DE3667498D1 - Verfahren zur metallbeschichtung eines organischen substrates. - Google Patents
Verfahren zur metallbeschichtung eines organischen substrates.Info
- Publication number
- DE3667498D1 DE3667498D1 DE8686300070T DE3667498T DE3667498D1 DE 3667498 D1 DE3667498 D1 DE 3667498D1 DE 8686300070 T DE8686300070 T DE 8686300070T DE 3667498 T DE3667498 T DE 3667498T DE 3667498 D1 DE3667498 D1 DE 3667498D1
- Authority
- DE
- Germany
- Prior art keywords
- metal coating
- organic substrate
- organic
- substrate
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2063—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 mixed adhesion layer containing metallic/inorganic and polymeric materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69056785A | 1985-01-11 | 1985-01-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3667498D1 true DE3667498D1 (de) | 1990-01-18 |
Family
ID=24772994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686300070T Expired - Fee Related DE3667498D1 (de) | 1985-01-11 | 1986-01-07 | Verfahren zur metallbeschichtung eines organischen substrates. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0187706B1 (de) |
JP (1) | JP2605010B2 (de) |
CA (1) | CA1276088C (de) |
DE (1) | DE3667498D1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0337445A3 (de) * | 1988-04-13 | 1991-01-16 | Hitachi, Ltd. | Laminare Struktur bestehend aus einem organischen Material und aus einem anorganischen Material, Methoden zu ihrer Herstellung und ihrer Benutzung |
US5104734A (en) * | 1988-06-03 | 1992-04-14 | International Business Machines Corporation | Method for improving adhesion between a polyimide layer and a metal and the article obtained |
IT1229221B (it) * | 1989-03-31 | 1991-07-26 | Tecnopart Srl | Articoli formati di materiale polimerico aventi migliorata bagnabilita' e adesivita' e processo per la loro produzione. |
AU636339B2 (en) * | 1989-05-02 | 1993-04-29 | Minnesota Mining And Manufacturing Company | Noble metal-polymer composites and flexible thin-film conductors prepared therefrom |
US5178957A (en) * | 1989-05-02 | 1993-01-12 | Minnesota Mining And Manufacturing Company | Noble metal-polymer composites and flexible thin-film conductors prepared therefrom |
US4975327A (en) * | 1989-07-11 | 1990-12-04 | Minnesota Mining And Manufacturing Company | Polyimide substrate having a textured surface and metallizing such a substrate |
US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
DE4211956C1 (de) * | 1992-04-09 | 1993-05-06 | Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De | |
JPH08330728A (ja) * | 1995-05-26 | 1996-12-13 | Toyo Metaraijingu Kk | フレキシブルプリント配線用基板 |
SE508280C2 (sv) * | 1997-01-31 | 1998-09-21 | Cuptronic Ab | Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial |
US6303278B1 (en) | 1997-01-31 | 2001-10-16 | Cuptronic Ab | Method of applying metal layers in distinct patterns |
DE10026540A1 (de) * | 2000-05-27 | 2001-11-29 | Gfe Met & Mat Gmbh | Gegenstand, insbesondere Implantat |
JP4605454B2 (ja) * | 2005-03-23 | 2011-01-05 | 住友金属鉱山株式会社 | フレキシブル基板の製造方法 |
DE602007001344D1 (de) * | 2006-04-10 | 2009-07-30 | Linea Tergi Ltd | Verfahren zur applizierung eines metalls auf ein substrat |
DK2004907T3 (da) * | 2006-04-10 | 2009-10-19 | Linea Tergi Ltd | Fremgangsmåde til påföring af et metal på papir |
JP2016159606A (ja) * | 2015-03-05 | 2016-09-05 | 住友電気工業株式会社 | 積層構造体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2812270A (en) * | 1954-01-28 | 1957-11-05 | Continental Can Co | Method and apparatus for depositing metal coatings on metal bases |
US2859130A (en) * | 1954-06-16 | 1958-11-04 | Ohio Commw Eng Co | Method for gas plating synthetic fibers |
US2897091A (en) * | 1954-10-27 | 1959-07-28 | Ohio Commw Eng Co | Method of high speed gas plating of synthetic resins |
GB1370893A (en) * | 1971-02-09 | 1974-10-16 | Ici Ltd | Metallised thermoplastic films |
DE2234510A1 (de) * | 1972-07-13 | 1974-01-24 | Siemens Ag | Verfahren zum metallisieren einer zur herstellung von elektrischen kondensatoren dienenden isolierstoffolie |
JPS538376A (en) * | 1976-07-12 | 1978-01-25 | Ulvac Corp | Preparation of magnetic recording material by evaporation process with oblique incidence |
FR2378815A1 (fr) * | 1977-01-28 | 1978-08-25 | Paris Haute Lunette | Procede d'application d'un produit de traitement sur des objets en verre organique, tels que des verres de lunette |
JPS53135840A (en) * | 1977-04-30 | 1978-11-27 | Sumitomo Electric Ind Ltd | Metal coating method for non-electroconductive material |
DE3136283C1 (de) * | 1981-09-12 | 1983-02-03 | Nukem Gmbh, 6450 Hanau | Verfahren zum Metallisieren kohlefaserverstaerkter Kunststoffteile |
DE3233087A1 (de) * | 1982-09-07 | 1984-03-08 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren zum herstellen von duennen metallschichten mittels aufdampfens |
US4466875A (en) * | 1983-11-30 | 1984-08-21 | Ppg Industries, Inc. | Auxiliary heater for magnetron sputtering |
-
1985
- 1985-09-12 JP JP60200729A patent/JP2605010B2/ja not_active Expired - Lifetime
- 1985-12-20 CA CA 498399 patent/CA1276088C/en not_active Expired - Fee Related
-
1986
- 1986-01-07 DE DE8686300070T patent/DE3667498D1/de not_active Expired - Fee Related
- 1986-01-07 EP EP19860300070 patent/EP0187706B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0187706A3 (en) | 1987-09-02 |
EP0187706B1 (de) | 1989-12-13 |
JPS61164295A (ja) | 1986-07-24 |
EP0187706A2 (de) | 1986-07-16 |
JP2605010B2 (ja) | 1997-04-30 |
CA1276088C (en) | 1990-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |