DE20115192U1 - Hilfsträgerplatine für den Kühlkörper der Hauptplatine - Google Patents
Hilfsträgerplatine für den Kühlkörper der HauptplatineInfo
- Publication number
- DE20115192U1 DE20115192U1 DE20115192U DE20115192U DE20115192U1 DE 20115192 U1 DE20115192 U1 DE 20115192U1 DE 20115192 U DE20115192 U DE 20115192U DE 20115192 U DE20115192 U DE 20115192U DE 20115192 U1 DE20115192 U1 DE 20115192U1
- Authority
- DE
- Germany
- Prior art keywords
- board
- heat sink
- main board
- hollow frame
- wings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005484 gravity Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Claims (1)
- Eine Hilfsträgerplatine, die als Durchlaß des Kühlkörpers sowie als einen Träger der Hauptplatine in industriell eingesetzten Rechnern funktioniert, bestehend aus:
- - einem Einsteckteil (41), die der Form einer Steckfassung auf der Hauptplatine (30) entspricht;
- - einem hohlen Rahmen (43) an einer vorgesehenen Stelle auf einer Seite gegenüber der Hauptplatine (30);
- - zwei Flügeln (42) des hohlen Rahmens (43), die in einem Abstand voneinander angeordnet sind, wobei der hohle Rahmen (43) vertikal zur Hauptplatine (30) angeordnet ist; und
- - aus einem Ventilator (33) des Kühlkörpers (32) zwischen den Flügeln (42), der sich an einem Ende des hohlen Rahmens (43) befindet;
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20115192U DE20115192U1 (de) | 2001-09-14 | 2001-09-14 | Hilfsträgerplatine für den Kühlkörper der Hauptplatine |
US09/951,421 US6411511B1 (en) | 2001-09-14 | 2001-09-14 | Motherboard heat sink passage and support board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20115192U DE20115192U1 (de) | 2001-09-14 | 2001-09-14 | Hilfsträgerplatine für den Kühlkörper der Hauptplatine |
US09/951,421 US6411511B1 (en) | 2001-09-14 | 2001-09-14 | Motherboard heat sink passage and support board |
Publications (1)
Publication Number | Publication Date |
---|---|
DE20115192U1 true DE20115192U1 (de) | 2001-11-29 |
Family
ID=26057197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE20115192U Expired - Lifetime DE20115192U1 (de) | 2001-09-14 | 2001-09-14 | Hilfsträgerplatine für den Kühlkörper der Hauptplatine |
Country Status (2)
Country | Link |
---|---|
US (1) | US6411511B1 (de) |
DE (1) | DE20115192U1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1322057A1 (de) * | 2001-12-21 | 2003-06-25 | Redfern Broadband Networks Inc. | WDM add/drop Multiplexermodul |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3565767B2 (ja) * | 2000-07-19 | 2004-09-15 | トラストガード株式会社 | カートリッジ型サーバユニットおよび該サーバユニット搭載用筐体ならびにサーバ装置 |
US6738262B2 (en) * | 2001-05-21 | 2004-05-18 | Sycamore Networks, Inc. | Port filler baffle |
US6522537B2 (en) * | 2001-07-18 | 2003-02-18 | Portwell Inc. | Snap-in computer casing structure |
US20030025966A1 (en) * | 2001-08-03 | 2003-02-06 | Ross Halgren | OSP hardened WDM network |
EP1464133A4 (de) * | 2001-12-21 | 2005-06-15 | Redfern Broadband Networks Inc | Wdm-add/drop-multiplexermodul |
US6776576B2 (en) * | 2002-03-20 | 2004-08-17 | Thomas Hokun Lee | Blower for forcing hot air out of a computer |
TW568301U (en) * | 2003-04-11 | 2003-12-21 | Hon Hai Prec Ind Co Ltd | Mounting apparatus for computer peripheral |
US6934152B1 (en) * | 2003-06-27 | 2005-08-23 | Emc Corporation | Systems and methods for connecting an electronic apparatus to a backplane |
US20050162830A1 (en) * | 2004-01-27 | 2005-07-28 | Hewlett-Packard Development Company, L.P. | Electronic system with a simplified enclosure |
TWM256970U (en) * | 2004-04-27 | 2005-02-11 | Via Tech Inc | Fan-shaped heat dissipating device |
JP4251197B2 (ja) * | 2005-11-29 | 2009-04-08 | セイコーエプソン株式会社 | ロボット制御装置及びロボットシステム |
US7286357B2 (en) * | 2005-11-29 | 2007-10-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Computer system with cooling device for CPU |
TWI296750B (en) * | 2005-12-20 | 2008-05-11 | Asustek Comp Inc | Heat-dissipating device coupled by a heat pipe |
US7480147B2 (en) * | 2006-10-13 | 2009-01-20 | Dell Products L.P. | Heat dissipation apparatus utilizing empty component slot |
US7623343B2 (en) * | 2007-04-16 | 2009-11-24 | Inventec Corporation | Physical configuration of computer system |
CN101551695B (zh) * | 2008-04-03 | 2012-07-18 | 鸿富锦精密工业(深圳)有限公司 | 扩展卡散热装置及用于其上的支架 |
US7688584B1 (en) * | 2008-10-02 | 2010-03-30 | Environmental Container Systems, Inc. | Cooling system for rack-mounted electronics equipment |
JP4706747B2 (ja) * | 2008-11-17 | 2011-06-22 | 富士ゼロックス株式会社 | 電子装置及び画像形成装置 |
US7969733B1 (en) * | 2008-12-17 | 2011-06-28 | Nvidia Corporation | Heat transfer system, method, and computer program product for use with multiple circuit board environments |
US20110032686A1 (en) * | 2009-08-04 | 2011-02-10 | Lin Te-Chang | Server chassis with common rear window for adapter and expansion card |
CN102541194B (zh) * | 2010-12-14 | 2016-05-11 | 中山市云创知识产权服务有限公司 | 扩充卡固定装置 |
CN103034305A (zh) * | 2011-09-30 | 2013-04-10 | 鸿富锦精密工业(深圳)有限公司 | 支架组件及应用该支架组件的扩展卡散热装置 |
US8848364B2 (en) * | 2012-04-05 | 2014-09-30 | Hewlett-Packard Development Company, L.P. | Daughterboard having airflow path |
US9252074B2 (en) * | 2013-01-23 | 2016-02-02 | Amtek Semiconductors Co., Ltd. | Heat dissipating device |
US9470720B2 (en) | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
US9898056B2 (en) * | 2013-06-19 | 2018-02-20 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US10013033B2 (en) | 2013-06-19 | 2018-07-03 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US9313874B2 (en) | 2013-06-19 | 2016-04-12 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
US9229496B2 (en) * | 2013-08-08 | 2016-01-05 | Dell Products, L.P. | Supplemental storage tray for increasing storage capacity within an information handling system |
US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
US9485851B2 (en) * | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
US9348377B2 (en) | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
DE102017126897A1 (de) * | 2017-11-15 | 2019-05-16 | Fujitsu Client Computing Limited | Computeranordnung mit Luftleitelement und Luftleitelement |
US20210235599A1 (en) * | 2020-01-29 | 2021-07-29 | Dell Products L.P. | Reversible air mover for modular processing unit |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5079438A (en) * | 1989-01-30 | 1992-01-07 | Heung Lap Yan | Circuit module fan assembly |
US5136465A (en) * | 1990-10-29 | 1992-08-04 | International Business Machines Corp. | Personal computer with tandem air flow dual fans and baffle directed air cooling |
US5338214A (en) * | 1992-10-27 | 1994-08-16 | Steffes Karl M | Expansion card/riser card module for desktop computers |
US5854738A (en) * | 1997-05-30 | 1998-12-29 | Intel Corporation | Apparatus for supporting a cooling assembly coupled to an integrated circuit |
US5852547A (en) * | 1997-07-14 | 1998-12-22 | Sun Microsystems, Inc. | Module shroud attachment to motherboard |
US5986883A (en) * | 1997-11-05 | 1999-11-16 | Micron Electronics, Inc. | Apparatus for cooling central processing units in personal computers |
US5936836A (en) * | 1997-12-19 | 1999-08-10 | Dell U.S.A., L.P. | Computer with an improved internal cooling system |
TW441812U (en) * | 1998-01-21 | 2001-06-16 | Hon Hai Prec Ind Co Ltd | Computer fan position apparatus |
US6259600B1 (en) * | 1999-06-17 | 2001-07-10 | Api Networks, Inc. | Apparatus and method for cooling a processor circuit board |
-
2001
- 2001-09-14 DE DE20115192U patent/DE20115192U1/de not_active Expired - Lifetime
- 2001-09-14 US US09/951,421 patent/US6411511B1/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1322057A1 (de) * | 2001-12-21 | 2003-06-25 | Redfern Broadband Networks Inc. | WDM add/drop Multiplexermodul |
Also Published As
Publication number | Publication date |
---|---|
US6411511B1 (en) | 2002-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20020110 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20050110 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20080103 |
|
R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20091208 |
|
R071 | Expiry of right | ||
R071 | Expiry of right | ||
R082 | Change of representative |
Representative=s name: KANDLBINDER, MARKUS, DIPL.-PHYS., DE |