DE3769158D1 - Optoelektronische vorrichtung zum oberflaechigen einbau. - Google Patents
Optoelektronische vorrichtung zum oberflaechigen einbau.Info
- Publication number
- DE3769158D1 DE3769158D1 DE8787200070T DE3769158T DE3769158D1 DE 3769158 D1 DE3769158 D1 DE 3769158D1 DE 8787200070 T DE8787200070 T DE 8787200070T DE 3769158 T DE3769158 T DE 3769158T DE 3769158 D1 DE3769158 D1 DE 3769158D1
- Authority
- DE
- Germany
- Prior art keywords
- surface mounting
- optoelectronic device
- optoelectronic
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8601028A FR2593930B1 (fr) | 1986-01-24 | 1986-01-24 | Dispositif opto-electronique pour montage en surface |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3769158D1 true DE3769158D1 (de) | 1991-05-16 |
Family
ID=9331467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787200070T Expired - Lifetime DE3769158D1 (de) | 1986-01-24 | 1987-01-19 | Optoelektronische vorrichtung zum oberflaechigen einbau. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4727457A (de) |
EP (1) | EP0230336B1 (de) |
JP (1) | JP2643935B2 (de) |
KR (1) | KR950000110B1 (de) |
DE (1) | DE3769158D1 (de) |
FR (1) | FR2593930B1 (de) |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2065940T3 (es) * | 1989-05-31 | 1995-03-01 | Siemens Ag | Opto-componente montable en la superficie. |
DE58909888C5 (de) * | 1989-05-31 | 2017-03-02 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement |
US5834799A (en) * | 1989-08-28 | 1998-11-10 | Lsi Logic | Optically transmissive preformed planar structures |
US4935856A (en) * | 1989-10-05 | 1990-06-19 | Dialight Corporation | Surface mounted LED package |
US4959761A (en) * | 1989-12-21 | 1990-09-25 | Dialight Corporation | Surface mounted led package |
US5165784A (en) * | 1991-07-15 | 1992-11-24 | Arriflex Corporation | Adjustable photography light that maintains constant color temperature |
US5302778A (en) * | 1992-08-28 | 1994-04-12 | Eastman Kodak Company | Semiconductor insulation for optical devices |
EP0646971B1 (de) * | 1993-09-30 | 1997-03-12 | Siemens Aktiengesellschaft | Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung |
AU2239595A (en) * | 1994-04-04 | 1995-10-23 | Kevin Mcdermott | Electronic wide angle lighting device |
GB2295274A (en) * | 1994-11-17 | 1996-05-22 | Teledyne Ind | Optical lens system for light emitting diodes |
FI108106B (fi) * | 1996-11-25 | 2001-11-15 | Modular Technology Group Engin | Menetelmä johde-elementin valmistamiseksi ja johde-elementti |
DE19653054A1 (de) | 1996-12-19 | 1998-07-02 | Telefunken Microelectron | Optoelektronisches Bauelement zur Datenübertragung |
US6020628A (en) * | 1997-07-21 | 2000-02-01 | Olin Corporation | Optical component package with a hermetic seal |
JP2001518692A (ja) * | 1997-07-29 | 2001-10-16 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト | 光電素子 |
DE19755734A1 (de) | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
JPH11194251A (ja) * | 1998-01-07 | 1999-07-21 | Minolta Co Ltd | レンズ保持構造 |
US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
DE19918370B4 (de) | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
EP1059668A3 (de) * | 1999-06-09 | 2007-07-18 | Sanyo Electric Co., Ltd. | Integrierte Hybridschaltungsanordnung |
US6370837B1 (en) | 1999-08-04 | 2002-04-16 | Anthony B. Mcmahon | System for laying masonry blocks |
DE19940319B4 (de) * | 1999-08-25 | 2004-10-14 | Osram Opto Semiconductors Gmbh | Verfahren zum spannungsarmen Aufsetzen einer Linse auf ein oberflächenmontierbares optoelektronisches Bauelement |
US6305821B1 (en) * | 2000-02-08 | 2001-10-23 | Gen-Home Technology Co., Ltd. | Led lamp having ball-shaped light diffusing modifier |
US7049761B2 (en) | 2000-02-11 | 2006-05-23 | Altair Engineering, Inc. | Light tube and power supply circuit |
DE10023353A1 (de) * | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
FR2824953B1 (fr) * | 2001-05-18 | 2004-07-16 | St Microelectronics Sa | Boitier semi-conducteur optique a lentille incorporee et blindage |
KR100880875B1 (ko) * | 2001-07-20 | 2009-01-30 | 마이클 사약 | 이미지 캡처 장치에 광학적으로 연결된 렌즈 시스템 |
US6950242B2 (en) * | 2001-07-20 | 2005-09-27 | Michel Sayag | Design and fabrication process for a lens system optically coupled to an image-capture device |
JP3948650B2 (ja) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
AUPR851301A0 (en) * | 2001-10-29 | 2001-11-29 | Woodward, Robert | Optical guide system |
US20030156819A1 (en) * | 2002-02-15 | 2003-08-21 | Mark Pruss | Optical waveguide |
GB0209016D0 (en) * | 2002-04-19 | 2002-05-29 | Zarlink Semiconductor Ab | Optical transducer with farfield modifier |
DE10229067B4 (de) * | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
US6896381B2 (en) * | 2002-10-11 | 2005-05-24 | Light Prescriptions Innovators, Llc | Compact folded-optics illumination lens |
US7042655B2 (en) * | 2002-12-02 | 2006-05-09 | Light Prescriptions Innovators, Llc | Apparatus and method for use in fulfilling illumination prescription |
TWI237546B (en) | 2003-01-30 | 2005-08-01 | Osram Opto Semiconductors Gmbh | Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component |
US7377671B2 (en) * | 2003-02-04 | 2008-05-27 | Light Prescriptions Innovators, Llc | Etendue-squeezing illumination optics |
US8075147B2 (en) * | 2003-05-13 | 2011-12-13 | Light Prescriptions Innovators, Llc | Optical device for LED-based lamp |
US7329029B2 (en) * | 2003-05-13 | 2008-02-12 | Light Prescriptions Innovators, Llc | Optical device for LED-based lamp |
US7021797B2 (en) * | 2003-05-13 | 2006-04-04 | Light Prescriptions Innovators, Llc | Optical device for repositioning and redistributing an LED's light |
WO2004109813A2 (de) * | 2003-05-30 | 2004-12-16 | Osram Opto Semiconductors Gmbh | Lumineszenzdiode |
JP4120813B2 (ja) * | 2003-06-12 | 2008-07-16 | セイコーエプソン株式会社 | 光学部品およびその製造方法 |
EP1664851B1 (de) * | 2003-07-28 | 2014-11-12 | Light Prescriptions Innovators, LLC. | Dreidimensionales gleichzeitiges mehrfachoberflächen-verfahren und daraus entwickelte freiform-beleuchtungsoptik |
WO2005012952A2 (en) * | 2003-07-29 | 2005-02-10 | Light Prescriptions Innovators, Llc | Circumferentially emitting luminaires and lens elements formed by transverse-axis profile-sweeps |
WO2005020338A1 (ja) * | 2003-08-26 | 2005-03-03 | Sumitomo Electric Industries, Ltd. | 半導体発光素子搭載部材、それを用いた発光ダイオード構成部材、およびそれを用いた発光ダイオード |
JP2005093610A (ja) * | 2003-09-16 | 2005-04-07 | Sumitomo Electric Ind Ltd | 光受信器 |
JP4385741B2 (ja) * | 2003-11-25 | 2009-12-16 | パナソニック電工株式会社 | 発光装置 |
US8975646B2 (en) * | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
DE102004045950A1 (de) * | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
KR100646093B1 (ko) * | 2004-12-17 | 2006-11-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
US20060145321A1 (en) * | 2004-12-30 | 2006-07-06 | Rohm And Haas Electronic Materials Llc | Microcomponent holder and method for manufacture thereof |
US20060187653A1 (en) * | 2005-02-10 | 2006-08-24 | Olsson Mark S | LED illumination devices |
CN101228391B (zh) * | 2005-07-28 | 2010-09-29 | 光处方革新有限公司 | 用于背光源和前灯的聚光本领-保持的照明光学器件 |
US8631787B2 (en) * | 2005-07-28 | 2014-01-21 | Light Prescriptions Innovators, Llc | Multi-junction solar cells with a homogenizer system and coupled non-imaging light concentrator |
EP1920285A4 (de) | 2005-07-28 | 2010-11-03 | Light Prescriptions Innovators | Linsenförmige optische freiformelemente und ihre anwendung auf kondensatoren und scheinwerfer |
US20070139792A1 (en) * | 2005-12-21 | 2007-06-21 | Michel Sayag | Adjustable apodized lens aperture |
WO2008008994A2 (en) * | 2006-07-14 | 2008-01-17 | Light Prescriptions Innovators, Llc | Brightness-enhancing film |
WO2008022064A2 (en) * | 2006-08-10 | 2008-02-21 | Light Prescriptions Innovators, Llc | Led light recycling device |
WO2008022065A2 (en) * | 2006-08-11 | 2008-02-21 | Light Prescriptions Innovators, Llc | Led luminance-enhancement and color-mixing by rotationally multiplexed beam-combining |
US8172434B1 (en) | 2007-02-23 | 2012-05-08 | DeepSea Power and Light, Inc. | Submersible multi-color LED illumination system |
US8118447B2 (en) | 2007-12-20 | 2012-02-21 | Altair Engineering, Inc. | LED lighting apparatus with swivel connection |
WO2009105198A2 (en) * | 2008-02-21 | 2009-08-27 | Light Prescriptions Innovators, Llc | Spherically emitting remote phosphor |
US8360599B2 (en) | 2008-05-23 | 2013-01-29 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
JP2010034370A (ja) * | 2008-07-30 | 2010-02-12 | Kyocera Corp | 太陽電池ユニット |
JP2010034369A (ja) * | 2008-07-30 | 2010-02-12 | Kyocera Corp | 太陽電池ユニットおよび太陽電池ユニット用パッケージ |
JP2010034371A (ja) * | 2008-07-30 | 2010-02-12 | Kyocera Corp | 太陽電池装置および太陽電池装置用パッケージ |
US8214084B2 (en) | 2008-10-24 | 2012-07-03 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US7938562B2 (en) | 2008-10-24 | 2011-05-10 | Altair Engineering, Inc. | Lighting including integral communication apparatus |
DE102010000942B4 (de) * | 2010-01-15 | 2022-08-25 | Infineon Technologies Ag | Verfahren zur Herstellung eines Leistungshalbleitermoduls |
CA2794541C (en) | 2010-03-26 | 2018-05-01 | David L. Simon | Inside-out led bulb |
WO2011119921A2 (en) | 2010-03-26 | 2011-09-29 | Altair Engineering, Inc. | Led light with thermoelectric generator |
US8764210B2 (en) | 2010-07-19 | 2014-07-01 | Greenwave Reality Pte Ltd. | Emitting light using multiple phosphors |
US8820981B2 (en) | 2010-07-19 | 2014-09-02 | Greenwave Reality Pte Ltd | Electrically controlled glass in a lamp |
WO2012058556A2 (en) | 2010-10-29 | 2012-05-03 | Altair Engineering, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
DE102013106948A1 (de) * | 2013-07-02 | 2015-01-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
US9343639B2 (en) * | 2013-11-29 | 2016-05-17 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) device having lens protective structure and method of fabrication |
US11112084B1 (en) * | 2015-02-13 | 2021-09-07 | Jerome H. Simon | Refracting elements, including ball lenses that concentrate and provide unobstructed optical pathways from multiple light sources |
FR3037190B1 (fr) * | 2015-06-02 | 2017-06-16 | Radiall Sa | Module optoelectronique pour liaison optique sans contact mecanique, ensemble de modules, systeme d'interconnexion, procede de realisation et de connexion a une carte associes |
CN113874657A (zh) | 2019-06-03 | 2021-12-31 | 昕诺飞控股有限公司 | 发光设备 |
CN112864298A (zh) * | 2021-01-08 | 2021-05-28 | 厦门市信达光电科技有限公司 | 一种小角度led封装结构及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4206493A (en) * | 1978-10-10 | 1980-06-03 | North American Philips Corporation | Multiple fault indicator light package |
JPS5586175A (en) * | 1978-12-22 | 1980-06-28 | Canon Inc | Photodiode |
JPS56120177A (en) * | 1980-02-27 | 1981-09-21 | Toshiba Corp | Semiconductor luminescence device |
JPS56152274A (en) * | 1980-04-26 | 1981-11-25 | Nec Home Electronics Ltd | Manufacture of lens cap for photosemiconductor |
JPS5932986Y2 (ja) * | 1980-10-02 | 1984-09-14 | 富士通株式会社 | オプテイカルフアイバ−入力装置 |
WO1982004500A1 (en) * | 1981-06-12 | 1982-12-23 | Inc Motorola | Led having self-aligned lens |
JPS58158460U (ja) * | 1982-04-16 | 1983-10-22 | 三菱電機株式会社 | 半導体発光装置 |
JPS58225673A (ja) * | 1982-06-23 | 1983-12-27 | Nec Corp | 半導体装置 |
JPS59138838U (ja) * | 1983-03-08 | 1984-09-17 | 株式会社ニコン | カメラのフアインダ−内表示装置 |
US4521835A (en) * | 1983-05-17 | 1985-06-04 | Gulf & Western | Flexible elongated lighting system |
FR2554606B1 (fr) * | 1983-11-04 | 1987-04-10 | Thomson Csf | Dispositif optique de concentration du rayonnement lumineux emis par une diode electroluminescente, et diode electroluminescente comportant un tel dispositif |
JPS60102605A (ja) * | 1983-11-10 | 1985-06-06 | Mitsubishi Electric Corp | 光半導体装置 |
JPS60147178A (ja) * | 1984-01-11 | 1985-08-03 | Canon Inc | Ledアレイ |
US4555749A (en) * | 1984-05-07 | 1985-11-26 | General Instrument Corporation | LED Circuit board indicator housing and tie-bar assembly |
-
1986
- 1986-01-24 FR FR8601028A patent/FR2593930B1/fr not_active Expired
- 1986-09-22 US US06/910,105 patent/US4727457A/en not_active Expired - Lifetime
-
1987
- 1987-01-19 EP EP87200070A patent/EP0230336B1/de not_active Expired - Lifetime
- 1987-01-19 DE DE8787200070T patent/DE3769158D1/de not_active Expired - Lifetime
- 1987-01-21 KR KR1019870000447A patent/KR950000110B1/ko not_active IP Right Cessation
- 1987-01-21 JP JP62010118A patent/JP2643935B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2593930B1 (fr) | 1989-11-24 |
JP2643935B2 (ja) | 1997-08-25 |
US4727457A (en) | 1988-02-23 |
EP0230336A1 (de) | 1987-07-29 |
KR870007439A (ko) | 1987-08-19 |
FR2593930A1 (fr) | 1987-08-07 |
KR950000110B1 (ko) | 1995-01-09 |
JPS62190777A (ja) | 1987-08-20 |
EP0230336B1 (de) | 1991-04-10 |
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