DE4218324C2 - Halbleiter-Dehnungssensor - Google Patents
Halbleiter-DehnungssensorInfo
- Publication number
- DE4218324C2 DE4218324C2 DE4218324A DE4218324A DE4218324C2 DE 4218324 C2 DE4218324 C2 DE 4218324C2 DE 4218324 A DE4218324 A DE 4218324A DE 4218324 A DE4218324 A DE 4218324A DE 4218324 C2 DE4218324 C2 DE 4218324C2
- Authority
- DE
- Germany
- Prior art keywords
- parts
- strain sensor
- semiconductor strain
- sensor according
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
- G01B7/20—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3131444A JP2861477B2 (ja) | 1991-06-03 | 1991-06-03 | 半導体歪みセンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
DE4218324A1 DE4218324A1 (de) | 1992-12-10 |
DE4218324C2 true DE4218324C2 (de) | 2003-04-17 |
Family
ID=15058102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4218324A Expired - Lifetime DE4218324C2 (de) | 1991-06-03 | 1992-06-03 | Halbleiter-Dehnungssensor |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2861477B2 (ja) |
DE (1) | DE4218324C2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3284921B2 (ja) * | 1997-04-24 | 2002-05-27 | 富士電機株式会社 | 加速度センサならびに角加速度センサおよびそれらの製造方法 |
FR2947628B1 (fr) * | 2009-07-01 | 2011-08-26 | Ct Tech Des Ind Mecaniques | Procede de fabrication d'une jauge de deformation en circuit integre |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02231571A (ja) * | 1988-04-11 | 1990-09-13 | Nippondenso Co Ltd | 加速度センサ |
US4967597A (en) * | 1988-04-11 | 1990-11-06 | Nippondenso Co., Ltd. | Acceleration sensor |
US4987781A (en) * | 1989-05-03 | 1991-01-29 | Sensym, Incorporated | Accelerometer chip |
US5000817A (en) * | 1984-10-24 | 1991-03-19 | Aine Harry E | Batch method of making miniature structures assembled in wafer form |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3010725B2 (ja) * | 1990-11-01 | 2000-02-21 | 日産自動車株式会社 | 半導体加速度センサ |
-
1991
- 1991-06-03 JP JP3131444A patent/JP2861477B2/ja not_active Expired - Lifetime
-
1992
- 1992-06-03 DE DE4218324A patent/DE4218324C2/de not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000817A (en) * | 1984-10-24 | 1991-03-19 | Aine Harry E | Batch method of making miniature structures assembled in wafer form |
JPH02231571A (ja) * | 1988-04-11 | 1990-09-13 | Nippondenso Co Ltd | 加速度センサ |
US4967597A (en) * | 1988-04-11 | 1990-11-06 | Nippondenso Co., Ltd. | Acceleration sensor |
US4987781A (en) * | 1989-05-03 | 1991-01-29 | Sensym, Incorporated | Accelerometer chip |
Also Published As
Publication number | Publication date |
---|---|
JPH04356971A (ja) | 1992-12-10 |
JP2861477B2 (ja) | 1999-02-24 |
DE4218324A1 (de) | 1992-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8127 | New person/name/address of the applicant |
Owner name: DENSO CORP., KARIYA, AICHI, JP |
|
8110 | Request for examination paragraph 44 | ||
8125 | Change of the main classification |
Ipc: G01P 15/09 |
|
8304 | Grant after examination procedure | ||
8364 | No opposition during term of opposition | ||
R071 | Expiry of right | ||
R071 | Expiry of right |