DE60027113D1 - Optische Prüfvorrichtung - Google Patents
Optische PrüfvorrichtungInfo
- Publication number
- DE60027113D1 DE60027113D1 DE60027113T DE60027113T DE60027113D1 DE 60027113 D1 DE60027113 D1 DE 60027113D1 DE 60027113 T DE60027113 T DE 60027113T DE 60027113 T DE60027113 T DE 60027113T DE 60027113 D1 DE60027113 D1 DE 60027113D1
- Authority
- DE
- Germany
- Prior art keywords
- optical tester
- tester
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8809—Adjustment for highlighting flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8845—Multiple wavelengths of illumination or detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34024199 | 1999-11-30 | ||
JP34024199A JP2001153621A (ja) | 1999-11-30 | 1999-11-30 | 外観検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60027113D1 true DE60027113D1 (de) | 2006-05-18 |
DE60027113T2 DE60027113T2 (de) | 2006-09-07 |
Family
ID=18335057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60027113T Expired - Fee Related DE60027113T2 (de) | 1999-11-30 | 2000-11-29 | Optische Prüfvorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6801651B2 (de) |
EP (1) | EP1107012B1 (de) |
JP (1) | JP2001153621A (de) |
DE (1) | DE60027113T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10157244B4 (de) * | 2001-11-22 | 2006-05-04 | Leica Microsystems Semiconductor Gmbh | Verfahren und Vorrichtung zur Defektanalyse von Wafern |
DE10330003B4 (de) * | 2003-07-03 | 2007-03-08 | Leica Microsystems Semiconductor Gmbh | Vorrichtung, Verfahren und Computerprogramm zur Wafer-Inspektion |
EP1677127B1 (de) * | 2004-12-29 | 2008-09-03 | eMedStream S.r.l. | Verfahren und System zur Verarbeitung digitaler Ultraschall-Bildsequenzen |
EP1846890A2 (de) * | 2005-01-26 | 2007-10-24 | Vu Medisch Centrum | Abbildungsvorrichtung und verfahren zur bildung eines zusammengesetzten bildes aus mehreren quellenbildern |
JP4984953B2 (ja) * | 2007-02-22 | 2012-07-25 | 株式会社明電舎 | 画像処理装置 |
KR100902170B1 (ko) * | 2008-05-19 | 2009-06-10 | (주)펨트론 | 표면형상 측정장치 |
KR101531709B1 (ko) | 2008-10-17 | 2015-07-06 | 삼성전자 주식회사 | 고감도 컬러 영상을 제공하기 위한 영상 처리 장치 및 방법 |
JP2011226947A (ja) * | 2010-04-21 | 2011-11-10 | Graduate School For The Creation Of New Photonics Industries | 分光イメージング装置及び分光イメージング方法 |
CN102566327B (zh) * | 2010-12-08 | 2016-06-08 | 无锡华润上华科技有限公司 | 显影均匀性调试方法 |
US9939386B2 (en) * | 2012-04-12 | 2018-04-10 | KLA—Tencor Corporation | Systems and methods for sample inspection and review |
CN103900973B (zh) * | 2014-04-24 | 2017-01-04 | 黄晓鹏 | 危险品检测方法 |
EP3232211A4 (de) * | 2014-12-08 | 2018-01-03 | Koh Young Technology Inc. | Verfahren zur inspektion eines anschlusses einer auf einem substrat geformten komponente und substratinspektionsvorrichtung |
JP6834174B2 (ja) * | 2016-05-13 | 2021-02-24 | 株式会社ジェイテクト | 外観検査方法および外観検査装置 |
JP6859627B2 (ja) * | 2016-08-09 | 2021-04-14 | 株式会社ジェイテクト | 外観検査装置 |
JP6859628B2 (ja) | 2016-08-10 | 2021-04-14 | 株式会社ジェイテクト | 外観検査方法および外観検査装置 |
CN109643012B (zh) * | 2016-09-06 | 2021-07-02 | 奥林巴斯株式会社 | 观察装置 |
CN107340294A (zh) * | 2016-12-24 | 2017-11-10 | 重庆都英科技有限公司 | 一种电机换向器自动化视觉检测*** |
JP7068869B2 (ja) * | 2017-03-14 | 2022-05-17 | 株式会社トプコン | 涙液層厚み測定装置及び方法 |
JP7005392B2 (ja) * | 2017-03-14 | 2022-01-21 | 株式会社トプコン | 涙液層厚み測定装置及び方法 |
US11475636B2 (en) * | 2017-10-31 | 2022-10-18 | Vmware, Inc. | Augmented reality and virtual reality engine for virtual desktop infrastucture |
US10621768B2 (en) | 2018-01-09 | 2020-04-14 | Vmware, Inc. | Augmented reality and virtual reality engine at the object level for virtual desktop infrastucture |
JP7132046B2 (ja) * | 2018-09-13 | 2022-09-06 | 株式会社東芝 | 検索装置、検索方法及びプログラム |
JP7315282B2 (ja) | 2019-07-02 | 2023-07-26 | 第一実業ビスウィル株式会社 | 外観検査装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH071776B2 (ja) * | 1983-11-25 | 1995-01-11 | 株式会社日立製作所 | パターン検査装置 |
JPS6244609A (ja) * | 1985-08-23 | 1987-02-26 | Hitachi Ltd | 検査方法 |
EP0266184B1 (de) * | 1986-10-31 | 1995-04-12 | Seiko Epson Corporation | Anzeigevorrichtung vom Projektionstyp |
JPH0499346A (ja) * | 1990-08-17 | 1992-03-31 | Nec Corp | ウェーハ外観検査装置 |
JPH06167460A (ja) * | 1992-05-29 | 1994-06-14 | Omron Corp | 検査装置 |
US5923430A (en) * | 1993-06-17 | 1999-07-13 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
WO1995020811A1 (en) * | 1994-01-31 | 1995-08-03 | Sdl, Inc. | Laser illuminated display system |
JPH08102957A (ja) * | 1994-09-30 | 1996-04-16 | Hitachi Denshi Ltd | 電子内視鏡装置 |
US5726443A (en) * | 1996-01-18 | 1998-03-10 | Chapman Glenn H | Vision system and proximity detector |
JP3657345B2 (ja) * | 1996-04-25 | 2005-06-08 | オリンパス株式会社 | 膜厚検査装置 |
JPH1183455A (ja) | 1997-09-04 | 1999-03-26 | Dainippon Printing Co Ltd | 外観検査装置 |
EP0930498A3 (de) | 1997-12-26 | 1999-11-17 | Nidek Co., Ltd. | Prüfeinrichtung und Verfahren zum Erfassen von Fehlstellen |
JP2001343336A (ja) * | 2000-05-31 | 2001-12-14 | Nidek Co Ltd | 欠陥検査方法及び欠陥検査装置 |
-
1999
- 1999-11-30 JP JP34024199A patent/JP2001153621A/ja not_active Withdrawn
-
2000
- 2000-11-29 EP EP00126105A patent/EP1107012B1/de not_active Expired - Lifetime
- 2000-11-29 DE DE60027113T patent/DE60027113T2/de not_active Expired - Fee Related
- 2000-11-30 US US09/726,122 patent/US6801651B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2001153621A (ja) | 2001-06-08 |
DE60027113T2 (de) | 2006-09-07 |
US6801651B2 (en) | 2004-10-05 |
EP1107012B1 (de) | 2006-04-05 |
EP1107012A1 (de) | 2001-06-13 |
US20010012393A1 (en) | 2001-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |