DE60025618D1 - Kassette zum einbrennen und testen eines wafers - Google Patents

Kassette zum einbrennen und testen eines wafers

Info

Publication number
DE60025618D1
DE60025618D1 DE60025618T DE60025618T DE60025618D1 DE 60025618 D1 DE60025618 D1 DE 60025618D1 DE 60025618 T DE60025618 T DE 60025618T DE 60025618 T DE60025618 T DE 60025618T DE 60025618 D1 DE60025618 D1 DE 60025618D1
Authority
DE
Germany
Prior art keywords
wafer
probe
plate
jaws
male connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60025618T
Other languages
English (en)
Other versions
DE60025618T2 (de
Inventor
Otto Uher
William Andberg
Charles Carbone
Paul Richmond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aehr Test Systems Inc
Original Assignee
Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/353,121 external-priority patent/US6562636B1/en
Priority claimed from US09/353,214 external-priority patent/US6340895B1/en
Priority claimed from US09/353,116 external-priority patent/US6580283B1/en
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of DE60025618D1 publication Critical patent/DE60025618D1/de
Application granted granted Critical
Publication of DE60025618T2 publication Critical patent/DE60025618T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60025618T 1999-07-14 2000-07-13 Kassette zum einbrennen und testen eines wafers Expired - Lifetime DE60025618T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US353116 1989-05-17
US09/353,121 US6562636B1 (en) 1999-07-14 1999-07-14 Wafer level burn-in and electrical test system and method
US09/353,214 US6340895B1 (en) 1999-07-14 1999-07-14 Wafer-level burn-in and test cartridge
US09/353,116 US6580283B1 (en) 1999-07-14 1999-07-14 Wafer level burn-in and test methods
US353214 1999-07-14
US353121 1999-07-14
PCT/US2000/019391 WO2001004643A2 (en) 1999-07-14 2000-07-13 Wafer-level burn-in and test cartridge and methods

Publications (2)

Publication Number Publication Date
DE60025618D1 true DE60025618D1 (de) 2006-04-06
DE60025618T2 DE60025618T2 (de) 2006-08-03

Family

ID=27408093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60025618T Expired - Lifetime DE60025618T2 (de) 1999-07-14 2000-07-13 Kassette zum einbrennen und testen eines wafers

Country Status (8)

Country Link
EP (2) EP1445620A1 (de)
JP (1) JP2003504890A (de)
KR (1) KR100735111B1 (de)
CN (1) CN100492040C (de)
AT (1) ATE316247T1 (de)
AU (1) AU6747300A (de)
DE (1) DE60025618T2 (de)
WO (1) WO2001004643A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4173306B2 (ja) 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
JP4464237B2 (ja) * 2004-09-30 2010-05-19 Ｎｅｃエレクトロニクス株式会社 バーンイン試験方法，及び，それに用いるバーンイン用測定プログラム
JP2006292727A (ja) * 2005-03-18 2006-10-26 Alps Electric Co Ltd 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
WO2007095555A2 (en) * 2006-02-13 2007-08-23 Finisar Corporation Automated characterization system for laser chip on a submount
CN100360944C (zh) * 2006-03-01 2008-01-09 友达光电股份有限公司 电压检测电路以及电压检测***
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (de) 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testen von integrierten Schaltungen auf einem Wafer mit einer die Oberfläche freiliegen lassenden Kassette
US7924033B2 (en) * 2008-03-21 2011-04-12 Electro Scientific Industries, Inc. Compensation tool for calibrating an electronic component testing machine to a standardized value
US8030957B2 (en) * 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US8872532B2 (en) 2009-12-31 2014-10-28 Formfactor, Inc. Wafer test cassette system
CN104048907A (zh) * 2013-03-14 2014-09-17 深圳市海洋王照明工程有限公司 密封圈老化测试装置
CN103487613A (zh) * 2013-09-27 2014-01-01 安徽赛福电子有限公司 电容器芯组耐压测试夹持装置
KR101711111B1 (ko) * 2015-08-21 2017-02-28 주식회사 쎄믹스 웨이퍼 프로버용 카트리지 조립 및 분해 장치 및 그 제어 방법
US10094873B2 (en) 2015-08-28 2018-10-09 Nxp Usa, Inc. High capacity I/O (input/output) cells
TWI700499B (zh) * 2019-07-17 2020-08-01 美商第一檢測有限公司 晶片測試系統
CN117443786B (zh) * 2023-12-22 2024-03-12 杭州芯云半导体技术有限公司 一种基于老化测试的半导体器件分选方法及***

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818933A (en) * 1986-10-08 1989-04-04 Hewlett-Packard Company Board fixturing system
EP0369554B1 (de) * 1987-03-11 1994-07-13 Hewlett-Packard Company Gerät zum automatischen Aufkratzen einer oxidierten Oberfläche
US4968931A (en) * 1989-11-03 1990-11-06 Motorola, Inc. Apparatus and method for burning in integrated circuit wafers
US5570032A (en) * 1993-08-17 1996-10-29 Micron Technology, Inc. Wafer scale burn-in apparatus and process
US5621313A (en) * 1993-09-09 1997-04-15 Tokyo Seimitsu Co., Ltd. Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers
KR0140034B1 (ko) * 1993-12-16 1998-07-15 모리시다 요이치 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법
JP3108398B2 (ja) * 1993-12-21 2000-11-13 松下電器産業株式会社 プローブカードの製造方法
JP2922486B2 (ja) * 1993-12-21 1999-07-26 松下電器産業株式会社 プローブカード
JP2828410B2 (ja) * 1993-12-21 1998-11-25 松下電器産業株式会社 プローブカード及び半導体チップの検査方法
JP2925964B2 (ja) * 1994-04-21 1999-07-28 松下電器産業株式会社 半導体ウェハ収納器及び半導体集積回路の検査方法
US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5808474A (en) * 1994-11-30 1998-09-15 Lsi Logic Corporation Test socket for testing integrated circuit packages
US5777485A (en) * 1995-03-20 1998-07-07 Tokyo Electron Limited Probe method and apparatus with improved probe contact
KR19980021258A (ko) * 1996-09-14 1998-06-25 김광호 프로브 장치의 프로브 헤드
JP3662372B2 (ja) * 1996-11-07 2005-06-22 大日本スクリーン製造株式会社 キャリア載置台
US5952840A (en) * 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers
JP3364134B2 (ja) * 1997-10-20 2003-01-08 松下電器産業株式会社 ウェハカセット
JP3294175B2 (ja) * 1997-11-05 2002-06-24 東京エレクトロン株式会社 信頼性試験用ウエハ収納室
US6084215A (en) * 1997-11-05 2000-07-04 Tokyo Electron Limited Semiconductor wafer holder with spring-mounted temperature measurement apparatus disposed therein
JP2000164656A (ja) * 1998-11-26 2000-06-16 Tokyo Seimitsu Co Ltd ウェハのバーンイン用保持具

Also Published As

Publication number Publication date
ATE316247T1 (de) 2006-02-15
CN100492040C (zh) 2009-05-27
KR20020030082A (ko) 2002-04-22
EP1445620A1 (de) 2004-08-11
WO2001004643A3 (en) 2002-04-18
JP2003504890A (ja) 2003-02-04
CN1384922A (zh) 2002-12-11
AU6747300A (en) 2001-01-30
EP1218765A2 (de) 2002-07-03
DE60025618T2 (de) 2006-08-03
KR100735111B1 (ko) 2007-07-06
EP1218765B1 (de) 2006-01-18
WO2001004643A2 (en) 2001-01-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition