DE4394317T1 - Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung - Google Patents
Polyimid-Vorstufe und diese enthaltende lichtempfindliche ZusammensetzungInfo
- Publication number
- DE4394317T1 DE4394317T1 DE4394317T DE4394317T DE4394317T1 DE 4394317 T1 DE4394317 T1 DE 4394317T1 DE 4394317 T DE4394317 T DE 4394317T DE 4394317 T DE4394317 T DE 4394317T DE 4394317 T1 DE4394317 T1 DE 4394317T1
- Authority
- DE
- Germany
- Prior art keywords
- composition containing
- photosensitive composition
- polyimide precursor
- polyimide
- precursor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4257582A JPH0680776A (ja) | 1992-09-02 | 1992-09-02 | ポリイミド前駆体及び組成物 |
PCT/JP1993/001229 WO1994006057A1 (en) | 1992-09-02 | 1993-09-02 | Polyimide precursor and photosensitive composition containing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE4394317T1 true DE4394317T1 (de) | 1997-07-24 |
Family
ID=17308273
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4394317T Pending DE4394317T1 (de) | 1992-09-02 | 1993-09-02 | Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung |
DE4394317A Expired - Lifetime DE4394317C2 (de) | 1992-09-02 | 1993-09-02 | Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4394317A Expired - Lifetime DE4394317C2 (de) | 1992-09-02 | 1993-09-02 | Polyimid-Vorstufe und diese enthaltende lichtempfindliche Zusammensetzung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5397682A (de) |
JP (1) | JPH0680776A (de) |
DE (2) | DE4394317T1 (de) |
WO (1) | WO1994006057A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6087006A (en) * | 1994-08-31 | 2000-07-11 | Hitachi, Ltd. | Surface-protecting film and resin-sealed semiconductor device having said film |
US6010825A (en) * | 1997-09-11 | 2000-01-04 | Olin Microelectronics Chemicals, Inc. | Negatively acting photoresist composition based on polyimide precursors |
KR19990057019A (ko) * | 1997-12-29 | 1999-07-15 | 유현식 | 감광성 폴리이미드 조성물용 반응성 단량체 |
JP4614503B2 (ja) * | 2000-06-21 | 2011-01-19 | 旭化成イーマテリアルズ株式会社 | 感光性ポリイミド前駆体の製造方法 |
JP3895945B2 (ja) * | 2001-04-24 | 2007-03-22 | ソニーケミカル&インフォメーションデバイス株式会社 | 樹脂組成物及び樹脂組成物製造方法 |
US7018776B2 (en) * | 2002-12-12 | 2006-03-28 | Arch Specialty Chemicals, Inc. | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems |
US20040161619A1 (en) * | 2002-12-12 | 2004-08-19 | Arch Specialty Chemicals, Inc. | Process for producing a heat resistant relief structure |
KR101001471B1 (ko) * | 2003-10-10 | 2010-12-14 | 삼성전자주식회사 | 표면요철구조에 의해 향상된 전하 이동도를 갖는 유기박막트랜지스터 |
JP2005321648A (ja) * | 2004-05-10 | 2005-11-17 | Toyobo Co Ltd | ネガ型感光性ポリイミド前駆体組成物 |
JP2005326579A (ja) * | 2004-05-13 | 2005-11-24 | Toyobo Co Ltd | ネガ型感光性ポリイミド前駆体組成物 |
CN100422243C (zh) * | 2006-09-05 | 2008-10-01 | 浙江大学 | 聚酰胺酯前体相转化制备超低介电常数聚酰亚胺膜的方法 |
US7935779B2 (en) * | 2008-03-07 | 2011-05-03 | Great Eastern Resins Industrial Co., Ltd. | Synthesis of polyimides (PI) from poly-carbodiimides and dianhydrides by sequential self-repetitive reaction (SSRR) |
US8071273B2 (en) | 2008-03-31 | 2011-12-06 | Dai Nippon Printing Co., Ltd. | Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition |
TWI413860B (zh) * | 2010-02-16 | 2013-11-01 | Asahi Kasei E Materials Corp | A negative photosensitive resin composition, a method for manufacturing a hardened embossed pattern, and a semiconductor device |
JP6190805B2 (ja) | 2012-05-07 | 2017-08-30 | 旭化成株式会社 | ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置 |
CN106537122A (zh) | 2014-06-27 | 2017-03-22 | 脉冲健康有限责任公司 | 用于羰基检测和定量的方法和装置 |
KR102350804B1 (ko) * | 2015-10-23 | 2022-01-14 | 도레이 카부시키가이샤 | 디스플레이 기판용 수지 조성물, 및 그것을 사용한 내열성 수지 필름, 유기 el 디스플레이 기판 및 유기 el 디스플레이의 제조 방법 |
TWI637980B (zh) | 2017-01-11 | 2018-10-11 | 長興材料工業股份有限公司 | 聚醯亞胺前驅物及其應用 |
US20220204697A1 (en) * | 2020-12-31 | 2022-06-30 | Industrial Technology Research Institute | Polymer and resin composition thereof |
WO2023176172A1 (ja) * | 2022-03-14 | 2023-09-21 | 東京応化工業株式会社 | ポリイミド樹脂前駆体 |
WO2023233895A1 (ja) * | 2022-06-02 | 2023-12-07 | 東京応化工業株式会社 | ポリイミド樹脂前駆体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0335620A1 (de) * | 1988-03-28 | 1989-10-04 | Canon Kabushiki Kaisha | Polymere Verbindungen und Aufzeichnungsmedium daraus |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1195039A (en) * | 1982-01-04 | 1985-10-08 | David L. Goff | Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound |
US4548891A (en) * | 1983-02-11 | 1985-10-22 | Ciba Geigy Corporation | Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators |
US4803147A (en) * | 1987-11-24 | 1989-02-07 | Hoechst Celanese Corporation | Photosensitive polyimide polymer compositions |
CA1335817C (en) * | 1988-08-24 | 1995-06-06 | Hideaki Takahashi | Precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor |
CA2025681A1 (en) * | 1989-09-22 | 1991-03-23 | Allan E. Nader | Photoreactive resin compositions developable in a semi-aqueous solution |
JP2635901B2 (ja) * | 1992-03-13 | 1997-07-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ポリイミドのネガティブ像形成方法 |
-
1992
- 1992-09-02 JP JP4257582A patent/JPH0680776A/ja not_active Withdrawn
-
1993
- 1993-08-31 US US08/196,189 patent/US5397682A/en not_active Expired - Lifetime
- 1993-09-02 DE DE4394317T patent/DE4394317T1/de active Pending
- 1993-09-02 DE DE4394317A patent/DE4394317C2/de not_active Expired - Lifetime
- 1993-09-02 WO PCT/JP1993/001229 patent/WO1994006057A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0335620A1 (de) * | 1988-03-28 | 1989-10-04 | Canon Kabushiki Kaisha | Polymere Verbindungen und Aufzeichnungsmedium daraus |
Non-Patent Citations (4)
Title |
---|
J. Macromol. Sci.Chem. A 21, Nr. 13/14, S. 1641 - 1663, referiert in Hochmolekular- bericht 1986, Referat (Rt) (H. 5439/86) * |
JP 01-1 13 460-A, referiert in CPI-Profile Booklet 1989, Referat 89-170566/23 * |
JP 01-1 18 513-A, referiert in CPI-Profile Booklet 1989, Referat 89-181453/25 * |
JP 04-3 28 127-A, referiert in CPI-Profile Booklet 1993, Referat 92-430177/52 * |
Also Published As
Publication number | Publication date |
---|---|
WO1994006057A1 (en) | 1994-03-17 |
US5397682A (en) | 1995-03-14 |
DE4394317C2 (de) | 1999-07-01 |
JPH0680776A (ja) | 1994-03-22 |
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