DE60025618D1 - Kassette zum einbrennen und testen eines wafers - Google Patents
Kassette zum einbrennen und testen eines wafersInfo
- Publication number
- DE60025618D1 DE60025618D1 DE60025618T DE60025618T DE60025618D1 DE 60025618 D1 DE60025618 D1 DE 60025618D1 DE 60025618 T DE60025618 T DE 60025618T DE 60025618 T DE60025618 T DE 60025618T DE 60025618 D1 DE60025618 D1 DE 60025618D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- probe
- plate
- jaws
- male connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US353116 | 1989-05-17 | ||
US09/353,121 US6562636B1 (en) | 1999-07-14 | 1999-07-14 | Wafer level burn-in and electrical test system and method |
US09/353,214 US6340895B1 (en) | 1999-07-14 | 1999-07-14 | Wafer-level burn-in and test cartridge |
US09/353,116 US6580283B1 (en) | 1999-07-14 | 1999-07-14 | Wafer level burn-in and test methods |
US353214 | 1999-07-14 | ||
US353121 | 1999-07-14 | ||
PCT/US2000/019391 WO2001004643A2 (en) | 1999-07-14 | 2000-07-13 | Wafer-level burn-in and test cartridge and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60025618D1 true DE60025618D1 (de) | 2006-04-06 |
DE60025618T2 DE60025618T2 (de) | 2006-08-03 |
Family
ID=27408093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60025618T Expired - Lifetime DE60025618T2 (de) | 1999-07-14 | 2000-07-13 | Kassette zum einbrennen und testen eines wafers |
Country Status (8)
Country | Link |
---|---|
EP (2) | EP1445620A1 (de) |
JP (1) | JP2003504890A (de) |
KR (1) | KR100735111B1 (de) |
CN (1) | CN100492040C (de) |
AT (1) | ATE316247T1 (de) |
AU (1) | AU6747300A (de) |
DE (1) | DE60025618T2 (de) |
WO (1) | WO2001004643A2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4173306B2 (ja) | 2001-11-30 | 2008-10-29 | 東京エレクトロン株式会社 | 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法 |
JP4464237B2 (ja) * | 2004-09-30 | 2010-05-19 | Necエレクトロニクス株式会社 | バーンイン試験方法,及び,それに用いるバーンイン用測定プログラム |
JP2006292727A (ja) * | 2005-03-18 | 2006-10-26 | Alps Electric Co Ltd | 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法 |
US8311758B2 (en) * | 2006-01-18 | 2012-11-13 | Formfactor, Inc. | Methods and apparatuses for dynamic probe adjustment |
WO2007095555A2 (en) * | 2006-02-13 | 2007-08-23 | Finisar Corporation | Automated characterization system for laser chip on a submount |
CN100360944C (zh) * | 2006-03-01 | 2008-01-09 | 友达光电股份有限公司 | 电压检测电路以及电压检测*** |
MY152599A (en) | 2007-02-14 | 2014-10-31 | Eles Semiconductor Equipment S P A | Test of electronic devices at package level using test boards without sockets |
EP1959265A1 (de) | 2007-02-16 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Testen von integrierten Schaltungen auf einem Wafer mit einer die Oberfläche freiliegen lassenden Kassette |
US7924033B2 (en) * | 2008-03-21 | 2011-04-12 | Electro Scientific Industries, Inc. | Compensation tool for calibrating an electronic component testing machine to a standardized value |
US8030957B2 (en) * | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
US8872532B2 (en) | 2009-12-31 | 2014-10-28 | Formfactor, Inc. | Wafer test cassette system |
CN104048907A (zh) * | 2013-03-14 | 2014-09-17 | 深圳市海洋王照明工程有限公司 | 密封圈老化测试装置 |
CN103487613A (zh) * | 2013-09-27 | 2014-01-01 | 安徽赛福电子有限公司 | 电容器芯组耐压测试夹持装置 |
KR101711111B1 (ko) * | 2015-08-21 | 2017-02-28 | 주식회사 쎄믹스 | 웨이퍼 프로버용 카트리지 조립 및 분해 장치 및 그 제어 방법 |
US10094873B2 (en) | 2015-08-28 | 2018-10-09 | Nxp Usa, Inc. | High capacity I/O (input/output) cells |
TWI700499B (zh) * | 2019-07-17 | 2020-08-01 | 美商第一檢測有限公司 | 晶片測試系統 |
CN117443786B (zh) * | 2023-12-22 | 2024-03-12 | 杭州芯云半导体技术有限公司 | 一种基于老化测试的半导体器件分选方法及*** |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4818933A (en) * | 1986-10-08 | 1989-04-04 | Hewlett-Packard Company | Board fixturing system |
EP0369554B1 (de) * | 1987-03-11 | 1994-07-13 | Hewlett-Packard Company | Gerät zum automatischen Aufkratzen einer oxidierten Oberfläche |
US4968931A (en) * | 1989-11-03 | 1990-11-06 | Motorola, Inc. | Apparatus and method for burning in integrated circuit wafers |
US5570032A (en) * | 1993-08-17 | 1996-10-29 | Micron Technology, Inc. | Wafer scale burn-in apparatus and process |
US5621313A (en) * | 1993-09-09 | 1997-04-15 | Tokyo Seimitsu Co., Ltd. | Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers |
KR0140034B1 (ko) * | 1993-12-16 | 1998-07-15 | 모리시다 요이치 | 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법 |
JP3108398B2 (ja) * | 1993-12-21 | 2000-11-13 | 松下電器産業株式会社 | プローブカードの製造方法 |
JP2922486B2 (ja) * | 1993-12-21 | 1999-07-26 | 松下電器産業株式会社 | プローブカード |
JP2828410B2 (ja) * | 1993-12-21 | 1998-11-25 | 松下電器産業株式会社 | プローブカード及び半導体チップの検査方法 |
JP2925964B2 (ja) * | 1994-04-21 | 1999-07-28 | 松下電器産業株式会社 | 半導体ウェハ収納器及び半導体集積回路の検査方法 |
US6577148B1 (en) * | 1994-08-31 | 2003-06-10 | Motorola, Inc. | Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer |
US5808474A (en) * | 1994-11-30 | 1998-09-15 | Lsi Logic Corporation | Test socket for testing integrated circuit packages |
US5777485A (en) * | 1995-03-20 | 1998-07-07 | Tokyo Electron Limited | Probe method and apparatus with improved probe contact |
KR19980021258A (ko) * | 1996-09-14 | 1998-06-25 | 김광호 | 프로브 장치의 프로브 헤드 |
JP3662372B2 (ja) * | 1996-11-07 | 2005-06-22 | 大日本スクリーン製造株式会社 | キャリア載置台 |
US5952840A (en) * | 1996-12-31 | 1999-09-14 | Micron Technology, Inc. | Apparatus for testing semiconductor wafers |
JP3364134B2 (ja) * | 1997-10-20 | 2003-01-08 | 松下電器産業株式会社 | ウェハカセット |
JP3294175B2 (ja) * | 1997-11-05 | 2002-06-24 | 東京エレクトロン株式会社 | 信頼性試験用ウエハ収納室 |
US6084215A (en) * | 1997-11-05 | 2000-07-04 | Tokyo Electron Limited | Semiconductor wafer holder with spring-mounted temperature measurement apparatus disposed therein |
JP2000164656A (ja) * | 1998-11-26 | 2000-06-16 | Tokyo Seimitsu Co Ltd | ウェハのバーンイン用保持具 |
-
2000
- 2000-07-13 AU AU67473/00A patent/AU6747300A/en not_active Abandoned
- 2000-07-13 CN CNB008102813A patent/CN100492040C/zh not_active Expired - Lifetime
- 2000-07-13 EP EP04008959A patent/EP1445620A1/de not_active Withdrawn
- 2000-07-13 KR KR1020027000536A patent/KR100735111B1/ko active IP Right Grant
- 2000-07-13 DE DE60025618T patent/DE60025618T2/de not_active Expired - Lifetime
- 2000-07-13 AT AT00955244T patent/ATE316247T1/de not_active IP Right Cessation
- 2000-07-13 EP EP00955244A patent/EP1218765B1/de not_active Expired - Lifetime
- 2000-07-13 WO PCT/US2000/019391 patent/WO2001004643A2/en active IP Right Grant
- 2000-07-13 JP JP2001510002A patent/JP2003504890A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
ATE316247T1 (de) | 2006-02-15 |
CN100492040C (zh) | 2009-05-27 |
KR20020030082A (ko) | 2002-04-22 |
EP1445620A1 (de) | 2004-08-11 |
WO2001004643A3 (en) | 2002-04-18 |
JP2003504890A (ja) | 2003-02-04 |
CN1384922A (zh) | 2002-12-11 |
AU6747300A (en) | 2001-01-30 |
EP1218765A2 (de) | 2002-07-03 |
DE60025618T2 (de) | 2006-08-03 |
KR100735111B1 (ko) | 2007-07-06 |
EP1218765B1 (de) | 2006-01-18 |
WO2001004643A2 (en) | 2001-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |