DE60015649D1 - Polyamidsäure und feine dispergierte Teilchen enthaltende Zusammensetzung und Verfahren zu ihrer Herstellung - Google Patents

Polyamidsäure und feine dispergierte Teilchen enthaltende Zusammensetzung und Verfahren zu ihrer Herstellung

Info

Publication number
DE60015649D1
DE60015649D1 DE60015649T DE60015649T DE60015649D1 DE 60015649 D1 DE60015649 D1 DE 60015649D1 DE 60015649 T DE60015649 T DE 60015649T DE 60015649 T DE60015649 T DE 60015649T DE 60015649 D1 DE60015649 D1 DE 60015649D1
Authority
DE
Germany
Prior art keywords
preparation
composition containing
polyamic acid
dispersed particles
containing polyamic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60015649T
Other languages
English (en)
Other versions
DE60015649T2 (de
Inventor
Tomoyuki Kuwamoto
Tsuyoshi Yamashita
Hayato Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Shokubai Co Ltd
Original Assignee
Nippon Shokubai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Shokubai Co Ltd filed Critical Nippon Shokubai Co Ltd
Publication of DE60015649D1 publication Critical patent/DE60015649D1/de
Application granted granted Critical
Publication of DE60015649T2 publication Critical patent/DE60015649T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
    • C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
    • C08J3/212—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase and solid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
    • C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
    • C08J3/215—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase at least one additive being also premixed with a liquid phase
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
DE60015649T 1999-06-11 2000-06-09 Polyamidsäure enthaltende und mit Feinpartikeln dispergierte Zusammensetzung und Verfahren zu ihrer Herstellung Expired - Lifetime DE60015649T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP16605199 1999-06-11
JP16605199 1999-06-11
JP2000006011 2000-01-07
JP2000006011 2000-01-07

Publications (2)

Publication Number Publication Date
DE60015649D1 true DE60015649D1 (de) 2004-12-16
DE60015649T2 DE60015649T2 (de) 2005-12-01

Family

ID=26490572

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60015649T Expired - Lifetime DE60015649T2 (de) 1999-06-11 2000-06-09 Polyamidsäure enthaltende und mit Feinpartikeln dispergierte Zusammensetzung und Verfahren zu ihrer Herstellung

Country Status (5)

Country Link
US (1) US6441083B1 (de)
EP (1) EP1059324B1 (de)
KR (1) KR100472050B1 (de)
DE (1) DE60015649T2 (de)
TW (1) TW546328B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4445375B2 (ja) * 2003-12-19 2010-04-07 株式会社リコー 中間転写体とその成膜液組成物
JP4584014B2 (ja) * 2005-04-25 2010-11-17 日立マグネットワイヤ株式会社 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法
JP4542463B2 (ja) * 2005-04-25 2010-09-15 日立マグネットワイヤ株式会社 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法
US8030376B2 (en) 2006-07-12 2011-10-04 Minusnine Technologies, Inc. Processes for dispersing substances and preparing composite materials
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
CN101784917B (zh) * 2007-07-25 2014-04-02 株式会社日本触媒 光屏蔽膜
EP2450408A4 (de) * 2009-06-29 2014-04-02 Ube Industries Polyimidvorläuferlösungszusammensetzung mit einem füllstoff und polyimidfi?lm damit
WO2011043467A1 (ja) * 2009-10-09 2011-04-14 宇部興産株式会社 着色ポリイミド成形体及びその製造方法
TWI466949B (zh) * 2009-10-15 2015-01-01 Ind Tech Res Inst 聚醯胺酸樹脂組成物、由其製備之聚醯亞胺薄膜及積層材料
JP5831229B2 (ja) * 2010-05-20 2015-12-09 東洋紡株式会社 遮光フィルム
KR20120106076A (ko) * 2011-03-17 2012-09-26 엘에스전선 주식회사 내 코로나 방전성 절연 도료 조성물 및 이를 도포하여 형성된 절연 피막을 포함하는 절연 전선
US20130102753A1 (en) * 2011-10-25 2013-04-25 Fujifilm Hunt Chemicals, Inc. Low residual solvent polyamideimide powder from suspension polymerization
CN113234321A (zh) * 2021-04-13 2021-08-10 南京翌动新材料科技有限公司 一种陶瓷复合材料的制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE414504A (de) * 1935-04-02
GB2156361B (en) * 1984-03-07 1987-07-15 Mitsui Toatsu Chemicals Iodine-containing conductive resin composition
JPS61281150A (ja) * 1985-06-05 1986-12-11 Nitto Electric Ind Co Ltd ポリイミド粉末およびその製法
JPH0730247B2 (ja) 1986-10-09 1995-04-05 宇部興産株式会社 芳香族ポリアミック酸溶液組成物
JPS63172741A (ja) 1987-01-09 1988-07-16 Asahi Glass Co Ltd 芳香族ポリイミド系フイルム及びその製造方法
JP2624723B2 (ja) 1987-11-04 1997-06-25 宇部興産株式会社 印刷用ポリイミド組成物
JPH03170548A (ja) 1989-11-30 1991-07-24 Mitsui Toatsu Chem Inc ポリイミドフィルム及びその製造方法
AT393271B (de) 1989-12-11 1991-09-25 Chemiefaser Lenzing Ag Kompositteilchen mit polyimid-struktureinheiten und einem kern aus fuellstoff, verfahren zu ihrer herstellung und formkoerper daraus
JPH06145378A (ja) 1992-09-18 1994-05-24 Shin Etsu Chem Co Ltd 易滑性ポリイミドフィルムの製造方法
JP3170548B2 (ja) 1994-03-18 2001-05-28 東芝キヤリア株式会社 空気調和機
US5648407A (en) * 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
KR100233425B1 (ko) * 1995-09-12 1999-12-01 구광시 필름용 폴리아마이드 조성물
US5753306A (en) 1996-09-11 1998-05-19 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of forming a composite coating with particle materials that are readily dispersed in a sprayable polyimide solution
US5780201A (en) 1996-09-27 1998-07-14 Brewer Science, Inc. Ultra thin photolithographically imageable organic black matrix coating material

Also Published As

Publication number Publication date
KR100472050B1 (ko) 2005-03-08
US6441083B1 (en) 2002-08-27
EP1059324B1 (de) 2004-11-10
TW546328B (en) 2003-08-11
EP1059324A1 (de) 2000-12-13
KR20010007321A (ko) 2001-01-26
DE60015649T2 (de) 2005-12-01

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