DE3689692D1 - "Silicon-resist"-Materialien, die Polysiloxane Verbindungen enthalten. - Google Patents

"Silicon-resist"-Materialien, die Polysiloxane Verbindungen enthalten.

Info

Publication number
DE3689692D1
DE3689692D1 DE86117468T DE3689692T DE3689692D1 DE 3689692 D1 DE3689692 D1 DE 3689692D1 DE 86117468 T DE86117468 T DE 86117468T DE 3689692 T DE3689692 T DE 3689692T DE 3689692 D1 DE3689692 D1 DE 3689692D1
Authority
DE
Germany
Prior art keywords
resist
silicon
materials
polysiloxane compounds
contain polysiloxane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE86117468T
Other languages
English (en)
Other versions
DE3689692T2 (de
Inventor
Yasuobu Onishi
Shuji Hayase
Rumiko Hayase
Akiko Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29318285A external-priority patent/JPS62153853A/ja
Priority claimed from JP61071107A external-priority patent/JPH07120044B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3689692D1 publication Critical patent/DE3689692D1/de
Publication of DE3689692T2 publication Critical patent/DE3689692T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/16Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0754Non-macromolecular compounds containing silicon-to-silicon bonds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Silicon Polymers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
DE3689692T 1985-12-27 1986-12-16 "Silicon-resist"-Materialien, die Polysiloxane Verbindungen enthalten. Expired - Fee Related DE3689692T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP29318285A JPS62153853A (ja) 1985-12-27 1985-12-27 感光性組成物
JP61071107A JPH07120044B2 (ja) 1986-03-31 1986-03-31 感光性組成物およびそれを用いるパターン形成方法
JP11467386 1986-05-21
JP12808186 1986-06-04

Publications (2)

Publication Number Publication Date
DE3689692D1 true DE3689692D1 (de) 1994-04-07
DE3689692T2 DE3689692T2 (de) 1994-07-14

Family

ID=27465321

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3689692T Expired - Fee Related DE3689692T2 (de) 1985-12-27 1986-12-16 "Silicon-resist"-Materialien, die Polysiloxane Verbindungen enthalten.
DE3650633T Expired - Lifetime DE3650633T2 (de) 1985-12-27 1986-12-16 Polysilan-Resist-Materialien und Methode zu deren Herstellung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3650633T Expired - Lifetime DE3650633T2 (de) 1985-12-27 1986-12-16 Polysilan-Resist-Materialien und Methode zu deren Herstellung

Country Status (3)

Country Link
US (2) US4822716A (de)
EP (2) EP0231497B1 (de)
DE (2) DE3689692T2 (de)

Families Citing this family (118)

* Cited by examiner, † Cited by third party
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EP0506425A3 (de) * 1991-03-26 1992-12-02 Kabushiki Kaisha Toshiba Monomolekularer Polysilanfilm und aus Polysilanschichten aufgebauter Film
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US5310620A (en) * 1991-12-06 1994-05-10 Shin-Etsu Chemical Co., Ltd. Alkali-soluble nitrone compounds and contrast enhanced material comprising the same
US5438113A (en) * 1992-03-30 1995-08-01 Kabushiki Kaisha Toshiba Thermosetting resin composition
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US5378789A (en) * 1992-05-14 1995-01-03 General Electric Company Phenol-modified silicones
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EP1006141B1 (de) * 1997-01-09 2003-08-20 Osaka Gas Company Limited Polysilane und verfahren zu deren herstellung
JPH1135688A (ja) 1997-05-19 1999-02-09 Canon Inc 珪素含有化合物、該珪素含有化合物の製造方法及び該珪素含有化合物を用いた発光素子
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US6087064A (en) * 1998-09-03 2000-07-11 International Business Machines Corporation Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
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JP6688041B2 (ja) 2014-11-11 2020-04-28 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6684075B2 (ja) 2014-11-11 2020-04-22 住友化学株式会社 樹脂、レジスト組成物及びレジストパターンの製造方法
JP6585471B2 (ja) 2014-11-11 2019-10-02 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
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JP6664932B2 (ja) 2014-11-14 2020-03-13 住友化学株式会社 樹脂、レジスト組成物及びレジストパターンの製造方法
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US9740097B2 (en) 2015-03-31 2017-08-22 Sumitomo Chemical Company, Limited Resist composition and method for producing resist pattern
JP6761657B2 (ja) 2015-03-31 2020-09-30 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
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JP6864994B2 (ja) 2015-06-26 2021-04-28 住友化学株式会社 レジスト組成物
JP6883954B2 (ja) 2015-06-26 2021-06-09 住友化学株式会社 レジスト組成物
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DE3689692T2 (de) 1994-07-14
US5017453A (en) 1991-05-21
EP0231497B1 (de) 1994-03-02
DE3650633T2 (de) 1997-10-16
US4822716A (en) 1989-04-18
EP0493367A3 (de) 1992-07-22
EP0231497A1 (de) 1987-08-12
DE3650633D1 (de) 1997-07-10
EP0493367B1 (de) 1997-06-04
EP0493367A2 (de) 1992-07-01

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