000
- 2000-03-30 US US09/539,103 patent/US6296944B1/en not_active Expired - Lifetime
-
2001
- 2001-01-16 EP EP01300369A patent/EP1138738B1/de not_active Expired - Lifetime
- 2001-01-16 DE DE60111989T patent/DE60111989T2/de not_active Expired - Lifetime
- 2001-01-29 JP JP2001019319A patent/JP5005130B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60111989T2 (de) | 2006-05-24 |
JP2001279224A (ja) | 2001-10-10 |
EP1138738A2 (de) | 2001-10-04 |
US6296944B1 (en) | 2001-10-02 |
JP5005130B2 (ja) | 2012-08-22 |
EP1138738B1 (de) | 2005-07-20 |
EP1138738A3 (de) | 2001-12-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |