DE4326443C2 - Membrane keyboard with wired component - Google Patents

Membrane keyboard with wired component

Info

Publication number
DE4326443C2
DE4326443C2 DE19934326443 DE4326443A DE4326443C2 DE 4326443 C2 DE4326443 C2 DE 4326443C2 DE 19934326443 DE19934326443 DE 19934326443 DE 4326443 A DE4326443 A DE 4326443A DE 4326443 C2 DE4326443 C2 DE 4326443C2
Authority
DE
Germany
Prior art keywords
openings
membrane keyboard
switching
component
interconnect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19934326443
Other languages
German (de)
Other versions
DE4326443A1 (en
Inventor
Konrad Dipl Farnbauer-Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Freudenberg KG
Original Assignee
Temic Telefunken Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temic Telefunken Microelectronic GmbH filed Critical Temic Telefunken Microelectronic GmbH
Priority to DE19934326443 priority Critical patent/DE4326443C2/en
Priority to GB9415631A priority patent/GB2281452A/en
Priority to FR9409688A priority patent/FR2708760A1/en
Publication of DE4326443A1 publication Critical patent/DE4326443A1/en
Application granted granted Critical
Publication of DE4326443C2 publication Critical patent/DE4326443C2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Push-Button Switches (AREA)

Description

In Folientastaturen mit flexiblen Schaltfolien (beispielsweise Polyesterfolien oder Polyimidfolien) werden als passive Bauelemente (Kondensatoren, Dioden etc.) SMD-Bauelemente eingesetzt. Diese werden mit ihrer Kontaktfläche (Gold, Silber) auf die mit Leitlack bedruckte Schaltfolie aufgeklebt und mittels eines Leitklebers kontaktiert; anschließend wird der Leit­ kleber in einem Ofen ausgehärtet.In membrane keyboards with flexible switching foils (for example polyester films or polyimide films) are used as passive components (capacitors, diodes etc.) SMD components used. These are with their contact surface (gold, silver) on that with conductive lacquer printed switching foil glued on and by means of a Conductive adhesive contacted; then the leader glue hardened in an oven.

Wie der Literaturstelle Ken Gilleo: "Handbook of Flexible Circuits", Van Nostrand Reinhold, New York, 1992, S. 218, zu entnehmen ist, können flexible Schaltfolien mit bedrahteten Bauelementen bestückt und diese durch Löten mit Leitbahnen kontaktiert werden.As the Ken Gilleo reference: "Handbook of Flexible Circuits, "Van Nostrand Reinhold, New York, 1992, p. 218, can be seen, can be flexible Switching foils with wired components and these are contacted by soldering with interconnects.

Der Erfindung liegt die Aufgabe zugrunde, eine Folien­ tastatur anzugeben, bei der die Bestückung der Schalt­ folien mit passiven Bauelementen vereinfacht ist und bei der gleichzeitig Kosten eingespart werden.The invention has for its object a film Specify the keyboard in which the switching foils with passive components is simplified and which saves costs at the same time.

Diese Aufgabe wird erfindungsgemäß durch die Merkmale im Kennzeichen des Patentanspruchs 1 gelöst.This object is achieved by the features solved in the characterizing part of claim 1.

Vorteilhafte Weiterbildungen der Erfindung ergeben sich aus den Unteransprüchen.Advantageous further developments of the invention result from the subclaims.

Als passive Bauelemente werden gehäuste Bauelemente verwendet, die in der Regel zwei oder drei Anschluß­ drähte aufweisen. Jeder Anschlußdraht wird durch zwei Öffnungen in der Schaltfolie durchgeführt (beispielsweise durch vorgefertigte Löcher oder indem die Schaltfolie durchstochen wird), durch eine be­ stimmte Formung der Anschlußdrähte auf der Schaltfolie fixiert; ein Teilstück der Anschlußdrähte wird im Bereich der Öffnungen bündig auf die Schaltfolie aufgebracht, und durch Ausbildung von Druck mit mindestens einer Leitbahn kontaktiert. Beispielsweise werden die Anschlußdrähte gegurteter Bauelemente durch Schaltfolien mit vorgestanzten Löchern automatisch hin­ durchgesteckt und die Bauelemente durch Anpressen der Anschlußdrähte auf den Leitbahnen fixiert und kontaktiert. Gegebenenfalls kann an den Öffnungen der Schaltfolie zur mechanischen Fixierung und/oder auf den Leitbahnen zur elektrischen Kontaktierung der Anschlußdrähte ein Klebepunkt aufgebracht werden.Housed components are used as passive components usually uses two or three connector have wires. Each lead wire is separated by two  Openings made in the switching film (for example through prefabricated holes or by the switching foil is pierced) by a be correct formation of the connecting wires on the switching film fixed; a section of the connecting wires is in the Area of the openings flush with the switching film applied, and by forming pressure with contacted at least one interconnect. For example are the connecting wires of taped components Switch foils with pre-punched holes automatically inserted and the components by pressing the Connection wires fixed on the interconnects and contacted. If necessary, at the openings of the Switching film for mechanical fixation and / or on the Conductors for electrical contacting of the Connection wires an adhesive point are applied.

Die Anschlußdrähte der gehäusten Bauelemente können auf vielfältige Weise und mit vielfältiger Formung durch die Öffnungen der Schaltfolie durchgeführt und mit der Leitbahn kontaktiert werden - beispielsweise können die Anschlußdrähte auf gegenüberliegenden Stirnseiten oder der gleichen Stirnseite des Bauelements kontaktiert werden; die Bestückung und Kontaktierung der Bauele­ mente erfolgt dabei auf der gleichen Oberflächenseite der Schaltfolie.The connection wires of the packaged components can diverse ways and with diverse shaping through the openings of the switching foil performed and with the Can be contacted - for example, the Connecting wires on opposite ends or contacted the same end face of the component will; the assembly and contacting of the components elements take place on the same surface side the switching foil.

Vorteilhaft bei der vorgestellten Folientastatur ist, daßThe advantage of the membrane keyboard presented is that

  • - konventionelle gehäuste Bauelemente eingesetzt werden, so daß gegenüber teueren SMD-Bauelementen Kosten eingespart werden können,- Conventional housed components used be so that compared to expensive SMD components Costs can be saved,
  • - die Anschlußdrähte der gehäusten Bauelemente durch einfache Druckkontaktierung mit den Leitbahnen verbunden werden (aufgrund der Verformung der Schaltfolie ist ein ausreichender Kontakt gewähr­ leistet); daher ist kein (zusätzlicher) Leitkleber erforderlich und die hierdurch bedingten Aushärte­ prozesse (verbunden mit Temperaturzyklen) können entfallen.- The connecting wires of the housed components through simple pressure contact with the interconnects connected (due to the deformation of the  Adequate contact is guaranteed for the switching foil performs); therefore there is no (additional) conductive adhesive required and the resulting hardening processes (associated with temperature cycles) omitted.

In den Fig. 1 bis 6 sind verschiedene Möglichkeiten der Bestückung einer Schaltfolie mit einem zwei Anschlußdrähte aufweisenden passiven Bauelement (bei­ spielsweise eine Diode) dargestellt.In Figs. 1 to 6 are various ways of mounting a switching foil with a two lead wires having passive component (with play, a diode), respectively.

Wie die Fig. 1 in Seitenansicht und die Fig. 2 in Draufsicht zeigt, ist ein Anschlußdraht 2 der Diode 1 gekrümmt durch die beiden Öffnungen 6, 7 in der Schalt­ folie 4 auf der Stirnseite 10 der Diode 1 durchgeführt, der andere Anschlußdraht 3 der Diode 1 ist auf der ent­ gegengesetzten Stirnseite 11 der Diode 1 an seinem End­ stück umgebogen durch die beiden Öffnungen 8, 9 in der Schaltfolie 4 durchgeführt. Jeweils ein Teilstück der beiden Anschlußdrähte 2, 3 wird durch Anpressen bündig auf die Schaltfolie 4 aufgebracht und dadurch elek­ trisch leitend mit der Leitbahn 5 verbunden; Diode 1 und die Kontaktstellen der Anschlußdrähte 2, 3 mit der Leitbahn 5 befinden sich auf der Oberseite der Schalt­ folie 4.As shown in Fig. 1 in side view and Fig. 2 in plan view, a connecting wire 2 of the diode 1 is curved through the two openings 6 , 7 in the switching film 4 on the front side 10 of the diode 1 , the other connecting wire 3 of the Diode 1 is bent on the opposite end face 11 of the diode 1 at its end piece through the two openings 8 , 9 in the switching film 4 . In each case a section of the two connecting wires 2 , 3 is applied flush by pressing onto the switching film 4 and thereby electrically conductively connected to the interconnect 5 ; Diode 1 and the contact points of the connecting wires 2 , 3 with the interconnect 5 are on the top of the switching film 4th

Wie die Fig. 3 in Draufsicht und die Fig. 4 in Sei­ tenansicht zeigt, sind die beiden Öffnungen 6, 7 in der Schaltfolie 4 für den ersten Anschlußdraht 2 und die beiden Öffnungen 8, 9 in der Schaltfolie 4 für den zweiten Anschlußdraht 3 der Diode 1 auf der gleichen Stirnseite 10 der Diode angeordnet und in einem Teil­ stück elektrisch leitend mit den Leitbahnen 5 verbun­ den.As shown in Fig. 3 in plan view and Fig. 4 in Be tenansicht, the two openings 6 , 7 in the switching film 4 for the first wire 2 and the two openings 8 , 9 in the switching film 4 for the second wire 3 are Diode 1 arranged on the same end face 10 of the diode and in one piece electrically connected to the interconnects 5 .

Gemäß der Fig. 5 weist ein Anschlußdraht 2 der Diode 1 an seinem Endstück eine S-förmige Kontur 12 auf, um eine bessere Fixierung der Diode 1 auf der Schaltfolie 4 zu erreichen. According to FIG. 5, a lead wire 2 of the diode 1 at its end an S-shaped contour 12 to provide a better fixation of the diode 1 to reach the switching foil 4.

Gemäß der Fig. 6 ist im Bereich der beiden Öffnungen 6, 7 in der Schaltfolie 4 ein Leitkleber 13 aufge­ bracht, um die Kontaktierung des Anschlußdrahtes 2 mit der Leitbahn 5 zu verbessern.According to FIG. 6 is in the region of the two openings 6, 7 in the switching film 4, a conductive adhesive 13 be applied to improve the contacting of the lead wire 2 with the interconnect. 5

Bei einem Anwendungsfall - beispielsweise eine Folien­ tastatur für Telefonanwendungen mit einer Leuchtdiode als Status-Anzeige - ist diese Leuchtdiode als gehäustes Bauelement mit 2 Anschlußdrähten in der beschriebenen Weise auf eine Polyesterfolie von beispielsweise 250 µm Dicke aufgebracht, auf der eine Leitbahnkonfiguration mittels einer Silber-Leitpaste von beispielsweise 15 µm Dicke und eine Carbonpaste als Passivierung von beispielsweise 15 µm Dicke aufgebracht ist.In one application - for example a film Keypad for telephone applications with a light emitting diode as status display - this LED is as housed component with 2 connecting wires in the described in a polyester film for example, applied 250 microns thick on one Route configuration using a silver conductive paste of, for example, 15 µm thickness and a carbon paste as Passivation of, for example, 15 µm thickness applied is.

Claims (4)

1. Folientastatur mit bedrahtetem Bauelement, bei der mindestens ein passives gehäustes Bauelement (1) mit Anschlußdrähten (2, 3) und mindestens eine Leitbahn (5) auf einer flexiblen Schaltfolie (4) angeordnet sind, gekennzeichnet dadurch:
  • - jeder Anschlußdraht (2; 3) der passiven Bauele­ mente (1) ist durch zwei Öffnungen (6, 7; 8, 9) in der Schaltfolie (4) durchgeführt,
  • - die Schaltfolie (4) ist zwischen den beiden Öffnungen (6, 7; 8, 9) derart verformt, daß ein Teilstück jedes Anschlußdrahts (2, 3) durch Druck bündig auf mindestens eine Leitbahn (5) aufge­ bracht und mit dieser durch Druckkontaktierung elektrisch leitend verbunden ist.
1. membrane keyboard with a wired component, in which at least one passive housed component ( 1 ) with connecting wires ( 2 , 3 ) and at least one interconnect ( 5 ) are arranged on a flexible switching foil ( 4 ), characterized in that :
  • - Each connecting wire ( 2 ; 3 ) of the passive components ( 1 ) is carried out through two openings ( 6 , 7 ; 8 , 9 ) in the switching film ( 4 ),
  • - The switching film ( 4 ) is deformed between the two openings ( 6 , 7 ; 8 , 9 ) in such a way that a portion of each connecting wire ( 2 , 3 ) is brought up flush by pressure on at least one interconnect ( 5 ) and with this by pressure contacting is electrically connected.
2. Folientastatur nach Anspruch 1, dadurch gekenn­ zeichnet, daß die Anschlußdrähte (2, 3) durch Öffnungen (6, 7, 8, 9) auf entgegengesetzten Stirnseiten (10, 11) des passiven Bauelements (1) durchgeführt sind (Fig. 2).2. membrane keyboard according to claim 1, characterized in that the connecting wires ( 2 , 3 ) through openings ( 6 , 7 , 8 , 9 ) on opposite end faces ( 10 , 11 ) of the passive component ( 1 ) are performed ( Fig. 2nd ). 3. Folientastatur nach Anspruch 1, dadurch gekennzeich­ net, daß die Anschlußdrähte (2, 3) durch Öffnungen (6, 7, 8, 9) auf der gleichen Stirnseite (10) des pas­ siven Bauelements (1) durchgeführt sind (Fig. 3).3. membrane keyboard according to claim 1, characterized in that the connecting wires ( 2 , 3 ) through openings ( 6 , 7 , 8 , 9 ) on the same end face ( 10 ) of the passive component ( 1 ) are performed ( Fig. 3rd ). 4. Folientastatur nach einem der Ansprüche 1 bis 3, da­ durch gekennzeichnet, daß im Bereich der Öffnungen (6, 7, 8, 9) Leitpaste (13) auf die Leitbahn(en) (5) aufgebracht ist.4. membrane keyboard according to one of claims 1 to 3, characterized in that in the region of the openings ( 6 , 7 , 8 , 9 ) conductive paste ( 13 ) on the interconnect (s) ( 5 ) is applied.
DE19934326443 1993-08-06 1993-08-06 Membrane keyboard with wired component Expired - Fee Related DE4326443C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19934326443 DE4326443C2 (en) 1993-08-06 1993-08-06 Membrane keyboard with wired component
GB9415631A GB2281452A (en) 1993-08-06 1994-08-03 Electrical connection of components to foil keyboards
FR9409688A FR2708760A1 (en) 1993-08-06 1994-08-04 Membrane keyboard in which the flexible control membrane carries at least one passive component.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19934326443 DE4326443C2 (en) 1993-08-06 1993-08-06 Membrane keyboard with wired component

Publications (2)

Publication Number Publication Date
DE4326443A1 DE4326443A1 (en) 1995-04-20
DE4326443C2 true DE4326443C2 (en) 1996-06-05

Family

ID=6494610

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19934326443 Expired - Fee Related DE4326443C2 (en) 1993-08-06 1993-08-06 Membrane keyboard with wired component

Country Status (3)

Country Link
DE (1) DE4326443C2 (en)
FR (1) FR2708760A1 (en)
GB (1) GB2281452A (en)

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US2927251A (en) * 1955-04-28 1960-03-01 Burroughs Corp Arrangement and method for connecting electrical circuit elements
GB787599A (en) * 1955-06-14 1957-12-11 Pye Ltd Improvements in or relating to electric circuits
US2962801A (en) * 1955-06-14 1960-12-06 Pye Ltd Method of making electric circuits
GB837310A (en) * 1956-11-30 1960-06-09 Hunt Capacitors Ltd A Improvements in or relating to the manufacture of electrical capacitors and other electrical components
DE1825839U (en) * 1960-12-07 1961-02-02 Vdo Schindling FASTENING DEVICE FOR ELECTRICAL COMPONENTS ON PRINTED CIRCUITS.
GB952531A (en) * 1963-06-27 1964-03-18 Oscar Conconi Detachable electric connector with yieldable plate for insertion onto a a fixed counter-plate
US3414666A (en) * 1963-10-14 1968-12-03 Electromechanical Devices Inc Weaved electronic equipment
DE6602868U (en) * 1964-05-05 1969-07-03 Siemens Ag ELECTRICAL COMPONENTS INTENDED FOR ACCOMMODATION IN SO-CALLED PRINTED CIRCUITS.
US3366914A (en) * 1965-05-18 1968-01-30 Western Union Telegraph Co Solderless connector for printed board circuits
GB1156581A (en) * 1966-01-04 1969-07-02 Lucas Industries Ltd Connectors for use with Flexible Printed Circuits
US3915544A (en) * 1974-11-05 1975-10-28 Gen Motors Corp Electrical terminal
JPS6314473Y2 (en) * 1977-05-25 1988-04-22
US4401354A (en) * 1981-07-06 1983-08-30 Buckbee-Mears Company Low cost bus strip
DE3439047A1 (en) * 1984-10-25 1986-04-30 Wilde Membran Impuls Technik GmbH, 5828 Ennepetal Method for fitting a circuit arrangement with electronic components
JPS61203695A (en) * 1985-03-06 1986-09-09 シャープ株式会社 Part mounting system for single-side wiring board
JPS63131416A (en) * 1986-11-20 1988-06-03 ブラザー工業株式会社 Printed circuit board
DE3819143C2 (en) * 1988-06-04 1994-08-04 Hagenuk Telecom Gmbh Circuit carriers, in particular switching foils and circuit boards, with special measures to improve ESD resistance
US4970624A (en) * 1990-01-22 1990-11-13 Molex Incorporated Electronic device employing a conductive adhesive

Also Published As

Publication number Publication date
FR2708760A1 (en) 1995-02-10
GB2281452A (en) 1995-03-01
DE4326443A1 (en) 1995-04-20
GB9415631D0 (en) 1994-09-21

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Owner name: FA. CARL FREUDENBERG, 69469 WEINHEIM, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20110301