DE3788155D1 - Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe. - Google Patents
Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe.Info
- Publication number
- DE3788155D1 DE3788155D1 DE87104937T DE3788155T DE3788155D1 DE 3788155 D1 DE3788155 D1 DE 3788155D1 DE 87104937 T DE87104937 T DE 87104937T DE 3788155 T DE3788155 T DE 3788155T DE 3788155 D1 DE3788155 D1 DE 3788155D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor wafer
- excess material
- removing excess
- wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/856,303 US4752668A (en) | 1986-04-28 | 1986-04-28 | System for laser removal of excess material from a semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3788155D1 true DE3788155D1 (de) | 1993-12-23 |
Family
ID=25323291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87104937T Expired - Lifetime DE3788155D1 (de) | 1986-04-28 | 1987-04-03 | Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4752668A (de) |
EP (1) | EP0247331B1 (de) |
JP (1) | JPS62257731A (de) |
DE (1) | DE3788155D1 (de) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5231471A (en) * | 1986-03-25 | 1993-07-27 | Canon Kabushiki Kaisha | Alignment and exposure apparatus |
JPS62262426A (ja) * | 1986-05-09 | 1987-11-14 | Canon Inc | 露光装置 |
US5148214A (en) * | 1986-05-09 | 1992-09-15 | Canon Kabushiki Kaisha | Alignment and exposure apparatus |
DE3731398A1 (de) * | 1987-09-18 | 1989-04-06 | Zeiss Carl Fa | Verfahren zum erzeugen einer kennzeichnung und/oder markierung auf einer brillenlinse |
IT1223341B (it) * | 1987-11-03 | 1990-09-19 | Ausimont Spa | Procedimento di fotoablazione di film a base di polimeri a struttura pergluoroalchilpolieterea, mediante raggi laser ad eccimeri |
JPH01245993A (ja) * | 1988-03-27 | 1989-10-02 | Semiconductor Energy Lab Co Ltd | 薄膜加工装置 |
US5821175A (en) * | 1988-07-08 | 1998-10-13 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface |
US4940508A (en) * | 1989-06-26 | 1990-07-10 | Digital Equipment Corporation | Apparatus and method for forming die sites in a high density electrical interconnecting structure |
US4987286A (en) * | 1989-10-30 | 1991-01-22 | University Of Iowa Research Foundation | Method and apparatus for removing minute particles from a surface |
US5198881A (en) * | 1989-12-28 | 1993-03-30 | Massachusetts Institute Of Technology | Barrier layer device processing |
US5023424A (en) * | 1990-01-22 | 1991-06-11 | Tencor Instruments | Shock wave particle removal method and apparatus |
US5656229A (en) * | 1990-02-20 | 1997-08-12 | Nikon Corporation | Method for removing a thin film layer |
EP0513359B1 (de) * | 1990-07-31 | 1994-07-20 | Materials And Intelligent Devices Research Co., Ltd. | Yag-laserbearbeitungsmaschine zur bearbeitung von dünnschichten |
US5310990A (en) * | 1991-06-03 | 1994-05-10 | The United Stated Of America As Represented By The Secretary Of The Navy | Method of laser processing ferroelectric materials |
US5319183A (en) * | 1992-02-18 | 1994-06-07 | Fujitsu Limited | Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards |
JP3088548B2 (ja) * | 1992-03-19 | 2000-09-18 | ローム株式会社 | 電子部品の実装方法 |
US5257706A (en) * | 1992-09-29 | 1993-11-02 | Bausch & Lomb Incorporated | Method of cleaning laser ablation debris |
US5643801A (en) * | 1992-11-06 | 1997-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing method and alignment |
US5367143A (en) * | 1992-12-30 | 1994-11-22 | International Business Machines Corporation | Apparatus and method for multi-beam drilling |
US5315604A (en) * | 1993-01-28 | 1994-05-24 | International Business Machines Corporation | Optical structure for adjusting the peak power of a laser beam |
US6489589B1 (en) | 1994-02-07 | 2002-12-03 | Board Of Regents, University Of Nebraska-Lincoln | Femtosecond laser utilization methods and apparatus and method for producing nanoparticles |
WO1996021534A1 (fr) * | 1995-01-13 | 1996-07-18 | Tokai Kogyo Mishin Kabushiki Kaisha | Dispositif de travail au laser et machine a coudre l'utilisant |
FR2731637B1 (fr) * | 1995-03-16 | 1997-05-16 | Aerospatiale | Procede et appareil pour eliminer, par photo-ablation, de la matiere d'une masse polymere |
DE29505985U1 (de) * | 1995-04-06 | 1995-07-20 | Bestenlehrer, Alexander, 91074 Herzogenaurach | Vorrichtung zum Bearbeiten, insbesondere zum Polieren und Strukturieren von beliebigen 3D-Formflächen mittels eines Laserstrahls |
WO1996033839A1 (en) | 1995-04-26 | 1996-10-31 | Minnesota Mining And Manufacturing Company | Method and apparatus for step and repeat exposures |
IL115934A0 (en) * | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Laser processing chamber with cassette cell |
IL115931A0 (en) | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Laser stripping improvement by modified gas composition |
IL115933A0 (en) | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Process and apparatus for oblique beam revolution for the effective laser stripping of sidewalls |
US5874011A (en) * | 1996-08-01 | 1999-02-23 | Revise, Inc. | Laser-induced etching of multilayer materials |
US5973764A (en) * | 1997-06-19 | 1999-10-26 | Svg Lithography Systems, Inc. | Vacuum assisted debris removal system |
IL121890A (en) * | 1997-10-06 | 2000-11-21 | Dov Zahavi | Laser assisted polishing |
US6494217B2 (en) | 1998-03-12 | 2002-12-17 | Motorola, Inc. | Laser cleaning process for semiconductor material and the like |
IL127720A0 (en) * | 1998-12-24 | 1999-10-28 | Oramir Semiconductor Ltd | Local particle cleaning |
US6364386B1 (en) * | 1999-10-27 | 2002-04-02 | Agilent Technologies, Inc. | Apparatus and method for handling an integrated circuit |
US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
AU2001282861A1 (en) * | 2000-07-24 | 2002-02-05 | Florida State University Research Foundation | Method and apparatus for removal of minute particles from a surface using thermophoresis to prevent particle redeposition |
US20020029956A1 (en) * | 2000-07-24 | 2002-03-14 | Allen Susan Davis | Method and apparatus for removing minute particles from a surface |
US6805751B2 (en) | 2000-07-24 | 2004-10-19 | Alkansas State University | Method and apparatus for removal of minute particles from a surface using thermophoresis to prevent particle redeposition |
US6674058B1 (en) | 2000-09-20 | 2004-01-06 | Compucyte Corporation | Apparatus and method for focusing a laser scanning cytometer |
US6777645B2 (en) * | 2001-03-29 | 2004-08-17 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US20020170897A1 (en) * | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
US6937350B2 (en) * | 2001-06-29 | 2005-08-30 | Massachusetts Institute Of Technology | Apparatus and methods for optically monitoring thickness |
US20030138709A1 (en) * | 2001-11-09 | 2003-07-24 | Burbank Daniel P. | Wafer fabrication having improved laserwise alignment recovery |
TWI236944B (en) * | 2001-12-17 | 2005-08-01 | Tokyo Electron Ltd | Film removal method and apparatus, and substrate processing system |
DE10203795B4 (de) * | 2002-01-31 | 2021-12-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Halbleiterbauelements |
TWI226139B (en) * | 2002-01-31 | 2005-01-01 | Osram Opto Semiconductors Gmbh | Method to manufacture a semiconductor-component |
JP2003302745A (ja) * | 2002-04-12 | 2003-10-24 | Dainippon Printing Co Ltd | 異物の無害化方法 |
KR20040111319A (ko) * | 2002-05-13 | 2004-12-31 | 가부시기가이샤 디스코 | 레이저빔을 사용한 가공기 |
US7015418B2 (en) | 2002-05-17 | 2006-03-21 | Gsi Group Corporation | Method and system for calibrating a laser processing system and laser marking system utilizing same |
EP2894678A1 (de) | 2003-01-31 | 2015-07-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements |
DE10313644A1 (de) | 2003-03-26 | 2004-10-07 | Leica Microsystems Semiconductor Gmbh | Vorrichtung und Verfahren zum Reduzieren der elektronenstrahlinduzierten Abscheidung von Kontaminationsprodukten |
JP2006317726A (ja) * | 2005-05-13 | 2006-11-24 | Nec Lcd Technologies Ltd | 断線修正方法及びアクティブマトリックス基板の製造方法並びに表示装置 |
US20070022623A1 (en) * | 2005-07-29 | 2007-02-01 | Board Of Regents Of University Of Nebraska | Laser surface drying |
US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
JP2007144494A (ja) * | 2005-11-30 | 2007-06-14 | Tokyo Electron Ltd | レーザー処理装置及びレーザー処理方法 |
US20080067160A1 (en) * | 2006-09-14 | 2008-03-20 | Jouni Suutarinen | Systems and methods for laser cutting of materials |
WO2011009427A1 (de) | 2009-07-23 | 2011-01-27 | Schaeffler Technologies Gmbh & Co. Kg | Verfahren zur herstellung eines reibbelags und reibbelag |
DE102011001322A1 (de) * | 2011-03-16 | 2012-09-20 | Ipg Laser Gmbh | Maschine und Verfahren zur Materialbearbeitung von Werkstücken mit einem Laserstrahl |
DE102011078825B4 (de) * | 2011-07-07 | 2018-07-19 | Sauer Gmbh Lasertec | Verfahren und Laserbearbeitungsmaschine zur Bearbeitung eines Werkstücks |
CN103170481A (zh) * | 2011-12-26 | 2013-06-26 | 财团法人金属工业研究发展中心 | 放电加工模具表面清洁方法 |
CN103048815B (zh) * | 2013-01-15 | 2015-09-09 | 深圳市华星光电技术有限公司 | 阵列基板修复装置及方法 |
EP3249394B1 (de) * | 2016-05-26 | 2018-09-12 | Malvern Panalytical B.V. | Röntgenanalyse von bohrflüssigkeit |
JP7168430B2 (ja) * | 2018-12-04 | 2022-11-09 | 株式会社アイシン福井 | レーザ溶接装置 |
KR20220011848A (ko) * | 2020-07-21 | 2022-02-03 | 삼성디스플레이 주식회사 | 레이저 장치 및 표시 장치의 제조 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3569660A (en) * | 1968-07-29 | 1971-03-09 | Nat Res Dev | Laser cutting apparatus |
DE2060688A1 (de) * | 1970-12-10 | 1972-06-22 | Blaupunkt Werke Gmbh | Schaltuhr mit Ziffernanzeige |
US3866398A (en) * | 1973-12-20 | 1975-02-18 | Texas Instruments Inc | In-situ gas-phase reaction for removal of laser-scribe debris |
JPS55109237A (en) * | 1979-02-17 | 1980-08-22 | Inoue Japax Res Inc | Apparatus for production of figured plate glass |
DE3008176C2 (de) * | 1979-03-07 | 1986-02-20 | Crosfield Electronics Ltd., London | Gravieren von Druckzylindern |
US4370175A (en) * | 1979-12-03 | 1983-01-25 | Bernard B. Katz | Method of annealing implanted semiconductors by lasers |
JPS57102016A (en) * | 1980-12-17 | 1982-06-24 | Hitachi Ltd | Pattern generator |
JPS58170037A (ja) * | 1982-03-31 | 1983-10-06 | Toshiba Corp | 配線の切断方法及び切断装置 |
JPS58213424A (ja) * | 1982-06-07 | 1983-12-12 | Hitachi Ltd | パタ−ン検出方法 |
US4577958A (en) * | 1982-06-18 | 1986-03-25 | Eaton Optimetrix, Inc. | Bore-sighted step-and-repeat projection alignment and exposure system |
US4414059A (en) * | 1982-12-09 | 1983-11-08 | International Business Machines Corporation | Far UV patterning of resist materials |
DE3333386A1 (de) * | 1983-09-15 | 1985-04-11 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und einrichtung zum beschriften von teilen, insbesondere von elektronischen bauelementen |
-
1986
- 1986-04-28 US US06/856,303 patent/US4752668A/en not_active Expired - Lifetime
-
1987
- 1987-03-13 JP JP62057039A patent/JPS62257731A/ja active Pending
- 1987-04-03 DE DE87104937T patent/DE3788155D1/de not_active Expired - Lifetime
- 1987-04-03 EP EP87104937A patent/EP0247331B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4752668A (en) | 1988-06-21 |
EP0247331B1 (de) | 1993-11-18 |
EP0247331A2 (de) | 1987-12-02 |
EP0247331A3 (en) | 1989-10-11 |
JPS62257731A (ja) | 1987-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |