CN100373995C - Electric conductor embedding method and circuit board and chip using said method - Google Patents
Electric conductor embedding method and circuit board and chip using said method Download PDFInfo
- Publication number
- CN100373995C CN100373995C CNB2004100150062A CN200410015006A CN100373995C CN 100373995 C CN100373995 C CN 100373995C CN B2004100150062 A CNB2004100150062 A CN B2004100150062A CN 200410015006 A CN200410015006 A CN 200410015006A CN 100373995 C CN100373995 C CN 100373995C
- Authority
- CN
- China
- Prior art keywords
- electric conductor
- circuit board
- contact
- chip
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000004020 conductor Substances 0.000 title claims description 47
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 230000006835 compression Effects 0.000 claims 3
- 238000007906 compression Methods 0.000 claims 3
- 238000003466 welding Methods 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011469 building brick Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention discloses a method for planting a conductive body, which comprises the following steps that a plurality of conductive bodies are supplied, each conductive body comprises a bonding part, a connecting part and a contact part; a main body is supplied; the conductive bodies are bonded on the main body through the bonding part; a circuit board or chip of the present invention is provided with a plurality of contacts; the conductive bodies are planted on a circuit board or chip; each conductive body comprises a bond part, a connecting part and a contact part; the bonding part is fixedly bonded to the circuit board or chip, and the connecting part is in contact with the contacts. Compared with the prior art, the conductive bodies are fixed in a bonding method to make the conductive bodies plant on the main body directly, the present invention has the advantages of simple structure, convenient assembly and low height of electronic products.
Description
[technical field]
The present invention relates to a kind of electric conductor and plants method and make in this way circuit board and chip.
[background technology]
Electronic building brick (as chip) electrically connects by electric connector usually with circuit board, but because electric connector structure complexity, manufacturing cost is higher relatively, under some applied environment, electric connection between electronic building brick and the circuit board does not need so complicated structure, therefore moreover this structure and electronic product are light, thin, short, little developing direction is not inconsistent, and are necessary to adopt other structure comparatively simple and help reducing the electric connection mode of electronic product height.
[summary of the invention]
The object of the present invention is to provide a kind of electric conductor to plant method and make in this way circuit board and chip, so that electronic building brick is simple in structure, it is convenient to assemble, and can reduce the height of electronic product.
Implementing the electric conductor method of planting of the present invention may further comprise the steps: several conducting is provided, and each electric conductor comprises adhesive portion, connecting portion and contact site; One main body is provided, and this main body is provided with some conductive junction points; Electric conductor is bonded on the main body by adhesive portion; The electric conductor connecting portion is connected with above-mentioned contact.
Circuit board of the present invention or chip, it is provided with some contacts, has planted several conducting on this circuit board or the chip, and each electric conductor comprises adhesive portion, connecting portion and contact site, and this adhesive portion is adhesively fixed on circuit board or chip, and connecting portion is connected with contact.
Compared with prior art, the present invention by adhering method fixedly electric conductor electric conductor is directly planted on main body, so structure is simple relatively, it is comparatively convenient to assemble, and helps reducing the electronic product height.
[description of drawings]
Fig. 1 is for implementing the structural representation of first embodiment of the present invention.
Fig. 2 is for implementing the structural representation of second embodiment of the present invention.
Fig. 3 is for implementing the structural representation of the 3rd embodiment of the present invention.
Fig. 4 is for implementing the structural representation of the 4th embodiment of the present invention.
Fig. 5 is for implementing the stereogram of the 5th embodiment electric conductor of the present invention.
Fig. 6 is the structural representation of chip of the present invention.
[embodiment]
See also shown in Figure 1ly, implement the electric conductor method of planting of the present invention and may further comprise the steps:
1) provide number of metal electric conductor 10, wherein electric conductor 10 comprises adhesive portion 11, connecting portion 12 and contact site 13.
2) provide a circuit board 20, its upper surface is provided with some contacts 21.
3) electric conductor 10 is positioned on the upper surface of circuit board 20, and its adhesive portion 11 usefulness binding agents 38 are bonded on the correspondence position of circuit board 20 upper surfaces.
4) connecting portion 12 with electric conductor 10 is welded on the contact 21 of circuit board 20.In the present embodiment, be on circuit board contact 21, to be coated with one deck tin cream 30 earlier, again electric conductor connecting portion 12 be placed on above the tin cream 30, add thermal weld then, those skilled in the art expect easily certainly, also can electric conductor are placed on above the circuit board contact earlier, be coated with tin cream again, add thermal weld then.
Figure 2 shows that the present invention plants another embodiment of electric conductor on circuit board, present embodiment may further comprise the steps:
1) provide number of metal electric conductor 10 ', wherein electric conductor comprises adhesive portion 11 ', connecting portion 12 ' and contact site 13 '.
2) provide a circuit board 20 ', this circuit board is provided with plurality of holes 22 ', and lower surface is provided with some contacts 21 '.
3) electric conductor 10 ' is positioned on the lower surface of circuit board 20 ', its adhesive portion 11 ' is bonded on circuit board 20 ' the lower surface correspondence position, the contact site 13 ' of electric conductor 10 ' then passes circuit board hole 23 ' and stretches out in circuit board 20 ' upper surface.
4) connecting portion 12 ' with electric conductor 10 ' is welded on the contact 21 ' of circuit board 20 '.
Certainly, the adhesive portion of electric conductor also can directly be compressed mutually with circuit board and contact (as shown in Figure 3, Figure 4), and needn't adopt solder technology.
Certainly, connecting portion 42 places of electric conductor 40 also can be provided with through hole 44 (as shown in Figure 5), and are more firmly bonding to make.
Compared to prior art, the present invention directly plants electric conductor 10 on circuit board 20 by electric conductor 10 being adhered on the circuit board 20, does not therefore need electric connector, it is convenient to assemble, simple in structure, and be beneficial to reduction electronic product height, adapt to the compact development trend of electronic product.
Figure 6 shows that the present invention uses above-mentioned electric conductor to plant the chip structure of method, these chip 50 lower surfaces are provided with some contacts 52, the position that its electric conductor 60 adhesive portion 62 are adhesively fixed and do not establish contact 52 in chip 50 lower surfaces, and its connecting portion 64 is connected with contact 52, this chip structure is simple, it is convenient to assemble, and because of not needing electric connector, thereby can reduce the electronic product height.
Certainly, persons skilled in the art are understood easily, above-mentioned electric conductor plants method and also can be applicable on the other products, as can in this way electric conductor being fixed on the electric connector insulating body, like this, because of need on electric conductor, not establishing fixed structure, thereby can significantly reduce the height of electric connector, and simple in structure, it is convenient to assemble, and can also control the flatness of the weld part that welds mutually with circuit board on the electric conductor preferably.
Claims (8)
1. an electric conductor plants method, it is characterized in that may further comprise the steps: several conducting is provided, and each electric conductor comprises adhesive portion, connecting portion and contact site; One main body is provided, and this main body is provided with some conductive junction points; Electric conductor is bonded on the main body by adhesive portion; The electric conductor connecting portion is connected with above-mentioned contact.
2. electric conductor as claimed in claim 1 plants method, it is characterized in that: the connecting portion of this electric conductor is connected by the welding manner or the elastic compression way of contact with contact system.
3. plant method as arbitrary described electric conductor in claim 1 or 2, it is characterized in that: this main body is circuit board or chip.
4. circuit board, it is provided with some contacts, it is characterized in that: planted several conducting on this circuit board, each electric conductor comprises adhesive portion, connecting portion and contact site, and this adhesive portion is adhesively fixed on circuit board, and connecting portion is connected with contact.
5. circuit board as claimed in claim 4 is characterized in that: this circuit board is provided with plurality of holes, and this electric conductor is adhered to the circuit board first surface, stretches out in the circuit board second surface and contact site extends through hole, and this second surface is relative with first surface.
6. circuit board as claimed in claim 4 is characterized in that: the connecting portion of this electric conductor is connected by the welding manner or the elastic compression way of contact with contact system.
7. chip, it is provided with some contacts, it is characterized in that: planted several conducting on this chip, each electric conductor comprises adhesive portion, connecting portion and contact site, and this adhesive portion is adhesively fixed on chip, and connecting portion is connected with contact.
8. chip as claimed in claim 7 is characterized in that: the connecting portion of this electric conductor is connected by the welding manner or the elastic compression way of contact with contact system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100150062A CN100373995C (en) | 2004-01-05 | 2004-01-05 | Electric conductor embedding method and circuit board and chip using said method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100150062A CN100373995C (en) | 2004-01-05 | 2004-01-05 | Electric conductor embedding method and circuit board and chip using said method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1556667A CN1556667A (en) | 2004-12-22 |
| CN100373995C true CN100373995C (en) | 2008-03-05 |
Family
ID=34351269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100150062A Expired - Fee Related CN100373995C (en) | 2004-01-05 | 2004-01-05 | Electric conductor embedding method and circuit board and chip using said method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100373995C (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4553192A (en) * | 1983-08-25 | 1985-11-12 | International Business Machines Corporation | High density planar interconnected integrated circuit package |
| US5395252A (en) * | 1993-10-27 | 1995-03-07 | Burndy Corporation | Area and edge array electrical connectors |
| CN2365788Y (en) * | 1999-04-13 | 2000-02-23 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN1250550A (en) * | 1997-03-18 | 2000-04-12 | 罗姆股份有限公司 | Connector |
| CN2415474Y (en) * | 2000-03-02 | 2001-01-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN1308393A (en) * | 2000-02-10 | 2001-08-15 | 富士康(昆山)电脑接插件有限公司 | Manufacture of socket connector |
-
2004
- 2004-01-05 CN CNB2004100150062A patent/CN100373995C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4553192A (en) * | 1983-08-25 | 1985-11-12 | International Business Machines Corporation | High density planar interconnected integrated circuit package |
| US5395252A (en) * | 1993-10-27 | 1995-03-07 | Burndy Corporation | Area and edge array electrical connectors |
| CN1250550A (en) * | 1997-03-18 | 2000-04-12 | 罗姆股份有限公司 | Connector |
| CN2365788Y (en) * | 1999-04-13 | 2000-02-23 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN1308393A (en) * | 2000-02-10 | 2001-08-15 | 富士康(昆山)电脑接插件有限公司 | Manufacture of socket connector |
| CN2415474Y (en) * | 2000-03-02 | 2001-01-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1556667A (en) | 2004-12-22 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080305 |
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| CF01 | Termination of patent right due to non-payment of annual fee |