DE4218324C2 - Halbleiter-Dehnungssensor - Google Patents

Halbleiter-Dehnungssensor

Info

Publication number
DE4218324C2
DE4218324C2 DE4218324A DE4218324A DE4218324C2 DE 4218324 C2 DE4218324 C2 DE 4218324C2 DE 4218324 A DE4218324 A DE 4218324A DE 4218324 A DE4218324 A DE 4218324A DE 4218324 C2 DE4218324 C2 DE 4218324C2
Authority
DE
Germany
Prior art keywords
parts
strain sensor
semiconductor strain
sensor according
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE4218324A
Other languages
German (de)
English (en)
Other versions
DE4218324A1 (de
Inventor
Akira Tai
Toshitaka Yamada
Yoshinori Fujihashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE4218324A1 publication Critical patent/DE4218324A1/de
Application granted granted Critical
Publication of DE4218324C2 publication Critical patent/DE4218324C2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G01B7/20—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
DE4218324A 1991-06-03 1992-06-03 Halbleiter-Dehnungssensor Expired - Lifetime DE4218324C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3131444A JP2861477B2 (ja) 1991-06-03 1991-06-03 半導体歪みセンサ

Publications (2)

Publication Number Publication Date
DE4218324A1 DE4218324A1 (de) 1992-12-10
DE4218324C2 true DE4218324C2 (de) 2003-04-17

Family

ID=15058102

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4218324A Expired - Lifetime DE4218324C2 (de) 1991-06-03 1992-06-03 Halbleiter-Dehnungssensor

Country Status (2)

Country Link
JP (1) JP2861477B2 (ja)
DE (1) DE4218324C2 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3284921B2 (ja) * 1997-04-24 2002-05-27 富士電機株式会社 加速度センサならびに角加速度センサおよびそれらの製造方法
FR2947628B1 (fr) * 2009-07-01 2011-08-26 Ct Tech Des Ind Mecaniques Procede de fabrication d'une jauge de deformation en circuit integre

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02231571A (ja) * 1988-04-11 1990-09-13 Nippondenso Co Ltd 加速度センサ
US4967597A (en) * 1988-04-11 1990-11-06 Nippondenso Co., Ltd. Acceleration sensor
US4987781A (en) * 1989-05-03 1991-01-29 Sensym, Incorporated Accelerometer chip
US5000817A (en) * 1984-10-24 1991-03-19 Aine Harry E Batch method of making miniature structures assembled in wafer form

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3010725B2 (ja) * 1990-11-01 2000-02-21 日産自動車株式会社 半導体加速度センサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000817A (en) * 1984-10-24 1991-03-19 Aine Harry E Batch method of making miniature structures assembled in wafer form
JPH02231571A (ja) * 1988-04-11 1990-09-13 Nippondenso Co Ltd 加速度センサ
US4967597A (en) * 1988-04-11 1990-11-06 Nippondenso Co., Ltd. Acceleration sensor
US4987781A (en) * 1989-05-03 1991-01-29 Sensym, Incorporated Accelerometer chip

Also Published As

Publication number Publication date
JPH04356971A (ja) 1992-12-10
JP2861477B2 (ja) 1999-02-24
DE4218324A1 (de) 1992-12-10

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: DENSO CORP., KARIYA, AICHI, JP

8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: G01P 15/09

8304 Grant after examination procedure
8364 No opposition during term of opposition
R071 Expiry of right
R071 Expiry of right