DE3483063D1 - Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen. - Google Patents

Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen.

Info

Publication number
DE3483063D1
DE3483063D1 DE8484303326T DE3483063T DE3483063D1 DE 3483063 D1 DE3483063 D1 DE 3483063D1 DE 8484303326 T DE8484303326 T DE 8484303326T DE 3483063 T DE3483063 T DE 3483063T DE 3483063 D1 DE3483063 D1 DE 3483063D1
Authority
DE
Germany
Prior art keywords
markings
producing
alignment
semiconductor disc
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484303326T
Other languages
English (en)
Inventor
Hiroshi C O Oki Elec I Ohtsuka
Yoshio C O Oki Electric I Itoh
Tadashi C O Oki Elec Nishimuro
Hisamitsu C O Miyaza Mitsutomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Application granted granted Critical
Publication of DE3483063D1 publication Critical patent/DE3483063D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7076Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE8484303326T 1983-05-20 1984-05-16 Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen. Expired - Lifetime DE3483063D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58087542A JPS59224123A (ja) 1983-05-20 1983-05-20 ウエハアライメントマ−ク

Publications (1)

Publication Number Publication Date
DE3483063D1 true DE3483063D1 (de) 1990-10-04

Family

ID=13917864

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484303326T Expired - Lifetime DE3483063D1 (de) 1983-05-20 1984-05-16 Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen.

Country Status (4)

Country Link
US (1) US4824254A (de)
EP (1) EP0126621B1 (de)
JP (1) JPS59224123A (de)
DE (1) DE3483063D1 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292440A (ja) * 1985-10-18 1987-04-27 Mitsubishi Electric Corp アライメントマ−ク
WO1989008926A1 (en) * 1988-03-16 1989-09-21 Plessey Overseas Limited Vernier structure for flip chip bonded devices
GB8806232D0 (en) * 1988-03-16 1988-04-13 Plessey Co Plc Vernier structure for flip chip bonded devices
JPH02234085A (ja) * 1989-03-08 1990-09-17 Mitsubishi Electric Corp 半導体装置
IT1251393B (it) * 1991-09-04 1995-05-09 St Microelectronics Srl Procedimento per la realizzazione di strutture metrologiche particolarmente per l'analisi dell'accuratezza di strumenti di misura di allineamento su substrati processati.
CA2096551A1 (en) * 1992-05-22 1993-11-23 Masanori Nishiguchi Semiconductor device
US5294975A (en) * 1992-10-15 1994-03-15 Altera Corporation Laser alignment target for semiconductor integrated circuits
US5300786A (en) * 1992-10-28 1994-04-05 International Business Machines Corporation Optical focus phase shift test pattern, monitoring system and process
US5316984A (en) * 1993-03-25 1994-05-31 Vlsi Technology, Inc. Bright field wafer target
US5311061A (en) * 1993-05-19 1994-05-10 Motorola Inc. Alignment key for a semiconductor device having a seal against ionic contamination
US5469263A (en) * 1994-07-01 1995-11-21 Motorola, Inc. Method for alignment in photolithographic processes
US5876819A (en) * 1995-02-17 1999-03-02 Mitsubishi Denki Kabushiki Kaisha Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same
KR0170909B1 (ko) * 1995-09-27 1999-03-30 김주용 반도체 소자의 오버레이 검사방법
DE19939825A1 (de) * 1999-08-21 2001-03-01 Bosch Gmbh Robert Bauelement mit einem optisch erkennbaren Marker
US6815838B2 (en) 2002-02-20 2004-11-09 International Business Machines Corporation Laser alignment target and method
TWI288428B (en) 2004-01-21 2007-10-11 Seiko Epson Corp Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment
US6989682B1 (en) * 2005-03-16 2006-01-24 United Microelectronics Corp. Test key on a wafer
CN105637097A (zh) 2013-08-05 2016-06-01 特韦斯特生物科学公司 从头合成的基因文库
CA2975855A1 (en) 2015-02-04 2016-08-11 Twist Bioscience Corporation Compositions and methods for synthetic gene assembly
US10669304B2 (en) 2015-02-04 2020-06-02 Twist Bioscience Corporation Methods and devices for de novo oligonucleic acid assembly
US9981239B2 (en) 2015-04-21 2018-05-29 Twist Bioscience Corporation Devices and methods for oligonucleic acid library synthesis
EP3350314A4 (de) 2015-09-18 2019-02-06 Twist Bioscience Corporation Oligonukleinsäurevariantenbibliotheken variante und synthese davon
KR20180058772A (ko) 2015-09-22 2018-06-01 트위스트 바이오사이언스 코포레이션 핵산 합성을 위한 가요성 기판
CN115920796A (zh) 2015-12-01 2023-04-07 特韦斯特生物科学公司 功能化表面及其制备
KR102212257B1 (ko) 2016-08-22 2021-02-04 트위스트 바이오사이언스 코포레이션 드 노보 합성된 핵산 라이브러리
WO2018057526A2 (en) 2016-09-21 2018-03-29 Twist Bioscience Corporation Nucleic acid based data storage
EA201991262A1 (ru) 2016-12-16 2020-04-07 Твист Байосайенс Корпорейшн Библиотеки вариантов иммунологического синапса и их синтез
CN118116478A (zh) 2017-02-22 2024-05-31 特韦斯特生物科学公司 基于核酸的数据存储
CN110913865A (zh) 2017-03-15 2020-03-24 特韦斯特生物科学公司 免疫突触的变体文库及其合成
WO2018231864A1 (en) 2017-06-12 2018-12-20 Twist Bioscience Corporation Methods for seamless nucleic acid assembly
KR20240013290A (ko) 2017-06-12 2024-01-30 트위스트 바이오사이언스 코포레이션 심리스 핵산 어셈블리를 위한 방법
KR20200047706A (ko) 2017-09-11 2020-05-07 트위스트 바이오사이언스 코포레이션 Gpcr 결합 단백질 및 이의 합성 방법
EP3697529B1 (de) 2017-10-20 2023-05-24 Twist Bioscience Corporation Beheizte nanowells für polynukleotidsynthese
WO2019136175A1 (en) 2018-01-04 2019-07-11 Twist Bioscience Corporation Dna-based digital information storage
CA3100739A1 (en) 2018-05-18 2019-11-21 Twist Bioscience Corporation Polynucleotides, reagents, and methods for nucleic acid hybridization
WO2020176678A1 (en) 2019-02-26 2020-09-03 Twist Bioscience Corporation Variant nucleic acid libraries for glp1 receptor
CA3131691A1 (en) 2019-02-26 2020-09-03 Twist Bioscience Corporation Variant nucleic acid libraries for antibody optimization
AU2020298294A1 (en) 2019-06-21 2022-02-17 Twist Bioscience Corporation Barcode-based nucleic acid sequence assembly
TWI736226B (zh) * 2020-04-21 2021-08-11 錼創顯示科技股份有限公司 對位結構
CN117492336B (zh) * 2024-01-02 2024-04-09 天府兴隆湖实验室 对准标记及图形对准方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885877A (en) * 1973-10-11 1975-05-27 Ibm Electro-optical fine alignment process
GB1550867A (en) * 1975-08-04 1979-08-22 Hughes Aircraft Co Positioning method and apparatus for fabricating microcircuit devices
US4066485A (en) * 1977-01-21 1978-01-03 Rca Corporation Method of fabricating a semiconductor device
US4309813A (en) * 1979-12-26 1982-01-12 Harris Corporation Mask alignment scheme for laterally and totally dielectrically isolated integrated circuits
JPS5694741A (en) * 1979-12-28 1981-07-31 Fujitsu Ltd Positioning mark for electronic beam exposure
US4356223A (en) * 1980-02-28 1982-10-26 Nippon Electric Co., Ltd. Semiconductor device having a registration mark for use in an exposure technique for micro-fine working
US4419013A (en) * 1981-03-30 1983-12-06 Tre Semiconductor Equipment Corporation Phase contrast alignment system for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
EP0126621A2 (de) 1984-11-28
US4824254A (en) 1989-04-25
JPH0463533B2 (de) 1992-10-12
EP0126621A3 (en) 1986-01-15
EP0126621B1 (de) 1990-08-29
JPS59224123A (ja) 1984-12-17

Similar Documents

Publication Publication Date Title
DE3483063D1 (de) Ausrichtungsmarkierungen auf halbleiterscheiben und verfahren zum herstellen der markierungen.
DE3575241D1 (de) Halbleiteranordnung und verfahren zum herstellen derselben.
DE3875463D1 (de) Verfahren zum verkuerzen der formgebungstaktzeit.
DE3381509D1 (de) Verfahren zum herstellen von halbleiteranordnungen.
DE3579681D1 (de) Verfahren und vorrichtung zum waermebehandeln von schienen.
DE3770239D1 (de) Mundstueck und verfahren zum herstellen von diesem.
DE68908326D1 (de) Verfahren zum herstellen elektrochromer vorrichtungen.
DE3684676D1 (de) Verfahren zum herstellen von halbleitersubstraten.
DE3585417D1 (de) Verfahren und vorrichtung zum herstellen von glasgegenstaenden.
DE3482523D1 (de) Verfahren zum herstellen eines elektrets und anordnungen.
DE3382563D1 (de) Verfahren zum unterscheiden zwischen komplexen zeichenvorraeten.
DE3861164D1 (de) Verfahren zum herstellen von sphaerischen teilchen.
DE3876019D1 (de) Verfahren und vorrichtung zum herstellen von pyramidenstumpffoermiger dosenzargen.
DE3772490D1 (de) Halbleiteranordnung sowie verfahren zum herstellen und testen derselben.
DE3481412D1 (de) Apparat zum herstellen von etiketten.
DE3784605D1 (de) Verfahren zum herstellen einer halbleitervorrichtung und halbleitervorrichtung.
DE58904461D1 (de) Verfahren zum herstellen von schaumstoffpolstern.
DE3482530D1 (de) Elektrisch programmierbare speicheranordnung und verfahren zum herstellen derselben.
DE3587514D1 (de) Verfahren und vorrichtung zum berechnen der beziehung zwischen der rohlinse und der brillenlinse.
DE3578266D1 (de) Verfahren zum herstellen von halbleiteranordnungen und dadurch hergestellte anordnungen.
DE3577781D1 (de) Ein festwertspeicher und ein verfahren zum herstellen desselben.
DE3586019D1 (de) Verfahren zum herstellen eines elektrostriktiven elementes.
AT381875B (de) Verfahren zum richten von eisenbahnschienen und durch das verfahren hergestellte eisenbahnschienen
DE3481569D1 (de) Verfahren zum herstellen von diamantwaermesenken.
DE3483520D1 (de) Verfahren zum herstellen bedruckter formkoerper.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition