DK2004907T3 - Fremgangsmåde til påföring af et metal på papir - Google Patents
Fremgangsmåde til påföring af et metal på papirInfo
- Publication number
- DK2004907T3 DK2004907T3 DK07727930T DK07727930T DK2004907T3 DK 2004907 T3 DK2004907 T3 DK 2004907T3 DK 07727930 T DK07727930 T DK 07727930T DK 07727930 T DK07727930 T DK 07727930T DK 2004907 T3 DK2004907 T3 DK 2004907T3
- Authority
- DK
- Denmark
- Prior art keywords
- metal
- ions
- paper
- circuits
- possibility
- Prior art date
Links
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H19/00—Coated paper; Coating material
- D21H19/02—Metal coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H19/00—Coated paper; Coating material
- D21H19/02—Metal coatings
- D21H19/08—Metal coatings applied as vapour, e.g. in vacuum
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
- D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
- D21H23/22—Addition to the formed paper
- D21H23/30—Pretreatment of the paper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31703—Next to cellulosic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Textile Engineering (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79116806P | 2006-04-10 | 2006-04-10 | |
SE0600806 | 2006-04-10 | ||
US85492206P | 2006-10-27 | 2006-10-27 | |
PCT/EP2007/053462 WO2007116056A2 (en) | 2006-04-10 | 2007-04-10 | Method for applying a metal on paper |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2004907T3 true DK2004907T3 (da) | 2009-10-19 |
Family
ID=38480951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK07727930T DK2004907T3 (da) | 2006-04-10 | 2007-04-10 | Fremgangsmåde til påföring af et metal på papir |
Country Status (8)
Country | Link |
---|---|
US (1) | US20090297840A1 (da) |
EP (1) | EP2004907B1 (da) |
AT (1) | ATE434081T1 (da) |
DE (1) | DE602007001343D1 (da) |
DK (1) | DK2004907T3 (da) |
ES (1) | ES2328748T3 (da) |
HK (1) | HK1122077A1 (da) |
WO (1) | WO2007116056A2 (da) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101578520B (zh) | 2006-10-18 | 2015-09-16 | 哈佛学院院长等 | 基于形成图案的多孔介质的横向流动和穿过生物测定装置、及其制备方法和使用方法 |
EP2257818B1 (en) | 2008-03-27 | 2017-05-10 | President and Fellows of Harvard College | Cotton thread as a low-cost multi-assay diagnostic platform |
CA2719320A1 (en) | 2008-03-27 | 2009-10-01 | President And Fellows Of Harvard College | Three-dimensional microfluidic devices |
CN103203210A (zh) | 2008-03-27 | 2013-07-17 | 哈佛学院院长等 | 基于纸的细胞阵列 |
EP2265958A4 (en) | 2008-03-27 | 2016-10-19 | Harvard College | MICROFLUIDIC SYSTEMS BASED ON PAPER |
EP2156945A1 (en) | 2008-08-13 | 2010-02-24 | Novelis Inc. | Clad automotive sheet product |
ES2612507T3 (es) | 2009-03-06 | 2017-05-17 | President And Fellows Of Harvard College | Dispositivos microfluídicos y electroquímicos |
DK2640868T3 (da) | 2010-11-16 | 2018-12-10 | Cuptronic Tech Ltd | Metalcoating af genstande under anvendelse af en plasmapolymeriseringsforbehandling |
EP2645830B1 (en) | 2012-03-29 | 2014-10-08 | Atotech Deutschland GmbH | Method for manufacture of fine line circuitry |
CN104619882A (zh) | 2012-05-07 | 2015-05-13 | 凯普卓尼克技术公司 | 一种金属涂覆工艺 |
WO2014086844A2 (en) | 2012-12-05 | 2014-06-12 | Cuptronic Technology Ltd. | Metalization of polymeric cavity filters |
FR3005391B1 (fr) * | 2013-05-03 | 2016-12-09 | Linxens Holding | Procede de fabrication d'un circuit flexible pour module de carte a puce, circuit flexible de carte a puce otenu par ce procede et module de carte a puce comportant un tel circuit flexible |
CN106460176B (zh) | 2014-04-28 | 2020-02-07 | 凯普卓尼克技术公司 | 表面的金属化 |
CN109610229B (zh) * | 2018-12-21 | 2021-04-06 | 东北林业大学 | 一种自蓬松电磁屏蔽纸的制备方法 |
WO2022018136A1 (en) | 2020-07-21 | 2022-01-27 | Ncapt Ab | METHOD FOR SURFACE TREATMENT PRIOR TO COATING and GLUING |
SE545002C2 (en) | 2020-07-24 | 2023-02-21 | Cuptronic Tech Ltd | Method for surface treatment prior to metallization |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3333169A (en) * | 1966-05-18 | 1967-07-25 | Union Carbide Corp | Electrical capacitor with a linear p-xylylene polymer dielectric |
GB1222969A (en) * | 1967-06-03 | 1971-02-17 | Geigy Uk Ltd | Plating process |
US3870526A (en) * | 1973-09-20 | 1975-03-11 | Us Army | Electroless deposition of copper and copper-tin alloys |
US3998602A (en) * | 1975-02-07 | 1976-12-21 | Carl Horowitz | Metal plating of polymeric substrates |
JPS54127573A (en) * | 1978-03-28 | 1979-10-03 | Shin Kobe Electric Machinery | Method of producing printed circuit board |
JPS5586744A (en) * | 1978-12-26 | 1980-06-30 | Fujitsu Ltd | Method of making copperrcoated laminated board |
JPH0740625B2 (ja) * | 1984-02-13 | 1995-05-01 | 松下電器産業株式会社 | 印刷配線板の製造方法 |
JP2605010B2 (ja) * | 1985-01-11 | 1997-04-30 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 有機基板への金属付着方法 |
US4810326A (en) * | 1987-08-31 | 1989-03-07 | International Business Machines Corporation | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces |
JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
US5114757A (en) * | 1990-10-26 | 1992-05-19 | Linde Harold G | Enhancement of polyimide adhesion on reactive metals |
US5225495A (en) * | 1991-07-10 | 1993-07-06 | Richard C. Stewart, II | Conductive polymer film formation using initiator pretreatment |
US5153986A (en) * | 1991-07-17 | 1992-10-13 | International Business Machines | Method for fabricating metal core layers for a multi-layer circuit board |
US5262208A (en) * | 1992-04-06 | 1993-11-16 | Plasma Plus | Gas plasma treatment for archival preservation of manuscripts and the like |
US6210537B1 (en) * | 1995-06-19 | 2001-04-03 | Lynntech, Inc. | Method of forming electronically conducting polymers on conducting and nonconducting substrates |
US6303278B1 (en) * | 1997-01-31 | 2001-10-16 | Cuptronic Ab | Method of applying metal layers in distinct patterns |
US6156221A (en) * | 1998-10-02 | 2000-12-05 | International Business Machines Corporation | Copper etching compositions, processes and products derived therefrom |
US6899999B2 (en) * | 2001-03-28 | 2005-05-31 | Kabushiki Kaisha Toshiba | Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member |
EP1282175A3 (en) * | 2001-08-03 | 2007-03-14 | FUJIFILM Corporation | Conductive pattern material and method for forming conductive pattern |
US6893681B2 (en) * | 2001-09-27 | 2005-05-17 | Fujitsu Limited | Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same |
JP3866579B2 (ja) * | 2002-01-25 | 2007-01-10 | 富士フイルムホールディングス株式会社 | 薄層金属膜 |
JP2005037881A (ja) * | 2003-04-21 | 2005-02-10 | Fuji Photo Film Co Ltd | パターン形成方法、画像形成方法、微粒子吸着パターン形成方法、導電性パターン形成方法、パターン形成材料、及び平版印刷版 |
US7291427B2 (en) * | 2004-03-19 | 2007-11-06 | Fujifilm Corporation | Surface graft material, conductive pattern material, and production method thereof |
-
2007
- 2007-04-10 US US12/296,663 patent/US20090297840A1/en not_active Abandoned
- 2007-04-10 DE DE602007001343T patent/DE602007001343D1/de active Active
- 2007-04-10 DK DK07727930T patent/DK2004907T3/da active
- 2007-04-10 AT AT07727930T patent/ATE434081T1/de not_active IP Right Cessation
- 2007-04-10 WO PCT/EP2007/053462 patent/WO2007116056A2/en active Application Filing
- 2007-04-10 EP EP07727930A patent/EP2004907B1/en active Active
- 2007-04-10 ES ES07727930T patent/ES2328748T3/es active Active
-
2009
- 2009-03-06 HK HK09102162.9A patent/HK1122077A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2007116056A3 (en) | 2007-11-29 |
HK1122077A1 (en) | 2009-05-08 |
ATE434081T1 (de) | 2009-07-15 |
EP2004907A2 (en) | 2008-12-24 |
EP2004907B1 (en) | 2009-06-17 |
US20090297840A1 (en) | 2009-12-03 |
ES2328748T3 (es) | 2009-11-17 |
DE602007001343D1 (de) | 2009-07-30 |
WO2007116056A2 (en) | 2007-10-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK2004907T3 (da) | Fremgangsmåde til påföring af et metal på papir | |
DK2004908T3 (da) | Fremgangsmåde til påföring af et metal på et substrat | |
SE0402904D0 (sv) | Coated product and method of production thereof | |
WO2008048840A3 (en) | Methods of patterning a deposit metal on a polymeric substrate | |
ATE424311T1 (de) | Sicherheitselement und verfahren zu seiner herstellung | |
ATE484398T1 (de) | Sicherheitselement und verfahren zu seiner herstellung | |
CN105702624A (zh) | 叠层柔性基板及制作方法 | |
WO2009004560A3 (en) | A method for forming a patterned layer on a substrate | |
WO2010070485A3 (en) | Methods for manufacturing panels | |
WO2008081585A1 (ja) | スパッタリングターゲットとその製造方法 | |
WO2008005892A3 (en) | Nanocrystal formation | |
WO2008141158A3 (en) | Substrate surface structures and processes for forming the same | |
TW200631784A (en) | Primed substrate comprising conductive polymer layer and method | |
DE60335452D1 (de) | Verfahren zur erzeugung eines films unter verwendung von elektrostatischen kräften | |
PL1913801T3 (pl) | Sposób wytwarzania na podłożu nośnym metalowych struktur tworzących wzory | |
EP1976793A4 (en) | METHOD OF MANUFACTURING NANOSTRUCTURES WITH CHROMOS | |
ATE542785T1 (de) | Verfahren zur elektrophoretischen beschichtung | |
GB2510295A (en) | Photo-patterning using a translucent cylindrical master to form microscopic conductive lines on a flexible substrate | |
WO2009011802A3 (en) | Methods for controlling coating gloss | |
DE50310646D1 (de) | Verfahren zur beschichtung von metalloberflächen | |
WO2010125295A3 (fr) | Procédé de fabrication d'un complexe textile incluant des motifs décoratifs et complexe ainsi fabriqué | |
DE502005008821D1 (de) | Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement | |
ATE498024T1 (de) | Verfahren zur strukturierung einer mesoporösen nanopartikelschicht | |
CN102350853B (zh) | 全息图纹膜的制作工艺、全息图纹膜及*** | |
MX2007009841A (es) | Metodo de fabricacion de recubrimientos configurados topograficamente. |