DE3669724D1 - Hitzehaertbare epoxydharzzusammensetzungen und daraus hergestellte gehaertete gegenstaende. - Google Patents

Hitzehaertbare epoxydharzzusammensetzungen und daraus hergestellte gehaertete gegenstaende.

Info

Publication number
DE3669724D1
DE3669724D1 DE8686102074T DE3669724T DE3669724D1 DE 3669724 D1 DE3669724 D1 DE 3669724D1 DE 8686102074 T DE8686102074 T DE 8686102074T DE 3669724 T DE3669724 T DE 3669724T DE 3669724 D1 DE3669724 D1 DE 3669724D1
Authority
DE
Germany
Prior art keywords
hardened
heat
epoxy resin
resin compositions
curable epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686102074T
Other languages
English (en)
Inventor
Sung Gun Chu
Harold Jabloner
Brian Joseph Swetlin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hercules LLC
Original Assignee
Hercules LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27106981&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3669724(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US06/702,518 external-priority patent/US4656207A/en
Application filed by Hercules LLC filed Critical Hercules LLC
Application granted granted Critical
Publication of DE3669724D1 publication Critical patent/DE3669724D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/08—Polysulfonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/906—Polysulfone
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE8686102074T 1985-02-19 1986-02-18 Hitzehaertbare epoxydharzzusammensetzungen und daraus hergestellte gehaertete gegenstaende. Expired - Lifetime DE3669724D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/702,518 US4656207A (en) 1985-02-19 1985-02-19 Epoxy thermosets having improved toughness
US06/724,133 US4656208A (en) 1985-02-19 1985-04-17 Thermosetting epoxy resin compositions and thermosets therefrom

Publications (1)

Publication Number Publication Date
DE3669724D1 true DE3669724D1 (de) 1990-04-26

Family

ID=27106981

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686102074T Expired - Lifetime DE3669724D1 (de) 1985-02-19 1986-02-18 Hitzehaertbare epoxydharzzusammensetzungen und daraus hergestellte gehaertete gegenstaende.

Country Status (7)

Country Link
US (1) US4656208A (de)
EP (1) EP0193082B1 (de)
JP (1) JPH0668015B2 (de)
KR (1) KR940010827B1 (de)
CA (2) CA1246294A (de)
DE (1) DE3669724D1 (de)
ES (2) ES8800291A1 (de)

Families Citing this family (52)

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US5089560A (en) * 1980-09-23 1992-02-18 Amoco Corporation Exopy resin with aromatic oligomer and rubber particles
US4863787A (en) * 1986-07-09 1989-09-05 Hercules Incorporated Damage tolerant composites containing infusible particles
US4999238A (en) * 1986-07-09 1991-03-12 Hercules Incorporated Damage tolerant composites containing infusible particles
US4680076A (en) * 1986-08-28 1987-07-14 Hercules Incorporated Multiphase epoxy thermosets having rubber within disperse phase
DE3751984T2 (de) * 1986-09-30 1997-04-17 Toho Rayon Kk Harzzusammensetzung auf der Basis von wärmehärtbaren Harzen und thermoplastischen Harzen
ATE142676T1 (de) * 1987-10-05 1996-09-15 Ici Plc Polymermasse
US5231150A (en) * 1987-10-05 1993-07-27 Imperial Chemical Industries Plc Polymer composition
EP0319008A3 (de) * 1987-12-01 1990-08-08 Hercules Incorporated Epoxydharzzusammensetzungen, verwendbar bei der Herstellung von Verbundwerkstoffen mit hoher Übergangstemperatur in nassem Zustand und bei Klebstoffverwendungen
US4874661A (en) * 1987-12-15 1989-10-17 Browne James M Impact enhanced prepregs and formulations
US5002821A (en) * 1987-12-15 1991-03-26 The Dexter Corporation Toughened prepregs and formulations
US5317067A (en) * 1988-01-25 1994-05-31 Tokyo Tire & Rubber Company Limited Molding and punching out melt-mixed epoxy resin-thermoplastic resin composition with hardener
US4949443A (en) * 1988-06-29 1990-08-21 Tatsuhiko Saruwatari Numerically controlled lathe
US5073605A (en) * 1988-07-14 1991-12-17 General Electric Company Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene ether
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
US5096771A (en) * 1988-07-14 1992-03-17 General Electric Company Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether
US4975319A (en) * 1988-07-14 1990-12-04 General Electric Company Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether
US4977218A (en) * 1988-09-26 1990-12-11 Amoco Corporation Carboxylated rubber particles as tougheners for fiber reinforced composites
US4977215A (en) * 1988-09-26 1990-12-11 Amoco Corporation Carboxylated rubber particles as tougheners for fiber reinforced composites
US5364914A (en) * 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
DE3837015A1 (de) * 1988-10-31 1990-05-03 Basf Ag Haertbare, zaehmodifizierte epoxidharze
DE3842306A1 (de) * 1988-12-16 1990-06-21 Basf Ag Haertbare, zaehmodifizierte epoxidharze
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5120823A (en) * 1989-02-17 1992-06-09 Basf Aktiengesellschaft Toughened thermosetting structural materials
US4930852A (en) * 1989-02-21 1990-06-05 Simmonds Precision Product, Inc. Optical fiber mounting and structural monitoring
US5087657A (en) * 1989-02-23 1992-02-11 Amoco Corporation Fiber-reinforced composites toughened with resin particles
EP0392348A3 (de) * 1989-04-14 1991-12-27 Cytec Technology Corp. Zähe, hitzehärtbare Konstruktionswerkstoffe
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article
US5268223A (en) * 1991-05-31 1993-12-07 Amoco Corporation Toughened fiber-reinforced composites
EP0525418B1 (de) * 1991-07-30 2002-11-20 Cytec Technology Corp. Gehärtete, faserverstärkte härtbare Harzmatrixprepregs und Verbundstoffe daraus
US5532296A (en) * 1991-07-30 1996-07-02 Cytec Technology Corp. Bismaleimide resin systems toughened by addition of preformed functionalized low Tg elastomer particles
TW223083B (de) * 1991-10-25 1994-05-01 Ciba Geigy Ag
US5250228A (en) * 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
US5464902A (en) * 1992-03-23 1995-11-07 Cytec Technology Corp. Toughening of brittle epoxy resin matrices with functionalized particulate elastomers
EP0583224B1 (de) * 1992-08-11 1999-01-20 Hexcel Corporation Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze
DE69309199T2 (de) * 1992-08-18 1997-11-06 Ciba Geigy Ag 2,2'-Dimethyl-5,5'-Diaminodiphenyl Sulphon
US5360840A (en) * 1992-12-29 1994-11-01 Hercules Incorporated Epoxy resin compositions with improved storage stability
US5418313A (en) * 1994-05-25 1995-05-23 Air Products And Chemicals, Inc. Process for reducing cure time in epoxy resins cured with methylenedianiline and derivatives
KR100314614B1 (ko) * 1999-10-01 2001-11-15 유현식 열가소성 고분자 입자 첨가에 의한 고강인성 열경화성 수지 조성물의 제조방법
WO2001027190A1 (fr) * 1999-10-13 2001-04-19 Toray Industries, Inc. Composition de resine epoxy pour matiere composite renforcee par des fibres, pre-impregne et matiere composite renforcee par des fibres ainsi obtenue
TW528771B (en) * 2000-01-27 2003-04-21 Lead Data Inc Soluble thermosetting polyethersulfone and making of them
US6586607B1 (en) 2002-04-11 2003-07-01 Indspec Chemical Corporation Process for making diglycidylether of alkoxylated resorcinol
JP4151573B2 (ja) * 2003-12-16 2008-09-17 東洋紡績株式会社 硬化型組成物
DE102004062551A1 (de) * 2004-12-24 2006-07-06 Rhein Chemie Rheinau Gmbh Mikrogel-enthaltende duroplastische Zusammensetzung
AU2006214709B2 (en) * 2005-02-16 2012-08-02 Cytec Technology Corp. Bismaleimire resin with high temperature thermal stability
KR101684721B1 (ko) * 2009-08-31 2016-12-20 사이텍 테크놀러지 코포레이션 고성능 접착제 조성물
GB0922599D0 (en) * 2009-12-23 2010-02-10 Cytec Tech Corp Modified resin systems for liquid resin infusion applications, prepreg autoclave applications and hybrids thereof
US8686069B2 (en) 2010-10-12 2014-04-01 Hexcel Corporation Solvent resistance of epoxy resins toughened with polyethersulfone
DE102011006674A1 (de) 2011-04-01 2012-10-04 Bayer Materialscience Aktiengesellschaft Polymere Nanopartikel und Beschichtungsmittel mit polymeren Nanopartikel
CN104245779B (zh) * 2011-12-16 2020-10-16 索尔维特殊聚合物美国有限责任公司 环氧树脂组合物
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KR102495843B1 (ko) 2020-08-28 2023-02-03 한국화학연구원 신규한 화합물, 이를 포함하는 에폭시 수지 조성물 및 이의 경화물

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ZA84551B (en) * 1983-06-30 1985-03-27 Union Carbide Corp Epoxy compositions containing oligomeric diamine hardeners and high strength composities therefrom

Also Published As

Publication number Publication date
ES557453A0 (es) 1988-06-16
ES552137A0 (es) 1987-10-16
ES8802532A1 (es) 1988-06-16
CA1283241C (en) 1991-04-16
JPH0668015B2 (ja) 1994-08-31
JPS6426665A (en) 1989-01-27
ES8800291A1 (es) 1987-10-16
KR940010827B1 (ko) 1994-11-17
US4656208A (en) 1987-04-07
KR860006509A (ko) 1986-09-11
EP0193082A1 (de) 1986-09-03
CA1246294A (en) 1988-12-06
EP0193082B1 (de) 1990-03-21

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8328 Change in the person/name/address of the agent

Free format text: VOGESER, W., DIPL.-ING., PAT.-ANW., 81369 MUENCHEN BOECKER, J., DIPL.-ING. DR.-ING., PAT.- U. RECHTSANW., 6000 FRANKFURT ALBER, N., DIPL.-ING. UNIV. DIPL.-WIRTSCH.-ING.UNIV STRYCH, W., DR.RER.NAT., PAT.-ANWAELTE, 81369 MUENCHEN

8365 Fully valid after opposition proceedings