DE4394317T1 - Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung - Google Patents

Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung

Info

Publication number
DE4394317T1
DE4394317T1 DE4394317T DE4394317T DE4394317T1 DE 4394317 T1 DE4394317 T1 DE 4394317T1 DE 4394317 T DE4394317 T DE 4394317T DE 4394317 T DE4394317 T DE 4394317T DE 4394317 T1 DE4394317 T1 DE 4394317T1
Authority
DE
Germany
Prior art keywords
composition containing
photosensitive composition
polyimide precursor
polyimide
precursor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE4394317T
Other languages
English (en)
Other versions
DE4394317C2 (de
Inventor
Yoshio Matsuoka
Yoshiaki Kawai
Hideo Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of DE4394317T1 publication Critical patent/DE4394317T1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DE4394317T 1992-09-02 1993-09-02 Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung Pending DE4394317T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4257582A JPH0680776A (ja) 1992-09-02 1992-09-02 ポリイミド前駆体及び組成物
PCT/JP1993/001229 WO1994006057A1 (en) 1992-09-02 1993-09-02 Polyimide precursor and photosensitive composition containing the same

Publications (1)

Publication Number Publication Date
DE4394317T1 true DE4394317T1 (de) 1997-07-24

Family

ID=17308273

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4394317T Pending DE4394317T1 (de) 1992-09-02 1993-09-02 Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung
DE4394317A Expired - Lifetime DE4394317C2 (de) 1992-09-02 1993-09-02 Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE4394317A Expired - Lifetime DE4394317C2 (de) 1992-09-02 1993-09-02 Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung

Country Status (4)

Country Link
US (1) US5397682A (de)
JP (1) JPH0680776A (de)
DE (2) DE4394317T1 (de)
WO (1) WO1994006057A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6087006A (en) * 1994-08-31 2000-07-11 Hitachi, Ltd. Surface-protecting film and resin-sealed semiconductor device having said film
US6010825A (en) * 1997-09-11 2000-01-04 Olin Microelectronics Chemicals, Inc. Negatively acting photoresist composition based on polyimide precursors
KR19990057019A (ko) * 1997-12-29 1999-07-15 유현식 감광성 폴리이미드 조성물용 반응성 단량체
JP4614503B2 (ja) * 2000-06-21 2011-01-19 旭化成イーマテリアルズ株式会社 感光性ポリイミド前駆体の製造方法
JP3895945B2 (ja) * 2001-04-24 2007-03-22 ソニーケミカル＆インフォメーションデバイス株式会社 樹脂組成物及び樹脂組成物製造方法
US7018776B2 (en) * 2002-12-12 2006-03-28 Arch Specialty Chemicals, Inc. Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems
US20040161619A1 (en) * 2002-12-12 2004-08-19 Arch Specialty Chemicals, Inc. Process for producing a heat resistant relief structure
KR101001471B1 (ko) * 2003-10-10 2010-12-14 삼성전자주식회사 표면요철구조에 의해 향상된 전하 이동도를 갖는 유기박막트랜지스터
JP2005321648A (ja) * 2004-05-10 2005-11-17 Toyobo Co Ltd ネガ型感光性ポリイミド前駆体組成物
JP2005326579A (ja) * 2004-05-13 2005-11-24 Toyobo Co Ltd ネガ型感光性ポリイミド前駆体組成物
CN100422243C (zh) * 2006-09-05 2008-10-01 浙江大学 聚酰胺酯前体相转化制备超低介电常数聚酰亚胺膜的方法
US7935779B2 (en) * 2008-03-07 2011-05-03 Great Eastern Resins Industrial Co., Ltd. Synthesis of polyimides (PI) from poly-carbodiimides and dianhydrides by sequential self-repetitive reaction (SSRR)
US8071273B2 (en) 2008-03-31 2011-12-06 Dai Nippon Printing Co., Ltd. Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition
TWI413860B (zh) * 2010-02-16 2013-11-01 Asahi Kasei E Materials Corp A negative photosensitive resin composition, a method for manufacturing a hardened embossed pattern, and a semiconductor device
JP6190805B2 (ja) 2012-05-07 2017-08-30 旭化成株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
CN106537122A (zh) 2014-06-27 2017-03-22 脉冲健康有限责任公司 用于羰基检测和定量的方法和装置
KR102350804B1 (ko) * 2015-10-23 2022-01-14 도레이 카부시키가이샤 디스플레이 기판용 수지 조성물, 및 그것을 사용한 내열성 수지 필름, 유기 el 디스플레이 기판 및 유기 el 디스플레이의 제조 방법
TWI637980B (zh) 2017-01-11 2018-10-11 長興材料工業股份有限公司 聚醯亞胺前驅物及其應用
US20220204697A1 (en) * 2020-12-31 2022-06-30 Industrial Technology Research Institute Polymer and resin composition thereof
WO2023176172A1 (ja) * 2022-03-14 2023-09-21 東京応化工業株式会社 ポリイミド樹脂前駆体
WO2023233895A1 (ja) * 2022-06-02 2023-12-07 東京応化工業株式会社 ポリイミド樹脂前駆体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0335620A1 (de) * 1988-03-28 1989-10-04 Canon Kabushiki Kaisha Polymere Verbindungen und Aufzeichnungsmedium daraus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1195039A (en) * 1982-01-04 1985-10-08 David L. Goff Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound
US4548891A (en) * 1983-02-11 1985-10-22 Ciba Geigy Corporation Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators
US4803147A (en) * 1987-11-24 1989-02-07 Hoechst Celanese Corporation Photosensitive polyimide polymer compositions
CA1335817C (en) * 1988-08-24 1995-06-06 Hideaki Takahashi Precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
CA2025681A1 (en) * 1989-09-22 1991-03-23 Allan E. Nader Photoreactive resin compositions developable in a semi-aqueous solution
JP2635901B2 (ja) * 1992-03-13 1997-07-30 インターナショナル・ビジネス・マシーンズ・コーポレイション ポリイミドのネガティブ像形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0335620A1 (de) * 1988-03-28 1989-10-04 Canon Kabushiki Kaisha Polymere Verbindungen und Aufzeichnungsmedium daraus

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
J. Macromol. Sci.Chem. A 21, Nr. 13/14, S. 1641 - 1663, referiert in Hochmolekular- bericht 1986, Referat (Rt) (H. 5439/86) *
JP 01-1 13 460-A, referiert in CPI-Profile Booklet 1989, Referat 89-170566/23 *
JP 01-1 18 513-A, referiert in CPI-Profile Booklet 1989, Referat 89-181453/25 *
JP 04-3 28 127-A, referiert in CPI-Profile Booklet 1993, Referat 92-430177/52 *

Also Published As

Publication number Publication date
WO1994006057A1 (en) 1994-03-17
US5397682A (en) 1995-03-14
DE4394317C2 (de) 1999-07-01
JPH0680776A (ja) 1994-03-22

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