DE60031865D1 - Verfahren und vorrichtung zur erkennung eines werkstückes sowie verfahren und vorrichtung zur bestückung - Google Patents

Verfahren und vorrichtung zur erkennung eines werkstückes sowie verfahren und vorrichtung zur bestückung

Info

Publication number
DE60031865D1
DE60031865D1 DE60031865T DE60031865T DE60031865D1 DE 60031865 D1 DE60031865 D1 DE 60031865D1 DE 60031865 T DE60031865 T DE 60031865T DE 60031865 T DE60031865 T DE 60031865T DE 60031865 D1 DE60031865 D1 DE 60031865D1
Authority
DE
Germany
Prior art keywords
workpiece
fitting
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60031865T
Other languages
English (en)
Other versions
DE60031865T2 (de
Inventor
Takashi Yazawa
Hiroshi Uchiyama
Atsushi Tanabe
Yoichi Tanaka
Takahiro Kurokawa
Naoto Mimura
Nobuyuki Kakita
Osamu Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24838099A external-priority patent/JP2001077598A/ja
Priority claimed from JP31506499A external-priority patent/JP4405012B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60031865D1 publication Critical patent/DE60031865D1/de
Publication of DE60031865T2 publication Critical patent/DE60031865T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE60031865T 1999-09-02 2000-08-31 Verfahren und vorrichtung zur erkennung eines werkstückes sowie verfahren und vorrichtung zur bestückung Expired - Lifetime DE60031865T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP24838099 1999-09-02
JP24838099A JP2001077598A (ja) 1999-09-02 1999-09-02 部品認識方法
JP31506499 1999-11-05
JP31506499A JP4405012B2 (ja) 1999-11-05 1999-11-05 部品認識方法及び部品実装方法
PCT/JP2000/005909 WO2001019156A1 (fr) 1999-09-02 2000-08-31 Procede et dispositif d'identification et de montage de pieces

Publications (2)

Publication Number Publication Date
DE60031865D1 true DE60031865D1 (de) 2006-12-28
DE60031865T2 DE60031865T2 (de) 2007-05-24

Family

ID=26538740

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60031865T Expired - Lifetime DE60031865T2 (de) 1999-09-02 2000-08-31 Verfahren und vorrichtung zur erkennung eines werkstückes sowie verfahren und vorrichtung zur bestückung

Country Status (6)

Country Link
US (1) US6948232B1 (de)
EP (1) EP1215954B1 (de)
KR (1) KR100452782B1 (de)
CN (1) CN100381033C (de)
DE (1) DE60031865T2 (de)
WO (1) WO2001019156A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1081998B1 (de) * 1999-09-03 2005-11-30 Matsushita Electric Industrial Co., Ltd. Bauteilen-bestückungsverfahren und Einrichtung
US7630465B2 (en) * 2004-11-23 2009-12-08 Harris Corporation Wireless communications device providing time and frequency-domain channel estimates interpolation and related methods
KR101278010B1 (ko) * 2005-08-02 2013-06-27 파나소닉 주식회사 전자 부품 장착기 및 장착 방법
KR100816071B1 (ko) * 2006-09-22 2008-03-24 미래산업 주식회사 전자부품 픽커 및 이를 구비한 핸들러용 헤드 어셈블리
JP4580972B2 (ja) * 2006-11-09 2010-11-17 パナソニック株式会社 部品実装方法
US8156642B2 (en) * 2007-04-03 2012-04-17 Panasonic Corporation Component mounting method
JP5095542B2 (ja) * 2008-07-24 2012-12-12 Ｊｕｋｉ株式会社 電子部品実装装置
JP5415349B2 (ja) * 2010-04-22 2014-02-12 ヒーハイスト精工株式会社 微小部品配置ユニット
JP5750235B2 (ja) 2010-04-29 2015-07-15 富士機械製造株式会社 製造作業機
CN102860150B (zh) * 2010-04-29 2015-05-13 富士机械制造株式会社 制造作业机
JP6294891B2 (ja) * 2013-10-09 2018-03-14 富士機械製造株式会社 搭載位置最適化プログラム
WO2018105030A1 (ja) * 2016-12-06 2018-06-14 株式会社Ｆｕｊｉ 部品装着方法
CN106767455A (zh) * 2016-12-15 2017-05-31 惠科股份有限公司 驱动芯片的传递交接平台的自动测量方法、设备
US10939597B2 (en) 2017-01-13 2021-03-02 Yamaha Hatsudoki Kabushiki Kaisha Component mounting device
EP3634100B1 (de) * 2017-05-31 2022-06-08 Fuji Corporation Arbeitsmaschine und kalkulationsverfahren
CN110076356B (zh) * 2019-05-29 2024-03-15 无锡迈泽科技有限公司 自动吸料上料数控车床
JP7417371B2 (ja) * 2019-07-12 2024-01-18 芝浦メカトロニクス株式会社 実装装置
CN111104542B (zh) * 2020-01-07 2023-04-18 成都睿琪科技有限责任公司 零件识别管理方法及装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
JP3114034B2 (ja) * 1992-06-05 2000-12-04 ヤマハ発動機株式会社 部品実装方法及び部品実装装置
DE69300850T2 (de) * 1992-07-01 1996-03-28 Yamaha Motor Co Ltd Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
JP2937018B2 (ja) 1994-06-17 1999-08-23 松下電器産業株式会社 電子部品実装装置
JP3379829B2 (ja) 1994-07-12 2003-02-24 ヤマハ発動機株式会社 実装機における部品認識装置
US6044169A (en) * 1995-07-12 2000-03-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
KR0177235B1 (ko) 1995-08-31 1999-04-15 배순훈 칩 마운터용 부품 인식 카메라의 포커스 레벨 조정방법
US6691400B1 (en) 1995-12-15 2004-02-17 Matsushita Electric Industrial Co., Ltd. High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board
SG52900A1 (en) * 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
JPH09246789A (ja) * 1996-03-07 1997-09-19 Brother Ind Ltd 電子部品実装装置
JPH09246794A (ja) 1996-03-14 1997-09-19 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装装置におけるノズルの位置検出方法
JP3769089B2 (ja) 1997-01-20 2006-04-19 ヤマハ発動機株式会社 実装機の部品認識装置
JP2001053496A (ja) * 1999-08-06 2001-02-23 Matsushita Electric Ind Co Ltd 電子部品実装方法
US6606790B2 (en) * 2000-06-21 2003-08-19 Matsushita Electric Industrial Co., Ltd. Component mounter and mounting method

Also Published As

Publication number Publication date
EP1215954A1 (de) 2002-06-19
KR100452782B1 (ko) 2004-10-14
WO2001019156A1 (fr) 2001-03-15
US6948232B1 (en) 2005-09-27
EP1215954A4 (de) 2004-08-18
CN1372785A (zh) 2002-10-02
DE60031865T2 (de) 2007-05-24
CN100381033C (zh) 2008-04-09
EP1215954B1 (de) 2006-11-15
KR20020026603A (ko) 2002-04-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)