DE3887770T2 - Verfahren und Apparat zum Verbinden von Leiterdrähten für eine integrierte Schaltungsanordnung. - Google Patents

Verfahren und Apparat zum Verbinden von Leiterdrähten für eine integrierte Schaltungsanordnung.

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Publication number
DE3887770T2
DE3887770T2 DE19883887770 DE3887770T DE3887770T2 DE 3887770 T2 DE3887770 T2 DE 3887770T2 DE 19883887770 DE19883887770 DE 19883887770 DE 3887770 T DE3887770 T DE 3887770T DE 3887770 T2 DE3887770 T2 DE 3887770T2
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit arrangement
connecting conductor
conductor wires
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19883887770
Other languages
English (en)
Other versions
DE3887770D1 (de
Inventor
Jon Long
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LSI Corp
Original Assignee
LSI Logic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LSI Logic Corp filed Critical LSI Logic Corp
Publication of DE3887770D1 publication Critical patent/DE3887770D1/de
Application granted granted Critical
Publication of DE3887770T2 publication Critical patent/DE3887770T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
DE19883887770 1987-04-29 1988-04-28 Verfahren und Apparat zum Verbinden von Leiterdrähten für eine integrierte Schaltungsanordnung. Expired - Fee Related DE3887770T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/043,894 US4790897A (en) 1987-04-29 1987-04-29 Device for bonding of lead wires for an integrated circuit device

Publications (2)

Publication Number Publication Date
DE3887770D1 DE3887770D1 (de) 1994-03-24
DE3887770T2 true DE3887770T2 (de) 1994-06-23

Family

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DE19883887770 Expired - Fee Related DE3887770T2 (de) 1987-04-29 1988-04-28 Verfahren und Apparat zum Verbinden von Leiterdrähten für eine integrierte Schaltungsanordnung.

Country Status (5)

Country Link
US (1) US4790897A (de)
EP (1) EP0289102B1 (de)
JP (1) JP2581748B2 (de)
KR (1) KR880013244A (de)
DE (1) DE3887770T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8903250U1 (de) * 1989-03-16 1989-04-27 Blaupunkt-Werke Gmbh, 3200 Hildesheim Aufnahme für eine Vorrichtung zum Drahtbonden von Halbleiterchips
WO1991000619A1 (en) * 1989-06-30 1991-01-10 Raychem Corporation Flying leads for integrated circuits
US5253415A (en) * 1990-03-20 1993-10-19 Die Tech, Inc. Method of making an integrated circuit substrate lead assembly
US5281794A (en) * 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means
JP2676444B2 (ja) * 1991-09-26 1997-11-17 株式会社カイジョー ボンディング装置
CA2079964C (en) * 1992-01-22 1997-12-16 Mitsutoshi Kamakura Apparatus and method for manufacturing optical module
US5713563A (en) * 1995-03-21 1998-02-03 Hewlett-Packard Co. Wire bonding to flexible substrates
JP2003303919A (ja) * 2002-04-10 2003-10-24 Hitachi Ltd 半導体装置及びその製造方法
CN101369545B (zh) * 2007-08-14 2011-07-20 三星电子株式会社 加热块及利用其的引线键合方法
US8752751B2 (en) 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
EP3502806A1 (de) 2017-12-22 2019-06-26 Siemens Aktiengesellschaft Verfahren zum schutz der produktionsdaten zur herstellung eines produkts
CN113035725B (zh) * 2021-02-25 2024-04-02 北京时代民芯科技有限公司 一种深腔键合方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB751253A (en) * 1954-03-18 1956-06-27 Jorgen Bech Improvements in or relating to the preparation of printing plates
US2781554A (en) * 1956-03-02 1957-02-19 Tile Council Of America Method and apparatus for making tile panels
US3812581A (en) * 1969-11-24 1974-05-28 Wells Electronics Method for forming electrical joints between intermediate parts of an elongated conductor and selected conductive elements on an electrical assembly
US3654019A (en) * 1969-12-10 1972-04-04 Gordon Edward Cusick Methods and apparatus for bonding laminate materials
US3617045A (en) * 1970-01-14 1971-11-02 Motorola Inc Vacuum-actuated chuck
US4050618A (en) * 1975-06-19 1977-09-27 Angelucci Sr Thomas L Flexible lead bonding apparatus
US4064917A (en) * 1976-10-18 1977-12-27 Honeywell Information Systems Inc. Apparatus for cutting and forming flexible beam leads of an integrated circuit chip
JPS5632444U (de) * 1979-08-18 1981-03-30
JPS5693336A (en) * 1979-12-27 1981-07-28 Fujitsu Ltd Wire bonder for manufacture of semiconductor device
JPS59121834U (ja) * 1983-02-02 1984-08-16 セイコーエプソン株式会社 ワイヤボンデイング装置
US4627151A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Automatic assembly of integrated circuits
JPS6173343A (ja) * 1984-09-19 1986-04-15 Hitachi Ltd ワイヤボンダ
JPS6178131A (ja) * 1984-09-25 1986-04-21 Toshiba Corp ワイヤボンデイング装置
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system

Also Published As

Publication number Publication date
DE3887770D1 (de) 1994-03-24
US4790897A (en) 1988-12-13
KR880013244A (ko) 1988-11-30
JP2581748B2 (ja) 1997-02-12
EP0289102B1 (de) 1994-02-16
EP0289102A2 (de) 1988-11-02
EP0289102A3 (en) 1990-09-26
JPH02244646A (ja) 1990-09-28

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