DE3484731D1 - Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung. - Google Patents
Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung.Info
- Publication number
- DE3484731D1 DE3484731D1 DE8484201675T DE3484731T DE3484731D1 DE 3484731 D1 DE3484731 D1 DE 3484731D1 DE 8484201675 T DE8484201675 T DE 8484201675T DE 3484731 T DE3484731 T DE 3484731T DE 3484731 D1 DE3484731 D1 DE 3484731D1
- Authority
- DE
- Germany
- Prior art keywords
- programmable
- production
- thick film
- film circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
- H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
- H03F2203/45—Indexing scheme relating to differential amplifiers
- H03F2203/45522—Indexing scheme relating to differential amplifiers the FBC comprising one or more potentiometers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03G—CONTROL OF AMPLIFICATION
- H03G1/00—Details of arrangements for controlling amplification
- H03G1/0005—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal
- H03G1/0088—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal using discontinuously variable devices, e.g. switch-operated
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/24—Frequency- independent attenuators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fuses (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/555,847 US4626818A (en) | 1983-11-28 | 1983-11-28 | Device for programmable thick film networks |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3484731D1 true DE3484731D1 (de) | 1991-07-25 |
Family
ID=24218845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484201675T Expired - Lifetime DE3484731D1 (de) | 1983-11-28 | 1984-11-20 | Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4626818A (de) |
EP (1) | EP0143493B1 (de) |
JP (1) | JPS60157247A (de) |
DE (1) | DE3484731D1 (de) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182538A (en) * | 1985-11-07 | 1993-01-26 | Limitor Ag | Bimetal thermoswitch |
DE3539425A1 (de) * | 1985-11-07 | 1987-05-14 | Limitor Ag | Thermobimetallschalter |
US4771260A (en) * | 1987-03-24 | 1988-09-13 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
US4763228A (en) * | 1987-11-20 | 1988-08-09 | Union Carbide Corporation | Fuse assembly for solid electrolytic capacitor |
US5204799A (en) * | 1990-03-22 | 1993-04-20 | Gpt Limited | Protective arrangement for telecommunications line interface circuit |
US5097246A (en) * | 1990-04-16 | 1992-03-17 | Cooper Industries, Inc. | Low amperage microfuse |
GB2255455A (en) * | 1991-04-22 | 1992-11-04 | Electronic Components Ltd | Fuse |
IT1249299B (it) * | 1991-04-30 | 1995-02-22 | Sgs Thomson Microelectronics | Circuito integrato con componenti passivi trimmabili |
US5097247A (en) * | 1991-06-03 | 1992-03-17 | North American Philips Corporation | Heat actuated fuse apparatus with solder link |
DE4222278C1 (de) * | 1992-07-07 | 1994-03-31 | Roederstein Kondensatoren | Verfahren zur Herstellung elektrischer Dickschichtsicherungen |
US5479147A (en) | 1993-11-04 | 1995-12-26 | Mepcopal Company | High voltage thick film fuse assembly |
US6191928B1 (en) | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
US5790008A (en) * | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
US5974661A (en) * | 1994-05-27 | 1999-11-02 | Littelfuse, Inc. | Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components |
US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
US5914648A (en) * | 1995-03-07 | 1999-06-22 | Caddock Electronics, Inc. | Fault current fusing resistor and method |
JPH0992110A (ja) * | 1995-09-26 | 1997-04-04 | Denso Corp | 温度ヒューズ付抵抗器 |
US5907272A (en) * | 1996-01-22 | 1999-05-25 | Littelfuse, Inc. | Surface mountable electrical device comprising a PTC element and a fusible link |
US5652562A (en) * | 1996-05-21 | 1997-07-29 | Spectrol Electronics Corporation | Thermally fused resistor having a portion of a solder loop thermally connected to an electrically insulated portion of an outer surface of the resistor |
US5977860A (en) * | 1996-06-07 | 1999-11-02 | Littelfuse, Inc. | Surface-mount fuse and the manufacture thereof |
US5699032A (en) * | 1996-06-07 | 1997-12-16 | Littelfuse, Inc. | Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material |
DE19704097A1 (de) * | 1997-02-04 | 1998-08-06 | Wickmann Werke Gmbh | Elektrisches Sicherungselement |
US6373371B1 (en) * | 1997-08-29 | 2002-04-16 | Microelectronic Modules Corp. | Preformed thermal fuse |
US5982268A (en) * | 1998-03-31 | 1999-11-09 | Uchihashi Estec Co., Ltd | Thin type fuses |
JP4396787B2 (ja) * | 1998-06-11 | 2010-01-13 | 内橋エステック株式会社 | 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法 |
US6034589A (en) * | 1998-12-17 | 2000-03-07 | Aem, Inc. | Multi-layer and multi-element monolithic surface mount fuse and method of making the same |
US6456186B1 (en) * | 1999-10-27 | 2002-09-24 | Motorola, Inc. | Multi-terminal fuse device |
US6791157B1 (en) * | 2000-01-18 | 2004-09-14 | Advanced Micro Devices, Inc. | Integrated circuit package incorporating programmable elements |
DE10005836B4 (de) * | 2000-02-10 | 2006-10-12 | Vossloh-Schwabe Elektronik Gmbh | Leiterplattensicherung mit erhöhter Sicherheit |
US20030048620A1 (en) * | 2000-03-14 | 2003-03-13 | Kohshi Nishimura | Printed-circuit board with fuse |
US7489229B2 (en) * | 2001-06-11 | 2009-02-10 | Wickmann-Werke Gmbh | Fuse component |
US7034652B2 (en) * | 2001-07-10 | 2006-04-25 | Littlefuse, Inc. | Electrostatic discharge multifunction resistor |
WO2003007452A1 (en) * | 2001-07-10 | 2003-01-23 | Littelfuse, Inc. | Electrostatic discharge apparatus for network devices |
US6878004B2 (en) * | 2002-03-04 | 2005-04-12 | Littelfuse, Inc. | Multi-element fuse array |
US7183891B2 (en) | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
US7132922B2 (en) | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
WO2003088356A1 (en) | 2002-04-08 | 2003-10-23 | Littelfuse, Inc. | Voltage variable material for direct application and devices employing same |
US6960978B2 (en) * | 2003-07-16 | 2005-11-01 | Hewlett-Packard Development Company, L.P. | Fuse structure |
WO2005053993A2 (en) * | 2003-11-26 | 2005-06-16 | Littelfuse, Inc. | Vehicle electrical protection device and system employing same |
DE102004033251B3 (de) * | 2004-07-08 | 2006-03-09 | Vishay Bccomponents Beyschlag Gmbh | Schmelzsicherung für einem Chip |
US7477130B2 (en) * | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
JP2009503768A (ja) * | 2005-07-22 | 2009-01-29 | リッテルフューズ,インコーポレイティド | 一体型溶断導体を備えた電気デバイス |
US7983024B2 (en) | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
US20090009281A1 (en) * | 2007-07-06 | 2009-01-08 | Cyntec Company | Fuse element and manufacturing method thereof |
JP5287154B2 (ja) * | 2007-11-08 | 2013-09-11 | パナソニック株式会社 | 回路保護素子およびその製造方法 |
US8525633B2 (en) * | 2008-04-21 | 2013-09-03 | Littelfuse, Inc. | Fusible substrate |
WO2010048782A1 (zh) * | 2008-10-28 | 2010-05-06 | 南京萨特科技发展有限公司 | 片式保险丝及其制备方法 |
JP5192524B2 (ja) * | 2009-09-04 | 2013-05-08 | 乾坤科技股▲ふん▼有限公司 | 保護装置 |
JP5571466B2 (ja) * | 2010-06-10 | 2014-08-13 | イビデン株式会社 | プリント配線板、電子デバイス、及びプリント配線板の製造方法 |
ES2563170T3 (es) * | 2010-07-16 | 2016-03-11 | Schurter Ag | Elemento de fusible |
US9378917B2 (en) * | 2012-02-20 | 2016-06-28 | Matsuo Electric Co., Ltd. | Chip-type fuse |
DE102019114228A1 (de) * | 2019-05-28 | 2020-12-03 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Analogspannungsprogrammierung |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE631489A (de) * | 1962-04-27 | |||
GB1001908A (en) * | 1962-08-31 | 1965-08-18 | Texas Instruments Inc | Semiconductor devices |
US3401452A (en) * | 1966-04-28 | 1968-09-17 | Electra Midland Corp | Method of making a precision electric fuse |
GB1184056A (en) * | 1966-05-20 | 1970-03-11 | Johnson Matthey Co Ltd | Improved Fuse |
US3564354A (en) * | 1968-12-11 | 1971-02-16 | Signetics Corp | Semiconductor structure with fusible link and method |
US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
US4201970A (en) * | 1978-08-07 | 1980-05-06 | Rca Corporation | Method and apparatus for trimming resistors |
-
1983
- 1983-11-28 US US06/555,847 patent/US4626818A/en not_active Expired - Fee Related
-
1984
- 1984-11-20 EP EP84201675A patent/EP0143493B1/de not_active Expired
- 1984-11-20 DE DE8484201675T patent/DE3484731D1/de not_active Expired - Lifetime
- 1984-11-27 JP JP59248828A patent/JPS60157247A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
EP0143493A2 (de) | 1985-06-05 |
EP0143493A3 (en) | 1987-03-04 |
JPS60157247A (ja) | 1985-08-17 |
US4626818A (en) | 1986-12-02 |
JPH0443423B2 (de) | 1992-07-16 |
EP0143493B1 (de) | 1991-06-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3484731D1 (de) | Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung. | |
DE3480752D1 (de) | Elektrisch leitender poroeser film und verfahren zu seiner herstellung. | |
DE3585171D1 (de) | Mehrschichtstoff und verfahren zu dessen herstellung. | |
DE3482814D1 (de) | Behaelter und verfahren zu seiner herstellung. | |
ATA185383A (de) | Kohaerentes, poroeses kollagenfolienmaterial und verfahren zu seiner herstellung | |
DE3483709D1 (de) | Halbleiterspeicher und verfahren zu seiner herstellung. | |
DE3482823D1 (de) | Dihydropyridin-derivate und verfahren zu ihrer herstellung. | |
ATA901883A (de) | Polydom, verfahren zu seiner herstellung und immunodiagnostische verfahren | |
PT74877A (de) | Cephalosporinderivate und verfahren zu ihrer herstellung | |
DE3683924D1 (de) | Mehrschichtiges elastomeres material und verfahren zu seiner herstellung. | |
DE3860618D1 (de) | Filmtraeger und verfahren zu seiner herstellung. | |
DE3581563D1 (de) | Polysiloxanpfropfcopolymer und verfahren zu dessen herstellung. | |
DE3483225D1 (de) | Waesserige atelocollagen-loesung und verfahren zu deren herstellung. | |
ATA403479A (de) | Mehrschichtenfilm und verfahren zu dessen herstellung | |
DE3485189D1 (de) | Kristallines aluminosilikat und verfahren zu dessen herstellung. | |
DE3381711D1 (de) | Halbleiteranordnung und verfahren zu deren herstellung. | |
ATA239381A (de) | Mehrebenen-leiterplatte und verfahren zu deren herstellung | |
DE3485043D1 (de) | Mehrfarbige anzeigevorrichtung und verfahren zu seiner herstellung. | |
AT381268B (de) | Werkzeug und verfahren zu dessen herstellung | |
PT79317B (de) | Cephalosporinderivate und verfahren zu ihrer herstellung | |
DE3483096D1 (de) | Polyacetylen enthaltende mehrschichtstruktur, verfahren zu ihrer herstellung und verwendung. | |
AT385878B (de) | Zigarettenfilter und verfahren zu deren herstellung | |
DE3484184D1 (de) | Keramischer verbundkoerper und verfahren zu dessen herstellung. | |
ATE48134T1 (de) | Herbizide und verfahren zu ihrer herstellung. | |
DE3879536D1 (de) | Supraleitender keramischer film und verfahren zu dessen herstellung. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: NORTH AMERICAN PHILIPS CORP., NEW YORK, N.Y., US |
|
8328 | Change in the person/name/address of the agent |
Free format text: KUPFERMANN, F., DIPL.-ING., PAT.-ANW., 2000 HAMBURG |
|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS NORTH AMERICA CORP., NEW YORK, |
|
8328 | Change in the person/name/address of the agent |
Free format text: PEUCKERT, H., DIPL.-ING., PAT.-ASS., 20097 HAMBURG |
|
8339 | Ceased/non-payment of the annual fee |