DE3888488D1 - Eine auf einer integrierten druckplatte durch löten befestigte nadel. - Google Patents

Eine auf einer integrierten druckplatte durch löten befestigte nadel.

Info

Publication number
DE3888488D1
DE3888488D1 DE88905456T DE3888488T DE3888488D1 DE 3888488 D1 DE3888488 D1 DE 3888488D1 DE 88905456 T DE88905456 T DE 88905456T DE 3888488 T DE3888488 T DE 3888488T DE 3888488 D1 DE3888488 D1 DE 3888488D1
Authority
DE
Germany
Prior art keywords
soldering
pressure plate
integrated pressure
needle fastened
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88905456T
Other languages
English (en)
Other versions
DE3888488T2 (de
Inventor
Rolf Olsson
Bjoern Kassman
Karl-Gustaf Olsson
Stig Ernolf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of DE3888488D1 publication Critical patent/DE3888488D1/de
Application granted granted Critical
Publication of DE3888488T2 publication Critical patent/DE3888488T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE3888488T 1987-06-11 1988-05-18 Eine auf einer integrierten druckplatte durch löten befestigte nadel. Expired - Fee Related DE3888488T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE8702441A SE457838B (sv) 1987-06-11 1987-06-11 Stift vilket aer fastsatt vid ett kretskort genom loedning
PCT/SE1988/000253 WO1988010015A1 (en) 1987-06-11 1988-05-18 A pin fastened to a printed circuit board by soldering

Publications (2)

Publication Number Publication Date
DE3888488D1 true DE3888488D1 (de) 1994-04-21
DE3888488T2 DE3888488T2 (de) 1994-06-23

Family

ID=20368829

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3888488T Expired - Fee Related DE3888488T2 (de) 1987-06-11 1988-05-18 Eine auf einer integrierten druckplatte durch löten befestigte nadel.

Country Status (19)

Country Link
US (1) US5000691A (de)
EP (1) EP0321525B1 (de)
KR (1) KR890702281A (de)
AU (1) AU601060B2 (de)
BR (1) BR8807087A (de)
DE (1) DE3888488T2 (de)
DK (1) DK163851C (de)
EG (1) EG18423A (de)
ES (1) ES2008536A6 (de)
FI (1) FI93911C (de)
GR (1) GR880100378A (de)
IE (1) IE63145B1 (de)
MA (1) MA21299A1 (de)
MX (1) MX169273B (de)
MY (1) MY103092A (de)
SE (1) SE457838B (de)
TN (1) TNSN88054A1 (de)
TR (1) TR26976A (de)
WO (1) WO1988010015A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3426801B2 (ja) * 1995-08-15 2003-07-14 株式会社ミツバ 電子部品
ES2140340B1 (es) * 1998-03-13 2000-10-16 Mecanismos Aux Es Ind S A M A Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos.
KR100319291B1 (ko) 1999-03-13 2002-01-09 윤종용 회로 기판 및 회로 기판의 솔더링 방법
US6798191B1 (en) * 1999-08-09 2004-09-28 Power Measurement Ltd. Revenue meter with a graphic user interface being operative to display scalable objects
US6186842B1 (en) * 1999-08-09 2001-02-13 Power Measurement Ltd. Revenue meter bayonet assembly and method of attachment
CN100484371C (zh) * 2004-06-21 2009-04-29 鸿富锦精密工业（深圳）有限公司 防止主机板短路的焊盘
CN1735321A (zh) * 2004-08-11 2006-02-15 鸿富锦精密工业（深圳）有限公司 具有改良焊盘的电路板
US9674943B2 (en) * 2012-12-06 2017-06-06 Intel Corporation Actuation mechanisms for electrical interconnections
TW201517716A (zh) * 2013-10-18 2015-05-01 Delta Electronics Inc 電路板總成及其導線固定裝置與方法
GB201521345D0 (en) * 2015-12-03 2016-01-20 Protosonic Ltd Apparatus for holding a printed circuit board
US10886685B2 (en) * 2019-03-08 2021-01-05 Onanon, Inc. Preformed solder-in-pin system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268653A (en) * 1964-04-29 1966-08-23 Ibm Printed circuit board with solder resistant coating in the through-hole connectors
US3428934A (en) * 1967-02-28 1969-02-18 Amp Inc Electrical connector for printed circuit board
US4236776A (en) * 1978-08-24 1980-12-02 Augat Inc. Electrical contact with improved means for solder wicking and degassing
US4421368A (en) * 1981-07-31 1983-12-20 Western Electric Company, Inc. Lead-receiving socket, multi-socket assembly incorporating same and method of effecting circuit interconnections therewith
US4577923A (en) * 1983-03-24 1986-03-25 Nec Corporation Microwave integrated circuit and mounting device therefor
DE3414343A1 (de) * 1984-04-16 1985-10-17 Siemens AG, 1000 Berlin und 8000 München Elektrischer steckverbinder
US4723925A (en) * 1987-03-02 1988-02-09 Woven Electronics Corporation Crimp contact for a printed circuit board and method

Also Published As

Publication number Publication date
DK163851B (da) 1992-04-06
US5000691A (en) 1991-03-19
MA21299A1 (fr) 1988-12-31
MY103092A (en) 1993-04-30
TNSN88054A1 (fr) 1990-07-10
FI890345A0 (fi) 1989-01-24
ES2008536A6 (es) 1989-07-16
DK62789A (da) 1989-02-10
IE881619L (en) 1988-12-11
SE457838B (sv) 1989-01-30
GR880100378A (el) 1989-03-08
BR8807087A (pt) 1989-10-31
SE8702441D0 (sv) 1987-06-11
EP0321525B1 (de) 1994-03-16
FI93911C (sv) 1995-06-12
KR890702281A (ko) 1989-12-23
MX169273B (es) 1993-06-28
SE8702441L (sv) 1988-12-12
AU601060B2 (en) 1990-08-30
EP0321525A1 (de) 1989-06-28
AU1946888A (en) 1989-01-04
FI93911B (sv) 1995-02-28
TR26976A (tr) 1994-09-12
EG18423A (en) 1993-04-30
DK163851C (da) 1992-09-07
FI890345A (fi) 1989-01-24
WO1988010015A1 (en) 1988-12-15
DK62789D0 (da) 1989-02-10
DE3888488T2 (de) 1994-06-23
IE63145B1 (en) 1995-03-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee