DE2847691A1 - Washing liq. for cleaning printed circuit surface - contains xylene, glycol mono:butyl ether, isobutanol and opt. toluene and (m)ethanol - Google Patents

Washing liq. for cleaning printed circuit surface - contains xylene, glycol mono:butyl ether, isobutanol and opt. toluene and (m)ethanol

Info

Publication number
DE2847691A1
DE2847691A1 DE19782847691 DE2847691A DE2847691A1 DE 2847691 A1 DE2847691 A1 DE 2847691A1 DE 19782847691 DE19782847691 DE 19782847691 DE 2847691 A DE2847691 A DE 2847691A DE 2847691 A1 DE2847691 A1 DE 2847691A1
Authority
DE
Germany
Prior art keywords
isobutanol
washing liquid
toluene
opt
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19782847691
Other languages
German (de)
Other versions
DE2847691C2 (en
Inventor
Herbert Kuenzig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19782847691 priority Critical patent/DE2847691C2/en
Publication of DE2847691A1 publication Critical patent/DE2847691A1/en
Application granted granted Critical
Publication of DE2847691C2 publication Critical patent/DE2847691C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/24—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A washing liq. consisting of xylene (I), glycol monobutyl ether (II), and isobutanol (III), is used for cleaning circuit surfaces coated with a resin-, rosin- or aminoalcohol-based flux, remaining after soldering. The mixts. have flash points >21 degrees C and can be used in a brush roller cleaning machine. A pref. washing liq. mixt., having flash point 24-26 degrees C, contains, by vol., 30% (I), 32.5% (II) and 37.5% (III). (I) may be replaced, opt. entirely, by toluene, and (III) by EtOH and/or MeOH, but these exchanges result in a lowered flash point.

Description

Waschflüssigkeit zur Reinigung von Ober-Washing liquid for cleaning upper

flächen gedruckter Schaltungen Die Erfindung bezieht sich auf eine Waschflüssigkeit zur Reinigung von Oberflächen gedruckter Schaltungen, die mit einer nach dem Löten zurückgebliebenen Flußmittelschicht auf der Basis von Harzen, Kolophonium oder Amminoalkoholen überzogen sind.printed circuit surfaces The invention relates to a Washing liquid for cleaning the surfaces of printed circuits that have a Resin-based flux layer left after soldering, rosin or amino alcohols are coated.

Ausgangspunkt der Erfindung ist die gleiche Beobachtung von der auch der Gegenstand des DBP 19 58 875 ausgeht nämlich, daß die beim Löten entstandenen Spaltprodukte und Salze ebenso wie die Aktivatoren in der Kolophoniumschitlt eingeschmol2en und außerdem offenbar auch darin gelöst sind. Dementsprechend bestehen also Wechselwirkungen zwischen dem Kolophonium einerseits und den Spaltprodukten, Salzen sowie den Aktivatoren andererseits. Daraus kann auf das Vorhandensein entsprechender kollodialer Teilchen in der nach dem Löten zurückgebliebenen, erstarrten Schicht geschlossen werden.The starting point of the invention is the same observation of that too the subject of DBP 19 58 875 assumes namely that the soldered Cleavage products and salts as well as the activators in the rosin box melted in and apparently also dissolved in it. Accordingly exist i.e. interactions between the rosin on the one hand and the fission products, Salts and the activators on the other hand. From this it can be appropriate to the presence colloidal particles in the solidified layer left after soldering getting closed.

In Gegenwart von Ionen wird die Beständigkeit insbesondere lyophober Kolloide stark beeinträchtigt.In the presence of ions, the resistance becomes particularly lyophobic Colloids severely affected.

Obwohl in.der beim Löten zurückgebliebenen Schicht auch Salze und Spaltprodukte eingeschmolzen sind, ist in diesem Fall noch keine Beeinträchtigung der Beständigkeit der Kolloide gegeben, da Salze und Spaltprodukte nicht dissotiiert sind. Außerdem ist Kollophonium nicht in Wasser löslich.Although in the layer left behind during soldering there are also salts and Fission products are melted down, in this case there is still no impairment given the stability of the colloids, since salts and cleavage products are not dissotiated are. In addition, rosin is not soluble in water.

Eine Dissoziation und damit auch eine entsprechende Ionenbildung kann jedoch leicht beim Reinigen der Oberfläche einer gedruckten Schaltung mittels Abwaschen auftreten. Dabei werden nachteiligerweise Spaltprodukte, Aktivatoren und Metallsalze aus der Lösung ausgefällt0 so daß<auf der Oberfläche von gedruckten Schaltungen nach Zutritt von Luftfeuchtigkeit weiße Rückstände entstehen. Diese Schwierigkeiten treten bei Verwendung einer Waschflüssigkeit nach dem DBP 19 58 875 nicht auf, die einerseits die Grundsubstanz der Schicht löst, andererseits aber gegenüber den kolloiden lyophobes Verhalten zeigt. Eine derartige lyophobe Waschflüssigkeit besitzt eine nur sehr geringe elektrische Leitfähigkeit. Mit einer solchen lyophoben Waschflüssigkeit ist es möglich, eine nach dem Löten zurückgebliebene Kolophoniumschicht derart abzuwaschen, daß mit den Spaltprodukten und Metallsalzen gebildete Kolloide erhalten bleiben und daß die kolloidale Lösung verdünnt wird. Unerwünschte durch das Ausfallen von Spaltprodukten und Metallsalzen bedingte Folgeerscheinungen werden dadurch vorteilhafterweise vermieden.A dissociation and thus also a corresponding ion formation can but easy to wash off the surface of a printed circuit board appear. The disadvantage here are cleavage products, activators and metal salts precipitated from solution0 so that <on the surface of printed circuit boards white residues arise after exposure to air humidity. These difficulties do not occur when using a washing liquid according to DBP 19 58 875, the on the one hand it dissolves the basic substance of the layer, but on the other hand it dissolves the colloid lyophobes Behavior shows. Such a lyophobic washing liquid has only a very high level of quality low electrical conductivity. With such a lyophobic washing liquid Is it possible to wash off a layer of rosin that has remained after soldering in such a way that that colloids formed with the cleavage products and metal salts are retained and that the colloidal solution is diluted. Unwanted by failing Consequences caused by fission products and metal salts are thereby advantageous avoided.

Die Waschflüssigkeit des vorbekannten DBP 19 58 875 hat einen relativ niedrigen Flammpunkt. Sie kann daher bei einem maschinellen Waschen von Oberflächen von gedruckten Schaltungen nicht ohne weiteres eingesetzt werden, sofern - entsprechend der Gefahrenklasse A II - ein Flammpunkt>210 C gefordert wird.The washing liquid of the previously known DBP 19 58 875 has a relative low flash point. It can therefore be used for machine washing of surfaces of printed circuits cannot be used without further ado, provided that - accordingly of hazard class A II - a flash point> 210 C is required.

Der vorliegenden Erfindung liegt dem entsprechend die Aufgabe zugrunde, die vorstehend dargelegten Bedingungen - die die Waschflüssigkeit nach dem DBP 19 58 875 erfüllt - mit einer Waschflüssigkeit zu erfüllen, deren Flammpunkt >210 C ist.The present invention is accordingly based on the object the conditions set out above - the washing liquid according to the DBP 19 58 875 fulfilled - to be fulfilled with a washing liquid with a flash point> 210 C is.

Diese Aufgabe wird dadurch gelöst, daß die Waschflüssigkeit aus Dimethylbenzol (Xylol), Glykolmonobutyläther (Butylglykol) und Isobutanol (Butylalkohol) besteht.This object is achieved in that the washing liquid consists of dimethylbenzene (Xylene), glycol monobutyl ether (butyl glycol) and isobutanol (butyl alcohol).

In einer vorteilhaften#Ausführüngsform der Waschflüssigkeit besteht das Gemisch aus 30 Vol ,~ Xylol 32,5 Vol "% Butylglykol 37,5 Vol % Butylalkohol Für dieses Gemisch ergibt sich ein Flammpunkt von 240#260 C.In an advantageous embodiment, the washing liquid consists the mixture of 30 vol% xylene 32.5 vol% butyl glycol 37.5 vol% butyl alcohol This mixture has a flash point of 240 # 260 C.

Es kann daher in einer Walzenbürstmaschine für gedruckte Schaltungen zum Reinigen deren Oberflächen nach dem Löten eingesetzt werden, obwohl für eine derartige Reinigung die Bestimmungen der Gefahrenklasse A II gelten. Lötmaschinen mit nachgeschalteter Waschmaschine sind an sich bekannt.It can therefore be used in a roller brush machine for printed circuit boards to clean the surfaces of which are used after soldering, although for a such cleaning the provisions of hazard class A II apply. Soldering machines with a downstream washing machine are known per se.

Ein Vorteil derselben ist, daß die Lötrahmen mitgewaschen werden. Ein besonderer Vorteil im vorliegenden Fall ist jesoch, daß trotz maschinellen Waschens auch die Vorteile erreicht werden, die für die Waschflüssigkeit des DBP 19 58 875 gelten. Üblicherweise werden beim maschinellen Waschen chlorierte #ohlenwasserstoffe, wie z.B. 1,1, 1-Trichlor-äthan, eingesetzt, wobei jedoch die Kolloide aus ihrer Lösung ausfallen und weiße Rückstände erzeugen. Zusätzlich sind empfindliche Bauelemente gefährdet.One advantage of this is that the solder frames are washed with them. A particular advantage in the present case is that despite machine washing also the advantages can be achieved for the washing liquid of the DBP 19 58 875 are valid. Usually chlorinated hydrocarbons are used in machine washing, such as 1,1, 1-trichloroethane, used, but the colloids from their Solution will precipitate and produce white residue. In addition, there are sensitive components endangered.

Bei der Waschflüssigkeit nach der Erfindung können Xylol ganz oder teilweise durch Toluol und Butanol ganz oder teilweise durch Äthanol und/oder Methanol ausgetauscht werden. Durch einen derartigen Austausch ergibt sich jedoch ein Absinken des Flammpunktes.In the washing liquid according to the invention, xylene can be whole or partly by toluene and butanol, wholly or partly by ethanol and / or methanol be replaced. However, such an exchange results in a drop the flash point.

Claims (4)

Patentansprüche 1. Waschflüssigkeit zur Reinigung von Oberflächen gedruckter Schaltungen, die mit einer nach dem Löten zurückgebliebenen Flußmittelschicht auf der Basis von Harzen, Kolophonium oder Amminoalkoholen überzogen sind, dadurch gekennzeichnet, daß die Waschflüssigkeit aus Dimethylbenzol, Glykolmonobutyläther und Isobutanol besteht. Claims 1. Washing liquid for cleaning surfaces printed circuits with a layer of flux left after soldering based on resins, rosin or amino alcohols are coated thereby characterized in that the washing liquid consists of dimethylbenzene, glycol monobutyl ether and isobutanol. 2. Waschflüssigkeit nach Anspruch 1, da durch gekennzeichnet, daß das Gemisch annähernd folgende Zusammensetzung aufweist: 30 Vol ,~ Dimethylbenzol 32,5 Vol % Glykolmonobutyläther 37,5 Vol % Isobutanol 2. Washing liquid according to claim 1, characterized in that the mixture has approximately the following composition: 30 vol , ~ Dimethylbenzene 32.5 vol% glycol monobutyl ether 37.5 vol% isobutanol 3. Waschflüssigkeit nach Anspruch 1 oder einem der folgenden, dadurch gekennzeichnet, daß Dimethylbenzol ganz oder teilweise gegen Toluol ausgetauscht wird.3. Washing liquid according to claim 1 or one of the following, characterized in that dimethylbenzene is wholly or partially exchanged for toluene. 4. Waschflüssigkeit nach Anspruch t oder einem der folgenden, dadurch gekennzeichnet, daß Isobutanol ganz oder teilweise gegen Äthanol und/oder Methanol ausgetauscht wird.4. Washing liquid according to claim t or one of the following, characterized characterized in that isobutanol wholly or partially against ethanol and / or methanol is exchanged.
DE19782847691 1978-11-03 1978-11-03 Washing liquid for cleaning the surfaces of printed circuits Expired DE2847691C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19782847691 DE2847691C2 (en) 1978-11-03 1978-11-03 Washing liquid for cleaning the surfaces of printed circuits

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Application Number Priority Date Filing Date Title
DE19782847691 DE2847691C2 (en) 1978-11-03 1978-11-03 Washing liquid for cleaning the surfaces of printed circuits

Publications (2)

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DE2847691A1 true DE2847691A1 (en) 1980-05-14
DE2847691C2 DE2847691C2 (en) 1986-05-22

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0426943A2 (en) * 1989-11-08 1991-05-15 Arakawa Chemical Industries, Ltd. Agent and method for removing rosinbase solder flux
DE4130494A1 (en) * 1991-09-13 1993-04-01 Ant Nachrichtentech Liq. mixt. for cleaning, esp. removing traces of solder - contains alcohol, glycol ether and opt. deionised water
DE4236580A1 (en) * 1991-09-13 1994-05-26 Ant Nachrichtentech Solvents for cleaning electronic components e.g. PCB - comprise n-butanol, propylene glycol 1-methyl ether and opt. water
US5330582A (en) * 1989-11-08 1994-07-19 Arakawa Chemical Industries, Ltd. Method for cleaning rosin-base solder flux
EP0811705A1 (en) * 1993-06-01 1997-12-10 Fujitsu Limited Defluxing agent and cleaning apparatus
EP0853116A1 (en) * 1997-01-09 1998-07-15 Kao Corporation Detergent composition for removing resinous stains

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0426943A2 (en) * 1989-11-08 1991-05-15 Arakawa Chemical Industries, Ltd. Agent and method for removing rosinbase solder flux
EP0426943A3 (en) * 1989-11-08 1991-09-04 Arakawa Chemical Industries, Ltd. Agent and method for removing rosinbase solder flux
US5330582A (en) * 1989-11-08 1994-07-19 Arakawa Chemical Industries, Ltd. Method for cleaning rosin-base solder flux
DE4130494A1 (en) * 1991-09-13 1993-04-01 Ant Nachrichtentech Liq. mixt. for cleaning, esp. removing traces of solder - contains alcohol, glycol ether and opt. deionised water
DE4236580A1 (en) * 1991-09-13 1994-05-26 Ant Nachrichtentech Solvents for cleaning electronic components e.g. PCB - comprise n-butanol, propylene glycol 1-methyl ether and opt. water
EP0811705A1 (en) * 1993-06-01 1997-12-10 Fujitsu Limited Defluxing agent and cleaning apparatus
US6050479A (en) * 1993-06-01 2000-04-18 Fujitsu, Ltd. Defluxing agent cleaning method and cleaning apparatus
US6140286A (en) * 1993-06-01 2000-10-31 Fujitsu Limited Defluxing agent cleaning method and cleaning apparatus
EP0853116A1 (en) * 1997-01-09 1998-07-15 Kao Corporation Detergent composition for removing resinous stains
US5954891A (en) * 1997-01-09 1999-09-21 Kao Corporation Detergent composition for removing resinous stains

Also Published As

Publication number Publication date
DE2847691C2 (en) 1986-05-22

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