DE3473112D1 - An integrated circuit module to planar board interconnection system - Google Patents

An integrated circuit module to planar board interconnection system

Info

Publication number
DE3473112D1
DE3473112D1 DE8484109399T DE3473112T DE3473112D1 DE 3473112 D1 DE3473112 D1 DE 3473112D1 DE 8484109399 T DE8484109399 T DE 8484109399T DE 3473112 T DE3473112 T DE 3473112T DE 3473112 D1 DE3473112 D1 DE 3473112D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit module
interconnection system
planar board
board interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484109399T
Other languages
German (de)
Inventor
Robert Babuka
John Lawrence Piechota
Leonard John Poch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3473112D1 publication Critical patent/DE3473112D1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
DE8484109399T 1983-08-25 1984-08-08 An integrated circuit module to planar board interconnection system Expired DE3473112D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/526,190 US4553192A (en) 1983-08-25 1983-08-25 High density planar interconnected integrated circuit package

Publications (1)

Publication Number Publication Date
DE3473112D1 true DE3473112D1 (en) 1988-09-01

Family

ID=24096298

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484109399T Expired DE3473112D1 (en) 1983-08-25 1984-08-08 An integrated circuit module to planar board interconnection system

Country Status (4)

Country Link
US (1) US4553192A (en)
EP (1) EP0147519B1 (en)
JP (1) JPS6049656A (en)
DE (1) DE3473112D1 (en)

Families Citing this family (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677458A (en) * 1983-11-04 1987-06-30 Control Data Corporation Ceramic IC package attachment apparatus
USRE33604E (en) * 1984-02-06 1991-06-04 International Business Machines Corporation Connector mechanisms
US4636019A (en) * 1984-02-06 1987-01-13 International Business Machines Corporation Connector mechanisms
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS62130500U (en) * 1986-02-13 1987-08-18
US5227959A (en) * 1986-05-19 1993-07-13 Rogers Corporation Electrical circuit interconnection
US4764848A (en) * 1986-11-24 1988-08-16 International Business Machines Corporation Surface mounted array strain relief device
US4768971A (en) * 1987-07-02 1988-09-06 Rogers Corporation Connector arrangement
JPH01114057A (en) * 1987-10-27 1989-05-02 Nec Corp Ic socket
US4830623A (en) * 1988-02-10 1989-05-16 Rogers Corporation Connector arrangement for electrically interconnecting first and second arrays of pad-type contacts
US4976626A (en) * 1988-12-21 1990-12-11 International Business Machines Corporation Connector for connecting flexible film circuit carrier to board or card
JPH03173077A (en) * 1989-11-30 1991-07-26 Toshiba Corp Connector device
US5046953A (en) * 1990-05-25 1991-09-10 Hewlett-Packard Company Method and apparatus for mounting an integrated circuit on a printed circuit board
US5716218A (en) * 1991-06-04 1998-02-10 Micron Technology, Inc. Process for manufacturing an interconnect for testing a semiconductor die
JP2665419B2 (en) * 1991-08-13 1997-10-22 山一電機株式会社 Connector for electrical components
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
BR9405792A (en) * 1993-12-23 1995-12-19 Motorola Inc Double beam contact for making connection and double beam contact for making electrical connection
FR2714539B1 (en) † 1993-12-24 1996-01-26 Itt Composants Instr Electrical connector for the connection of an electronic memory card.
US5494448A (en) * 1994-03-15 1996-02-27 Motorola, Inc. Cantilever spring and method for temporarily coupling a semiconductor device to a transmission line using the cantilever spring
WO1996002913A1 (en) * 1994-07-15 1996-02-01 Berg Technology, Inc. Long arm compression connector with bump header
US5664973A (en) * 1995-01-05 1997-09-09 Motorola, Inc. Conductive contact
US5529504A (en) * 1995-04-18 1996-06-25 Hewlett-Packard Company Electrically anisotropic elastomeric structure with mechanical compliance and scrub
EP0742682B1 (en) * 1995-05-12 2005-02-23 STMicroelectronics, Inc. Low-profile socketed integrated circuit packaging system
US5557503A (en) * 1995-05-12 1996-09-17 International Business Machines Corporation Circuit card having a large module strain relief and heat sink support
US5991158A (en) * 1995-05-24 1999-11-23 Dell Usa, L.P. Slot for mechanically detecting the presence of a computer card
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
GB9513540D0 (en) 1995-07-04 1995-09-06 Elco Europ Ltd Electrical connectors
US5655913A (en) * 1995-09-26 1997-08-12 Motorola, Inc. Electrical interconnect contact
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US5756370A (en) * 1996-02-08 1998-05-26 Micron Technology, Inc. Compliant contact system with alignment structure for testing unpackaged semiconductor dice
US8033838B2 (en) * 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6880245B2 (en) * 1996-03-12 2005-04-19 International Business Machines Corporation Method for fabricating a structure for making contact with an IC device
US5746626A (en) * 1996-10-11 1998-05-05 Bourns, Inc. Electrical connector assembly
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6520778B1 (en) * 1997-02-18 2003-02-18 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US5820389A (en) * 1997-02-27 1998-10-13 Japan Aviation Electronics Industry, Limited Contact set having a wiping action for printed circuit board
US5815427A (en) * 1997-04-02 1998-09-29 Micron Technology, Inc. Modular memory circuit and method for forming same
US6224396B1 (en) 1997-07-23 2001-05-01 International Business Machines Corporation Compliant, surface-mountable interposer
US6807734B2 (en) 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
GB9804333D0 (en) * 1998-02-27 1998-04-22 Amp Great Britain Device-to-board electrical connector
JP3284342B2 (en) * 1998-04-17 2002-05-20 日本航空電子工業株式会社 connector
JP3068557B2 (en) * 1998-04-30 2000-07-24 北川工業株式会社 Grounding structure of printed wiring board and conductive member used for the grounding structure
US6705876B2 (en) * 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
FR2784806B1 (en) * 1998-10-14 2001-01-26 Proner Comatel Sa METAL CONNECTION CONTACT, PACKAGING PACKAGING FOR THIS CONTACT AND ITS PACKAGING METHOD
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6077089A (en) * 1999-01-19 2000-06-20 Avx Corporation Low profile electrical connector
US6273731B1 (en) 1999-01-19 2001-08-14 Avx Corporation Low profile electrical connector
JP2000323216A (en) * 1999-05-07 2000-11-24 Kyoshin Kogyo Co Ltd Connection terminal and taping connection terminal
US7215131B1 (en) * 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US7189077B1 (en) * 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6713374B2 (en) 1999-07-30 2004-03-30 Formfactor, Inc. Interconnect assemblies and methods
US7435108B1 (en) 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6296495B1 (en) * 1999-11-05 2001-10-02 Hon Hai Precision Ind. Co., Ltd. Land grid package connector
JP2001143802A (en) * 1999-11-16 2001-05-25 Yazaki Corp Butting contact terminal structure
US6434817B1 (en) 1999-12-03 2002-08-20 Delphi Technologies, Inc. Method for joining an integrated circuit
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
US6640432B1 (en) * 2000-04-12 2003-11-04 Formfactor, Inc. Method of fabricating shaped springs
US7458816B1 (en) 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
US6257899B1 (en) * 2000-07-26 2001-07-10 Hon Hai Precision Ind. Co., Ltd. Soft internal touch contact for IC socket
US6723927B1 (en) * 2000-08-24 2004-04-20 High Connection Density, Inc. High-reliability interposer for low cost and high reliability applications
US6319054B1 (en) 2000-11-30 2001-11-20 Avx Corporation Electrical connector
US20030070836A1 (en) * 2001-10-12 2003-04-17 Quint David W. PGA chip package and process for same
TW536122U (en) * 2002-09-27 2003-06-01 Emi Stop Corp Corner elastic sheet
US20040102066A1 (en) * 2002-11-21 2004-05-27 Fci Americas Technology, Inc. Electrical connector with deflectable contacts and fusible elements
TW570346U (en) * 2003-03-12 2004-01-01 Hon Hai Prec Ind Co Ltd Contact for electrical connector
US6791843B1 (en) * 2003-06-11 2004-09-14 Hewlett-Packard Development Company, L.P. Parallel board connection system and method
TWM250411U (en) * 2003-07-04 2004-11-11 Hon Hai Prec Ind Co Ltd Land grid array socket
US6994565B2 (en) * 2003-07-14 2006-02-07 Fci Americas Technology, Inc. Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element
DE10354585A1 (en) * 2003-11-21 2005-06-16 Robert Bosch Gmbh connecting element
CN100373995C (en) * 2004-01-05 2008-03-05 番禺得意精密电子工业有限公司 Electric conductor embedding method and circuit board and chip using said method
TWM256608U (en) * 2004-02-06 2005-02-01 Hon Hai Prec Ind Co Ltd Socket connector
US7057295B2 (en) * 2004-04-22 2006-06-06 Ted Ju IC module assembly
US7121841B2 (en) * 2004-11-10 2006-10-17 Intel Corporation Electrical socket with compressible domed contacts
CN101316014B (en) * 2007-10-17 2012-02-01 番禺得意精密电子工业有限公司 Electric connection device and assembly method thereof
CN201178168Y (en) * 2007-11-26 2009-01-07 富士康(昆山)电脑接插件有限公司 Electric connector
TWI373166B (en) * 2008-05-12 2012-09-21 Hon Hai Prec Ind Co Ltd Electrical contact
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
US20100136821A1 (en) * 2008-11-28 2010-06-03 Sheng-Yuan Huang Connector terminal and method for making the same
JP5500870B2 (en) * 2009-05-28 2014-05-21 新光電気工業株式会社 Substrate with connection terminal and socket for electronic parts
JP5606695B2 (en) * 2009-07-03 2014-10-15 新光電気工業株式会社 Board with connection terminal
US8278748B2 (en) * 2010-02-17 2012-10-02 Maxim Integrated Products, Inc. Wafer-level packaged device having self-assembled resilient leads
TWM391758U (en) 2010-04-28 2010-11-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP2012186087A (en) * 2011-03-07 2012-09-27 Fujitsu Component Ltd Connector
JP2014011048A (en) * 2012-06-29 2014-01-20 Fujitsu Component Ltd Contact member
JP2014071964A (en) * 2012-09-27 2014-04-21 Fujitsu Component Ltd Contact member
DE102013208681A1 (en) 2013-05-13 2014-11-13 Robert Bosch Gmbh Electronic component as well as control unit with the electronic component
TWI543451B (en) * 2013-07-30 2016-07-21 鴻海精密工業股份有限公司 Electrical connector and assembly thereof
US9011187B2 (en) * 2013-09-04 2015-04-21 Cheng Uei Precision Industry Co., Ltd. Electrical connector
CN106470534B (en) * 2015-08-14 2019-11-01 富士康(昆山)电脑接插件有限公司 Electronic device
TW201709794A (en) * 2015-08-17 2017-03-01 鴻騰精密科技股份有限公司 Electrical device
JP6601203B2 (en) * 2015-10-28 2019-11-06 株式会社オートネットワーク技術研究所 Terminal fittings and connectors
JP6684419B2 (en) * 2016-03-02 2020-04-22 北川工業株式会社 contact
US10514391B2 (en) * 2016-08-22 2019-12-24 Kla-Tencor Corporation Resistivity probe having movable needle bodies

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2065611A (en) * 1934-04-25 1936-12-29 Gemmer Mfg Co Steering mechanism
US3172719A (en) * 1964-08-05 1965-03-09 paholek etal
NL6504501A (en) * 1965-01-11 1966-07-12
US3395377A (en) * 1966-03-22 1968-07-30 Dale Electronics Digital connector
US3391383A (en) * 1966-06-20 1968-07-02 Hughes Aircraft Co Electrical connector for integrated circuit elements
US3701071A (en) * 1971-01-18 1972-10-24 Berg Electronics Inc Hinge type circuit board connector block
BE789688A (en) * 1971-10-06 1973-04-04 Amp Inc CONNECTOR
IL40587A (en) * 1971-11-05 1975-04-25 Bunker Ramo Electrical connector assemblies
US3771109A (en) * 1972-05-01 1973-11-06 Bunker Ramo Electrical connector for integrated circuit device
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US3877064A (en) * 1974-02-22 1975-04-08 Amp Inc Device for connecting leadless integrated circuit packages to a printed-circuit board
US3982159A (en) * 1974-11-11 1976-09-21 E. I. Du Pont De Nemours And Company Leadless package retaining frame
US4052118A (en) * 1975-05-30 1977-10-04 Amp Incorporated Contact carrying spring member
GB2008333B (en) * 1977-11-14 1982-05-26 Amp Inc Electrical connector
US4220383A (en) * 1979-04-06 1980-09-02 Amp Incorporated Surface to surface connector
US4278311A (en) * 1979-04-06 1981-07-14 Amp Incorporated Surface to surface connector
US4354720A (en) * 1980-10-20 1982-10-19 Amp Incorporated Connector assembly having improved latching means
JPS5922707Y2 (en) * 1980-11-10 1984-07-06 山一電機工業株式会社 Attachment/detaching device for flat IC package in IC carrier
US4354729A (en) * 1980-12-22 1982-10-19 Amp Incorporated Preloaded electrical contact terminal
US4381131A (en) * 1981-05-04 1983-04-26 Burroughs Corporation Levered system connector for an integrated circuit package
US4427247A (en) * 1981-06-12 1984-01-24 Augat Inc. Magnetic bubble memory socket

Also Published As

Publication number Publication date
EP0147519B1 (en) 1988-07-27
JPS6049656A (en) 1985-03-18
EP0147519A1 (en) 1985-07-10
JPH0310232B2 (en) 1991-02-13
US4553192A (en) 1985-11-12

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